Ngenxa yeentlobo ezahlukeneyo ze-substrates, inkqubo yokuvelisa i-PCB eqinile-flex yahlukile. Iinkqubo eziphambili ezimisela ukusebenza kwayo yitekhnoloji yocingo olucekethekileyo kunye nobuchwepheshe be-microporous. Ngeemfuno zeminiaturization, imisebenzi emininzi kunye nendibano esembindini yeemveliso ze-elektroniki, itekhnoloji yokuvelisa iPCB eqinile-eguquguqukayo kunye nePCB eguquguqukayo egxininisiweyo yetekhnoloji yePCB enoxinaniso oluphezulu itsale ingqwalasela enkulu.

Inkqubo yokwenziwa kwe-PCB eguquguqukayo:

I-Rigid-Flex PCB, okanye i-RFC, ibhodi yesekethe eprintiweyo edibanisa i-PCB eqinile kunye ne-PCB eguquguqukayo, enokwenza i-interlayer conduction nge-PTH.

Inkqubo elula yokuvelisa ye-PCB eqinile-flex:

Emva kophuhliso oluqhubekayo kunye nophuculo, iitekhnoloji ezintsha ezahlukeneyo eziguquguqukayo zePCB ziyaqhubeka nokuvela. Phakathi kwabo, eyona nkqubo yokuvelisa ixhaphakileyo neqolileyo kukusebenzisa engqongqo FR-4 njenge substrate engqongqo engqongqo-flex ibhodi yangaphandle PCB, kunye inki yokutshiza solder ukukhusela ipateni yesekethe amacandelo PCB engqongqo. Amacandelo e-PCB aguquguqukayo asebenzisa ifilimu ye-PI njengebhodi engundoqo eguquguqukayo kunye nokugubungela i-polyimide okanye ifilimu ye-acrylic. Izinto zokuncamathelisa zisebenzisa i-prepregs ehambayo ephantsi, kwaye ekugqibeleni ezi substrates zilaminethiwe kunye ukwenza ii-PCB eziguquguqukayo eziqinileyo.

Umkhwa wophuhliso lwetekhnoloji yokwenziwa kwePCB eqinileyo:

Kwixesha elizayo, ii-PCB eziguquguqukayo eziqinileyo ziya kuphuhlisa kwicala le-ultra-thin, high-density, kunye ne-multi-functional, ngaloo ndlela iqhuba uphuhliso lwemizi-mveliso yezinto ezihambelanayo, izixhobo kunye neenkqubo kumashishini aphezulu. Ngophuhliso lwetekhnoloji yemathiriyeli kunye nobugcisa bokuvelisa obunxulumeneyo, ii-PCB eziguquguqukayo kunye nee-PCB eziguquguqukayo eziqinileyo ziphuhla zisiya kuqhagamshelo, ikakhulu kule miba ilandelayo.

I-1) Uphando kunye nokuphuhlisa iteknoloji ephezulu yokuchaneka kokuchaneka kunye nezinto eziphantsi zokulahleka kwe-dielectric.

2) Ukuphumelela kwitekhnoloji ye-polymer ukuze kuhlangatyezwane neemfuno zoluhlu lobushushu obuphezulu.

3) Izixhobo ezinkulu kakhulu kunye nezinto eziguquguqukayo zinokuvelisa iiPCB ezinkulu neziguquguqukayo.

4) Ukwandisa ubuninzi bofakelo kunye nokwandisa amacandelo afakwe.

5) Isekethe yeHybrid kunye neteknoloji yePCB ebonakalayo.

6) Idityaniswe ne-elektroniki eprintiweyo.

Ukushwankathela, itekhnoloji yokuvelisa iibhodi zesekethe eziprintiweyo eziqinileyo (PCBs) ziyaqhubeka nokuqhubela phambili, kodwa ezinye iingxaki zobugcisa ziye zadibana nazo. Nangona kunjalo, ngophuhliso oluqhubekayo lobuchwepheshe bemveliso ye-elektroniki, ukuveliswa kwePCB eguquguqukayo