Kungakhathaliseki ukuba luhlobo luni lwebhodi yesekethe eprintiweyo efuna ukwakhiwa okanye uhlobo lwesixhobo esisetyenziswayo, iPCB kufuneka isebenze ngokufanelekileyo. Yisitshixo ekusebenzeni kweemveliso ezininzi, kwaye ukungaphumeleli kunokubangela iziphumo ezibi.

Ukujonga i-PCB ngexesha loyilo, ukuveliswa, kunye nenkqubo yokuhlanganisa kubalulekile ukuqinisekisa ukuba imveliso ihlangabezana nemigangatho yomgangatho kwaye yenza njengoko kulindelekile. Namhlanje, iiPCB zintsonkothile kakhulu. Nangona obu bunzima bubonelela ngegumbi lezinto ezininzi ezintsha, kuzisa umngcipheko omkhulu wokungaphumeleli. Ngophuhliso lwe-PCB, itekhnoloji yokuhlola kunye netekhnoloji esetyenziselwa ukuqinisekisa ukuba umgangatho wayo uya uhambela phambili ngakumbi.

Khetha itekhnoloji yobhaqo echanekileyo ngohlobo lwePCB, amanyathelo akhoyo kwinkqubo yokuvelisa kunye neempazamo eziza kuvavanywa. Ukuphuhlisa isicwangciso esifanelekileyo sokuhlola kunye nokuvavanya kubalulekile ukuqinisekisa iimveliso ezikumgangatho ophezulu.

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Kutheni kufuneka sijonge iPCB?
Ukuhlolwa linyathelo eliphambili kuzo zonke iinkqubo zemveliso yePCB. Iyakwazi ukubona iziphene zePCB ukuze izilungise kwaye iphucule ukusebenza ngokubanzi.

Ukuhlolwa kwe-PCB kunokuveza naziphi na iziphene ezinokuthi zenzeke ngexesha lokwenziwa okanye inkqubo yokuhlanganisa. Isenokunceda nokutyhila naziphi na iimpazamo kuyilo ezinokuba zikhona. Ukujonga i-PCB emva kwenqanaba ngalinye lenkqubo kunokufumana iziphene ngaphambi kokungena kwinqanaba elilandelayo, ngaloo ndlela ukuphepha ukuchitha ixesha elininzi kunye nemali yokuthenga iimveliso ezineziphene. Inokunceda ekufumaneni iziphene zexesha elinye ezichaphazela iPCB enye okanye ngaphezulu. Le nkqubo inceda ukuqinisekisa ukuhambelana komgangatho phakathi kwebhodi yesiphaluka kunye nemveliso yokugqibela.

Ngaphandle kweenkqubo zokuhlola ezifanelekileyo ze-PCB, iibhodi zesekethe ezineziphene zinokunikwa abathengi. Ukuba umthengi ufumana imveliso enesiphene, umenzi unokufumana ilahleko ngenxa yentlawulo yewaranti okanye imbuyekezo. Abathengi nabo baya kulahlekelwa yintembelo kwinkampani, ngaloo ndlela besonakalisa isidima senkampani. Ukuba abathengi bahambisa ishishini labo kwezinye iindawo, le meko inokukhokelela kumathuba alahlekileyo.

Kwimeko embi kakhulu, ukuba iPCB eneziphene isetyenziswa kwiimveliso ezifana nezixhobo zonyango okanye iinxalenye zemoto, inokubangela ukwenzakala okanye ukufa. Iingxaki ezinjalo zinokukhokelela ekuphulukaneni nodumo olukhulu kunye nokumangalelana kwexabiso eliphezulu.

Ukuhlolwa kwe-PCB kunokunceda ukuphucula yonke inkqubo yemveliso ye-PCB. Ukuba isiphene sifumaneka rhoqo, amanyathelo anokuthathwa kwinkqubo yokulungisa isiphene.

