Oku kuthetha ntoni kwishishini lePCB ephezulu?
Okokuqala, xa uyilo kunye nokwakha izitokhwe zePCB, izinto ezibonakalayo kufuneka zibekwe phambili. I-5G pcbs kufuneka ihlangane zonke iinkcazo xa ukuthwala kunye nokufumana ugqithiso lomqondiso, ukubonelela ngonxibelelwano lombane, kunye nokubonelela ngolawulo lwemisebenzi ethile. Ukongeza, imiceli mngeni yoyilo yePCB iya kufuneka ilungiswe, njengokugcina ingqibelelo yesantya esiphezulu, ulawulo lobushushu, kunye nendlela yokuphazamiseka kwe-electromagnetic (i-EMI) phakathi kwedatha kunye neebhodi.
Umqondiso oxutywe ngumqondiso wokufumana uyilo lwebhodi yesekethe
Namhlanje, uninzi lweenkqubo zijongana ne-4G kunye ne-3G PCBS. Oku kuthetha ukuba icandelo elidlulayo kwaye lifumana uluhlu lwe-frequency liyi-600 MHZ ukuya kwi-5.925 GHZ, kunye ne-bandwidy Channel i-20 mhz, okanye eyi-200 khz yeenkqubo ze-IOI. Xa uyilo lwee-PCB zeNkqubo yenethiwekhi ye-5G, ezi zinto ziya kufuna ii-millimeres ze-millime ze-28 GHZ, i-30 GHZ okanye i-GHZ i-GHZ, kuxhomekeka kwisicelo. Kwi-bandwidth tennels, iinkqubo ze-5G ziya kuqhubeka ne-100mhz apha ngezantsi i-6gz kunye ne-400mhz ngaphezulu kwe-6gz.
Ezi ngesantya esiphezulu kunye nezantya eziphakamileyo ziya kufuna ukusetyenziswa kwezixhobo ezifanelekileyo kwi-PCB ukufaka idatha kunye nokudlulisela imiqondiso esezantsi kunye nephezulu ngaphandle kokulahleka kwesibonakaliso kunye ne-EMI. Enye ingxaki kukuba izixhobo ziya kuba lula, ziphathwa ngakumbi, kwaye zincinci. Due to strict weight, size and space constraints, PCB materials must be flexible and lightweight to accommodate all microelectronic devices on the circuit board.
Kwindlela ye-PCB Copper, umkhondo omncinci kunye nolawulo olubekiweyo kufuneka lulandelwe. Inkqubo yokuthabatha i-etching yemveli esetyenziselwa i-3G kunye ne-4G ye-CHDS ePhezulu ye-SPRS inokuthi itshintshelwe kwinkqubo eguqulweyo ye-swinsied. Ezi nkqubo ziphuculweyo ze-soricaries ziya kubonelela ngodonga olufanelekileyo kunye neendonga ezinzima.
Isiseko sezinto ezibonakalayo siphinde sihlengahlengiswa. Iinkampani zeBhodi zeSekethi eziprintiweyo zifunda ngokufunda kunye ne-dielector rhoqo njenge-3, kuba izinto ezisemgangathweni zePCB zesantya eziphantsi zihlala zingu-3.5 ukuya ku-5.5. I-tighter glasi fid ye-fid, ilahleko esezantsi yelahleko yelahleko kunye neprofayile esezantsi iya kuba kukhetho lwePCB ePhili yeDijithali, ngokuthi ngokuthintela ukulahleka kwesiginali kunye nokuphucula ingqibelelo yomqondiso.
Ingxaki yokukhusela i-EMI
I-EMI, i-crostalk kunye neemeko zeparasitic zezona ngxaki ziphambili kwiibhodi zesekethe. Ukwenzela ukujongana ne-crostalk kunye ne-EMI ngenxa yemifuno ye-analog kunye nedijithali ebhodini, kuyacetyiswa ngamandla ukwahlula umkhondo. Ukusetyenziswa kweebhodi ezininzi ze-multayer kuya kubonelela kakuhle kakhulu ekuqinisekiseni ukuba indlela yokufikelela kumkhondo okhawulezayo ukuze iindlela ze-analog kunye nemiqondiso ye-analog kunye nedijithali zigcinwa kude omnye komnye, ngelixa zisahlukanisa imijikelezo ye-AC neDC neDC neDC neDC neDC neDC neDC neDC neDC neDC neDC kunye neDC zaza zahlulahlula. Ukongeza ukukhusela kunye nokucoca xa kubeka izinto kufuneka zinciphise inani le-EMI yendalo kwi-PCB.
Ukuqinisekisa ukuba akukho ziphene kunye nesekethe emifutshane okanye isekethe evulekileyo kwindawo yobhedu, inkqubo yokuhlolisisa eyakhiwe ngokuzenzekelayo (i-AIO) enemisebenzi ephezulu kunye ne-2D ye-2D iya kusetyenziselwa ukukhangela umqhubi wepeyinti kwaye ulinganise. Ezi teknoloji ziya kunceda abavelisi be-PCB bajonga umngcipheko wokuphelisa umqondiso.
Imiceli mngeni yolawulo lwe-Thermal
Isantya esiphezulu somqondiso siya kubangela okwangoku nge-PCB ukuvelisa ubushushu obungaphezulu. Izixhobo ze-PCB zeZinto zeDeoklic kunye nezixhobo eziphambili ze-subrest ziya kufuneka zisiphathise ngesantya esiphezulu esifunwa yitekhnoloji ye-5G. Ukuba izinto ezibonakalayo azonelanga, kunokubangela umkhondo wobhedu, ukutshixeka, ukunyibilika kwaye kudlule, kuba ezi ngxaki ziya kubangela ukuba i-PCB inzisiseko.
Ukwenzela ukujamelana nala maqondo obushushu aphezulu, abavelisi baya kudinga ukugxila ekukhetheni izixhobo ezijongana nemiba yokuphumelela kwi-thermal kunye nemiba ye-thermal efanelekileyo. Izixhobo ngokuhamba kwe-hermal ephezulu, ukudluliselwa kobushushu obufanelekileyo, kunye ne-diecturic engaguqukiyo rhoqo kufuneka isetyenziselwe ukwenza i-PCB elungileyo ukubonelela zonke iimpawu ze-5G ezifunekayo kwesi sicelo.