I-Multilayer PCBiqokelelwe ikakhulu ye-foreper foil, i-Prerdrere, neBhodi ePhakamileyo. Zimbini iintlobo zezakhiwo zomntu, ezizezi, isakhiwo se-lamoper foil kunye nebhodi ephambili kunye neBhodi yeBhodi yeBhodi kunye neBhodi ePhakamileyo. I-foil yobhedu kunye ne-Core yeBhola yeBhodi iyathandwa, kwaye iBhodi yeSoftware yeBhodi yeBhodi eNgcono (ezinjengeerages44350, njl. Njl.

1.Dedegers ekugxininiselweni kwesakhiwo se-PCB, isakhiwo se-PCB simele sihlangane neemfuno zolungelelwaniso, ukuba, udidi lokusasaza (i-Nt. njl.

I-2.Conuctor yobhedu

. Kumzobo, ubukhulu bangaphandle bobhedu buphawulwe njenge- "Popper Fill Fiell + i-Protick + ubukhulu be-Inter Teverser buphawulwe"

(2) Izilumkiso zokusetyenziswa kwe-2oz kwaye ngaphezulu kobhedu oluncinci kufuneka lusetyenziswe ngendlela efanayo.

Kulumkele uzibeke kwi-L2 kunye ne-LN-2 kwiindawo ezinokwenzeka, oko kukuthi, iindawo zangaphandle zenqanaba lezesekondari lendawo ephezulu nezantsi, ukunqanda umphezulu wePCB.

3. Iimfuno zokucinezelwa kwesakhiwo

Inkqubo yokulelisa yinkqubo ephambili kwimveliso ye-PCB. Ngaphezulu inani lezinto ezizezalisekileyo, ezibaluleke kakhulu ukuchaneka kolungelelwaniso lwemingxunya kunye nediski, kunye nokwenzakala ngakumbi kwe-PCB, ngakumbi xa kuncitshisiwe. Ukulelisa kudinga iimfuno zokubhabha, njengokuqina kobhedu kunye nobubanzi beDiecric kufuneka bahambelane.