Indlela eprintiweyo yokuhlola indibano yesiphaluka
Yintoni uhlolo lwePCB? Ukuqinisekisa ukuba iPCB inokusebenza ngokulindelekileyo, umenzi kufuneka aqinisekise ukuba onke amalungu adityaniswe kakuhle. Oku kufezwa ngothotho lweendlela, ukusuka kuhlolo olulula lwezandla ukuya kuvavanyo oluzenzekelayo kusetyenziswa izixhobo zokuhlola eziphambili zePCB.

Ukuhlolwa okubonakalayo ngesandla sisiqalo esihle. KwiiPCB ezilula ngokwentelekiso, unokuzifuna kuphela.
Ukuhlola okubonakalayo:
Olona hlobo lulula lokuhlola i-PCB luhlolo olubonakalayo olwenziwa ngesandla (MVI). Ukwenza iimvavanyo ezinjalo, abasebenzi banokujonga ibhodi ngeso lenyama okanye bakhulise. Baya kuthelekisa ibhodi kunye noxwebhu loyilo ukuze baqinisekise ukuba zonke iinkcukacha ziyafezekiswa. Baza kujonga kwakhona amaxabiso amiselweyo aqhelekileyo. Uhlobo lwesiphene abalujongayo luxhomekeke kuhlobo lwebhodi yesekethe kunye namacandelo kuwo.

Kuluncedo ukwenza MVI emva phantse zonke inyathelo lenkqubo yemveliso PCB (kuquka nendibano).

Umhloli uhlola phantse yonke imiba yebhodi yesekethe kwaye ujonge iziphene ezahlukeneyo eziqhelekileyo kuzo zonke iinkalo. Uluhlu lokuhlola oluqhelekileyo lwe-PCB lunokubandakanya oku kulandelayo:
Qinisekisa ukuba ubukhulu bebhodi yesekethe buchanekile, kwaye ujonge uburhabaxa bomphezulu kunye ne-warpage.
Khangela ukuba ubungakanani becandelo budibana neenkcukacha, kwaye uhlawule ngokukodwa ubungakanani obunxulumene nesixhumi sombane.
Khangela ingqibelelo kunye nokucaca kwepateni yokuqhuba, kwaye ukhangele iibhulorho ze-solder, iisekethe ezivulekileyo, i-burrs kunye ne-voids.
Jonga umgangatho womphezulu uze emva koko ujonge izibonda, izibonda, imikrwelo, imingxunya kunye nezinye iziphene kwimikhondo eprintiweyo kunye neepads.
Qinisekisa ukuba yonke imingxunya ikwindawo echanekileyo. Qinisekisa ukuba akukho kukhutshwa okanye imingxuma engafanelekanga, ububanzi buhambelana neenkcukacha zoyilo, kwaye akukho zithuba okanye amaqhina.
Jonga ukuqina, uburhabaxa kunye nokukhanya kwe-backing plate, kwaye ujonge iziphene eziphakanyisiweyo.
Vavanya umgangatho wokwaleka. Khangela umbala we-plating flux, kwaye ingaba iyunifomu, iqinile kwaye ikwindawo echanekileyo.

Xa kuthelekiswa nezinye iintlobo zohlolo, iMVI ineengenelo ezininzi. Ngenxa yokulula kwayo, inexabiso eliphantsi. Ngaphandle kokwandiswa okunokwenzeka, akukho sixhobo sikhethekileyo sifunekayo. Ezi zitshekisho nazo zingenziwa ngokukhawuleza kakhulu, kwaye zinokongezwa ngokulula ekupheleni kwayo nayiphi na inkqubo.

Ukwenza uhlolo olunjalo, ekuphela kwento efunekayo kukufumana abasebenzi abaqeqeshiweyo. Ukuba unobuchule obufunekayo, obu buchule bunokuba luncedo. Nangona kunjalo, kubalulekile ukuba abasebenzi banokusebenzisa iinkcukacha zoyilo kwaye bazi ukuba zeziphi iziphene ekufuneka ziqatshelwe.

