I-PCB aluminiyam substrate inamagama amaninzi, i-aluminiyam i-aluminiyam, i-aluminium PCB, i-metal clad eprintiweyo ibhodi yesekethe (MCPCB), i-PCB ye-thermal conductive, njl. Uncedo lwe-PCB aluminiyam substrate kukuba ukuchithwa kobushushu kubhetele kakhulu kunokwakheka kwe-FR-4 eqhelekileyo, kunye ne-dielectric esetyenziswayo idla ngokuba yi-5 ukuya kwi-10 amaxesha e-thermal conductivity yeglasi ye-epoxy yesiqhelo, kwaye isalathisi sokudlulisa ubushushu sesinye kwishumi sobunzima sisebenza ngakumbi kune-PCB eqinile yendabuko. Makhe siqonde iintlobo PCB aluminiyam substrates ngezantsi.

1. I-aluminium substrate eguquguqukayo

Olunye uphuhliso lwamva nje kwizinto ze-IMS zii-dielectrics eziguquguqukayo. Ezi zixhobo zinokubonelela ngokugqwesileyo kombane, ukuguquguquka kunye ne-thermal conductivity. Xa isetyenziswe kwizinto eziguquguqukayo ze-aluminium ezifana ne-5754 okanye izinto ezinjalo, iimveliso zinokuqulunqwa ukuze zifezekise iimilo ezahlukeneyo kunye nee-angles, ezinokuphelisa izixhobo zokulungisa ezibizayo, iintambo kunye nezihlanganisi. Nangona ezi zixhobo ziguquguqukayo, zenzelwe ukugoba kwindawo kwaye zihlale kwindawo.

2. Umxube we-aluminium substrate ye-aluminium
Kwisakhiwo se-IMS "i-hybrid", "i-sub-components" yezinto ezingezona i-thermal zicutshungulwa ngokuzimeleyo, kwaye ke ii-PCB ze-Amitron Hybrid IMS ziboshwe kwi-substrate ye-aluminium kunye nezixhobo zokushisa. Isakhiwo esiqhelekileyo yi-2-layer okanye i-4-layer subassembly eyenziwe yendabuko ye-FR-4, enokuthi idibaniswe ne-aluminium substrate kunye ne-thermoelectric ukunceda ukukhupha ukushisa, ukwandisa ukuqina, kunye nokusebenza njengekhaka. Olunye uncedo lubandakanya:
1. Iindleko eziphantsi kunazo zonke izinto zokuqhuba i-thermal.
2. Ukubonelela ngentsebenzo engcono ye-thermal kuneemveliso eziqhelekileyo ze-FR-4.
3. Iisinki zokushisa ezixabisa kakhulu kunye namanyathelo okuhlanganisa ahambelanayo anokupheliswa.
4. Ingasetyenziswa kwiinkqubo zeRF ezifuna iimpawu zelahleko zeRF zomaleko womphezulu wePTFE.
5. Sebenzisa iifestile zecandelo kwi-aluminiyam ukulungiselela amacandelo angaphakathi-umngxuma, evumela izihlanganisi kunye neentambo ukuba zidlule isinxibelelanisi kwi-substrate ngelixa ukuwelda iikona ezijikelezileyo ukwenza itywina ngaphandle kwemfuneko yeegaskets ezikhethekileyo okanye ezinye iiadaptha ezibizayo.

Isithathu, i-aluminium substrate eninzi
Kwimarike yonikezelo lwamandla aphezulu, ii-PCB ze-IMS ezininzi zenziwe ngee-dielectrics ze-thermal conductive multilayer. Ezi zakhiwo zinemigangatho enye okanye ngaphezulu kweesekethe ezingcwatywe kwi-dielectric, kwaye ii-vias eziyimfama zisetyenziswa njenge-thermal vias okanye iindlela zomqondiso. Nangona uyilo lwe-single-layer lubiza kakhulu kwaye lusebenza kancinci ukuhambisa ubushushu, lubonelela ngesisombululo esilula nesisebenzayo sokupholisa kuyilo oluntsonkothileyo.
Isine, i-substrate ye-aluminiyam yomngxuma
Kwisakhiwo esinzima kakhulu, uluhlu lwe-aluminium lunokwenza "ingundoqo" yesakhiwo se-thermal multilayer. Ngaphambi kokuba i-lamination, i-aluminiyam i-electroplated kwaye izaliswe nge-dielectric kwangaphambili. Izixhobo zokushisa okanye iinxalenye ezincinci zinokuthi zifakwe i-laminated kumacala omabini e-aluminium usebenzisa izinto zokunamathela ezishisayo. Emva kokuba i-laminated, indibano egqityiweyo ifana ne-multilayer ye-aluminium substrate ngokubhobhoza. Ifakwe kwimingxuma idlula kwizikhewu kwi-aluminiyam ukugcina ukugquma kombane. Kungenjalo, undoqo wobhedu unokuvumela uqhagamshelo lombane oluthe ngqo kunye ne-insulating vias.