Kwimveliso kunye nokusebenza kwePCBA yeemoto, ezinye iibhodi zeesekethe kufuneka zifakwe ngobhedu.Ukugqoka ubhedu kunokunciphisa ngokufanelekileyo impembelelo ye-SMT patch processing products ekuphuculeni amandla okuchasana nokuphazamiseka kunye nokunciphisa indawo ye-loop.Isiphumo sayo esihle sinokusetyenziswa ngokupheleleyo kwi-SMT patch processing.Nangona kunjalo, kukho izinto ezininzi zokuthobela ingqalelo ngexesha lokugalelwa kobhedu.Makhe ndikwazise iinkcukacha zenkqubo yokugalela ubhedu lwePCBA.
一.Inkqubo yokugalela ubhedu
1. Inxalenye yokulungiswa kwangaphambili: Ngaphambi kokuthululwa kobhedu olusesikweni, ibhodi ye-PCB kufuneka iqhutywe ngaphambili, kubandakanywa nokucoca, ukususwa komhlwa, ukucocwa kunye namanye amanyathelo okuqinisekisa ukucoceka kunye nokugudiswa kwendawo yebhodi kunye nokubeka isiseko esihle sokugalela ubhedu olusemthethweni.
2. I-electroless copper plating: Ukugquma umaleko we-electroless copper plating liquid kumphezulu webhodi yesekethe ukudibanisa ngokwekhemikhali kunye nefoyile yobhedu ukwenza ifilimu yobhedu yenye yeendlela eziqhelekileyo zokucwenga ubhedu.Inzuzo kukuba ubukhulu kunye nokufana kwefilimu yethusi kunokulawulwa kakuhle.
3. I-Mechanical copper plating: Umphezulu webhodi yesekethe ugutyungelwe ngumaleko wefoyile yobhedu ngokucutshungulwa ngoomatshini.Ikwayenye yeendlela zokucwenga ubhedu, kodwa ixabiso lemveliso liphezulu kunemichiza yobhedu, ngoko ke unokukhetha ukuyisebenzisa ngokwakho.
4. Ukugquma ubhedu kunye ne-lamination: Linyathelo lokugqibela layo yonke inkqubo yokugquma ubhedu.Emva kokugqitywa kobhedu, i-foil yobhedu kufuneka icinezelwe phezu kwendawo yebhodi yesekethe ukuze kuqinisekiswe ukuhlanganiswa okupheleleyo, ngaloo ndlela kuqinisekiswe ukuqhuba kunye nokuthembeka kwemveliso.
二.Indima yokugqoka ubhedu
1. Ukunciphisa i-impedance yocingo lomhlaba kunye nokuphucula amandla okuchasana nokuphazamiseka;
2. Ukunciphisa ukuhla kwamandla ombane kunye nokuphucula ukusebenza kakuhle kwamandla;
3. Xhuma kucingo oluphantsi ukuze unciphise indawo ye-loop;
三.Izilumkiso zokugalelwa kobhedu
1. Musa ukuthululela ubhedu kwindawo evulekileyo ye-wiring kwinqanaba eliphakathi kwebhodi le-multilayer.
2. Ukudibanisa indawo enye kwimihlaba eyahlukeneyo, indlela yokudibanisa nge-resistors ye-0 ohm okanye i-magnetic beads okanye i-inductors.
3. Xa uqala ukuyila i-wiring, ucingo lomhlaba kufuneka luhanjiswe kakuhle.Awunakuthembela ekongezeni i-vias emva kokugalela ubhedu ukuphelisa izikhonkwane zomhlaba ezingadityaniswanga.
4. Galela ubhedu kufuphi ne-crystal oscillator.I-crystal oscillator kwisekethe ngumthombo we-high-frequency emission source.Indlela yokuthulula ubhedu malunga ne-crystal oscillator, kwaye emva koko igobolondo le-crystal oscillator ngokwahlukileyo.
5. Qinisekisa ubukhulu kunye nokufana komgangatho we-copper clad.Ngokuqhelekileyo, ubukhulu bomgca we-copper clad buphakathi kwe-1-2oz.Umaleko wobhedu otyebe kakhulu okanye obhityileyo kakhulu uya kuchaphazela ukusebenza kwe-conductive kunye nomgangatho wokuhanjiswa komqondiso wePCB.Ukuba umaleko wobhedu awulingani, uya kubangela ukuphazamiseka kunye nokulahleka kweempawu zesekethe kwibhodi yesekethe, echaphazela ukusebenza kunye nokuthembeka kwePCB.