Ukusebenza kwale ndlela yokukhangela kulinganiselwe. Ayinakuhlola amacandelo angekhoyo kwindlela yokujonga umsebenzi. Ngokomzekelo, ii-solder ezifihliweyo azikwazi ukujongwa ngale ndlela. Abasebenzi banokuphoswa neziphene, ngakumbi iziphene ezincinci. Ukusebenzisa le ndlela yokuhlola iibhodi zesekethe ezintsonkothileyo ezinamacandelo amancinci amaninzi kunzima kakhulu.

Uhlolo oluzenzekelayo lwamehlo:
Ungasebenzisa kwakhona umatshini wokuhlola we-PCB wokuhlola okubonakalayo. Le ndlela ibizwa ngokuba yi-automated optical inspection (AOI).

Iinkqubo ze-AOI zisebenzisa imithombo yokukhanya emininzi kunye nenye okanye ngaphezulu kokumileyo okanye iikhamera ukuze zihlolwe. Umthombo wokukhanya ukhanyisa ibhodi yePCB kuzo zonke ii-engile. Ikhamera ke ithatha umfanekiso omileyo okanye ividiyo yebhodi yesekethe ize iyihlanganise ukwenza umfanekiso opheleleyo wesixhobo. Inkqubo ke ithelekisa imifanekiso yayo ethathiweyo ngolwazi malunga nokubonakala kwebhodi ukusuka kwiinkcukacha zoyilo okanye iiyunithi ezipheleleyo ezivunyiweyo.

Zombini izixhobo ze-2D kunye ne-3D AOI ziyafumaneka. Umatshini we-2D AOI usebenzisa izibane ezinemibala kunye neekhamera ezisecaleni ukusuka kwii-engile ezininzi ukuhlola amacandelo anobude obuchaphazelekayo. Isixhobo se-3D AOI sisentsha kwaye sinokulinganisa ubude becandelo ngokukhawuleza nangokuchanekileyo.

I-AOI inokufumana iziphene ezininzi ezifana ne-MVI, kubandakanywa amaqhuqhuva, imikrwelo, iisekethe ezivulekileyo, i-solder thinning, izinto ezingekhoyo, njl.

I-AOI bubuchwephesha obukhulileyo nobuchanekileyo obunokubona iimpazamo ezininzi kwii-PCB. Iluncedo kakhulu kwizigaba ezininzi zenkqubo yokuvelisa iPCB. Ikwakhawuleza ngakumbi kune-MVI kwaye isusa ukubakho kwempazamo yomntu. Njenge MVI, ayinakusetyenziswa ukuhlola amacandelo ngaphandle kwamehlo, njengonxibelelwano olufihlwe phantsi koluhlu lwegridi yebhola (BGA) kunye nezinye iindidi zokupakishwa. Oku kunokuba kungasebenzi kwiiPCB ezinogxininiso lwecandelo eliphezulu, kuba amanye amacandelo asenokufihlwa okanye angabonakali.
Umlinganiselo wovavanyo lwelaser oluzenzekelayo:
Enye indlela yokuhlola iPCB luvavanyo lwelaser oluzenzekelayo (ALT) umlinganiselo. Ungasebenzisa i-ALT ukulinganisa ubungakanani be-solder joints kunye ne-solder joint deposits kunye nokubonakaliswa kwamacandelo ahlukeneyo.

Inkqubo ye-ALT isebenzisa i-laser ukuskena kunye nokulinganisa amacandelo e-PCB. Xa ukukhanya kubonakalisa ukusuka kumacandelo ebhodi, inkqubo isebenzisa indawo yokukhanya ukumisela ubude bayo. Ikwalinganisa ukuqina komqadi obonakalisiweyo ukumisela ukubonakaliswa kwecandelo. Inkqubo inokuthelekisa ke le milinganiselo kunye neenkcukacha zoyilo, okanye kunye neebhodi zeesekethe ezivunyiweyo ukuba zichonge ngokuchanekileyo naziphi na iziphene.

