I-PCB ye-multilayerikakhulu yenziwe ngefoyile yobhedu, prepreg, kunye nebhodi engundoqo. Kukho iintlobo ezimbini zezakhiwo zokulalisa, ezizezi, ulwakhiwo lwe-lamination yefoyile yobhedu kunye nebhodi engundoqo kunye nesakhiwo se-lamination sebhodi engundoqo kunye nebhodi engundoqo. I-foil yobhedu kunye nebhodi engundoqo ye-lamination structure ikhethwayo, kwaye i-core board ye-lamination structure ingasetyenziselwa iiplate ezikhethekileyo (ezifana ne-Rogess44350, njl.) Iibhodi ze-multi-layer kunye neebhodi ze-hybrid structure.

1.Iimfuno zokuyila ukucinezela isakhiwo Ukuze kuncitshiswe i-warpage ye-PCB, i-PCB yokwakhiwa kwe-lamination kufuneka ihlangabezane neemfuno ze-symmetry, oko kukuthi, ubukhulu be-foil yobhedu, uhlobo kunye nobukhulu be-dielectric layer, uhlobo lokusabalalisa ipateni. (umaleko wesekethe, umaleko wenqwelomoya), i-lamination, njl.

2.Ubunzima bobhedu lweConductor

(1) Ubukhulu bobhedu olubonisiweyo kumzobo bubunzima bobhedu olugqityiweyo, oko kukuthi, ubukhulu bomaleko ongaphandle wobhedu bubunzima befoyile yobhedu esezantsi kunye nobungqingqwa bomaleko we-electroplating, kunye nobungqingqwa. Umaleko wangaphakathi wobhedu bubunzima bomaleko ongaphakathi wefoyile yobhedu esezantsi. Kumzobo, ubungqingqwa bobhedu bangaphandle buphawulwe “njengobunzima befoyile yobhedu + yokucwenga, kwaye ubungqingqwa bangaphakathi bobhedu buphawulwe “njengobunzima befoyile yobhedu”.

(2) Izilumkiso zokusetyenziswa kwe-2OZ kunye nobhedu olusezantsi ongqindilili olungaphezulu Kufuneka lusetyenziswe ngokulinganayo kulo lonke isitaki.

Kuphephe ukuwabeka kwi-L2 kunye ne-Ln-2 kangangoko kunokwenzeka, oko kukuthi, iileya zesibini zangaphandle ze-Top and Bottom surfaces, ukuphepha imiphezulu ye-PCB engalinganiyo neshwabeneyo.

3. Iimfuno zesakhiwo esicinezelayo

Inkqubo yokuthambisa yinkqubo ephambili kwimveliso yePCB. Okukhona inani laminations, kokukhona ukuchaneka ulungelelwaniso imingxunya kunye disk, kwaye kakhulu deformation PCB, ingakumbi xa asymmetrically laminated. I-Lamination ineemfuno zokupakisha, ezifana nobukhulu bobhedu kunye nobukhulu be-dielectric kufuneka buhambelane.