Umahluko kwiimpawu phakathi kweFPC kunye nePCB

Enyanisweni, i-FPC ayiyona nje ibhodi yesekethe eguquguqukayo, kodwa iyindlela ebalulekileyo yoyilo lwesakhiwo sesekethe esidibeneyo. Esi sakhiwo sinokudityaniswa nolunye uyilo lwemveliso ye-elektroniki ukwakha iintlobo ezahlukeneyo zezicelo. Ke ngoko, ukusuka kweli nqaku kuJonga, iFPC kunye nebhodi enzima zihluke kakhulu.

Kwiibhodi ezinzima, ngaphandle kokuba isiphaluka senziwe kwifom ye-three-dimensional ngokusebenzisa i-glue yobumba, ibhodi yesekethe ngokubanzi. Ke ngoko, ukusebenzisa ngokupheleleyo indawo enamacala amathathu, iFPC sisisombululo esihle. Ngokubhekiselele kwiibhodi ezinzima, isisombululo sangoku sokwandisa indawo eqhelekileyo kukusebenzisa i-slots ukongeza amakhadi e-interface, kodwa i-FPC inokwenziwa ngesakhiwo esifanayo nje ngokuba i-adapter design isetyenzisiweyo, kunye noyilo lwesikhokelo nalo luguquguqukayo. Ukusebenzisa iqhekeza elinye loqhagamshelwano lwe-FPC, iziqwenga ezibini zeebhodi ezinzima zinokudityaniswa ukwenza iseti yeenkqubo zesekethe ezihambelanayo, kwaye inokuthi iguqulwe ibe yiyiphi na i-engile ukuze iqhelane noyilo lwemilo eyahlukeneyo yemveliso.

 

I-FPC ngokuqinisekileyo inokusebenzisa uqhagamshelo lwetheminali kuqhagamshelo lomgca, kodwa kuyenzeka ukuba usebenzise iibhodi ezithambileyo neziqinileyo ukunqanda ezi ndlela zoqhagamshelwano. I-FPC enye inokusebenzisa uyilo ukumisela iibhodi ezininzi ezinzima kwaye ziqhagamshele. Le ndlela inciphisa ukudibanisa kunye nokuphazamiseka kwe-terminal, enokuphucula umgangatho wesignali kunye nokuthembeka kwemveliso. Umzobo ubonisa ibhodi ethambileyo nenzima eneebhodi ezininzi ezinzima kunye noyilo lweFPC.

I-FPC inokwenza iibhodi zesekethe ezibhityileyo ngenxa yeempawu zayo eziphathekayo, kwaye ukuncipha yenye yezona mfuno zibalulekileyo kushishino lwangoku lombane. Ngenxa yokuba i-FPC yenziwe ngezinto zefilimu ezibhityileyo zokuvelisa isekethe, ikwayinto ebalulekileyo kuyilo olubhityileyo kwishishini le-elektroniki elizayo. Ekubeni ukuhanjiswa kobushushu bezinto zeplastiki kubi kakhulu, i-substrate yeplastiki iyancipha ngakumbi, ilungele ngakumbi ukulahleka kobushushu. Ngokuqhelekileyo, umahluko phakathi kobukhulu be-FPC kunye nebhodi eqinile ingaphezulu kwamashumi amaxesha, ngoko ke izinga lokutshatyalaliswa kobushushu liphindwe kashumi. I-FPC ineempawu ezinjalo, ngoko ke iimveliso ezininzi zendibano ye-FPC ezineendawo eziphezulu zokukhupha amanzi ziya kuthi zincanyathiselwe kwiipleyiti zentsimbi ukuphucula ukutshatyalaliswa kobushushu.

Kwi-FPC, enye yezinto ezibalulekileyo kukuba xa i-solder joints isondele kwaye uxinzelelo lwe-thermal lukhulu, umonakalo wexinzelelo phakathi kwamalungu ungancitshiswa ngenxa yeempawu ze-elastic ze-FPC. Olu hlobo lwenzuzo lunokufunxa uxinzelelo lwe-thermal ngakumbi kwindawo ethile yokunyuka komphezulu, olu hlobo lwengxaki luya kuncitshiswa kakhulu.