Ukusebenzisa inkqubo ye-ALT ikulungele ukugqiba inani kunye nendawo ye-solder paste deposits. Inika ulwazi malunga nokulungelelaniswa, i-viscosity, ukucoceka kunye nezinye iimpawu ze-solder paste yokushicilela. Indlela ye-ALT inikezela ngolwazi olucacileyo kwaye inokulinganiswa ngokukhawuleza. Ezi ntlobo zemilinganiselo zihlala zichanekile kodwa zixhomekeke kuphazamiseko okanye ukukhuselwa.

Ukuhlolwa kweX-reyi:
Ngokunyuka kwetekhnoloji yokunyuka komphezulu, iiPCB ziye zanzima ngakumbi. Ngoku, iibhodi zesekethe zinoxinano oluphezulu, amacandelo amancinci, kwaye ziquka iipakethe ze-chip ezifana ne-BGA kunye ne-chip scale packaging (CSP), apho udibaniso lwe-solder olufihliweyo lungenakubonwa. Le misebenzi izisa imingeni kuhlolo olubonakalayo olufana ne-MVI kunye ne-AOI.

Ukoyisa le mingeni, izixhobo zokuhlola iiX-reyi zinokusetyenziswa. Izinto zifunxa ii-X-reyi ngokobunzima bayo be-athomu. Izinto ezinzima zifunxa ngakumbi kwaye izinto ezikhaphukhaphu zifunxa kancinci, ezinokuthi zikwazi ukwahlula izixhobo. I-Solder yenziwe ngezinto ezinzima ezifana ne-tin, isilivere, kunye nelothe, ngelixa ezinye izinto ezininzi kwi-PCB zenziwe ngezinto ezikhaphukhaphu ezifana ne-aluminiyam, ubhedu, ikhabhoni kunye nesilicon. Ngenxa yoko, i-solder kulula ukuyibona ngexesha lokuhlolwa kwe-X-ray, ngelixa phantse zonke ezinye izinto (kubandakanywa i-substrates, i-lead, kunye neesekethe ezidibeneyo ze-silicon) zingabonakali.

I-X-ray ayibonakali njengokukhanya, kodwa idlula kwinto ukuze yenze umfanekiso wento. Le nkqubo yenza kube nokwenzeka ukubona ngephakheji chip kunye namanye amacandelo ukukhangela uqhagamshelwano solder phantsi kwazo. Uhlolo lwe-X-reyi lunokubona ngaphakathi kwi-solder joints ukufumana amaqamza angenakubonwa nge-AOI.

Inkqubo ye-X-reyi inokubona isithende se-solder joint. Ngexesha le-AOI, ijoyinti ye-solder iya kugqunywa ngokukhokela. Ukongezelela, xa usebenzisa ukuhlolwa kwe-X-ray, akukho mthunzi ongena. Ngoko ke, ukuhlolwa kwe-X-ray kusebenza kakuhle kwiibhodi zeesekethe ezinamacandelo ashinyeneyo. Izixhobo zokuhlola i-X-reyi zingasetyenziselwa ukuhlolwa kwe-X-reyi ngesandla, okanye inkqubo ye-X-reyi ezenzekelayo ingasetyenziselwa ukuhlola i-X-reyi (AXI).

Ukuhlolwa kwe-X-ray lukhetho olufanelekileyo kwiibhodi zesekethe eziyinkimbinkimbi, kwaye inemisebenzi ethile engekho ezinye iindlela zokuhlola, ezifana nokukwazi ukungena kwiipakethi ze-chip. Isenokusetyenziswa kakuhle ukuhlola ii-PCB ezixineneyo, kwaye inokwenza uhlolo oluthe kratya kumalungu e-solder. Itekhnoloji isentsha, intsonkothe ​​ngakumbi, kwaye inokubiza kakhulu. Kuphela xa unenani elikhulu leebhodi zesekethe ezishinyeneyo kunye ne-BGA, i-CSP kunye nezinye iipakethe ezinjalo, kufuneka utyale kwizixhobo zokuhlola ze-X-ray.