1. Umngxuma wokuqhafaza
I-pinhole ibangelwa ukubhengezwa kwegesi ye-hydrogen phezu kwendawo edibeneyo, engayi kukhutshwa ixesha elide. Isisombululo se-plating asikwazi ukumanzisa umphezulu weendawo ezicwecwe, ukwenzela ukuba i-electrolytic plating layer ayikwazi ukuhlalutywa nge-electrolytically. Njengoko ubukhulu bengubo busanda kwindawo ejikeleze indawo ye-hydrogen evolution, i-pinhole yenziwa kwindawo ye-hydrogen evolution. Ibonakala ngomngxuma ongqukuva omenyezelayo kwaye ngamanye amaxesha unomsila omncinci ophethukileyo. Xa kukho ukungabikho kwe-ejenti yokumanzisa kwisisombululo se-plating kwaye ubuninzi bangoku buphezulu, i-pinholes kulula ukwenza.
2. Ukugqobhoza
Iipockmarks zibangelwa ukuba umphezulu ubekwe etafileni ayicocekanga, kukho izinto eziqinileyo ezifakwe kwi-adsorbed, okanye izinto eziqinileyo zixhonywe kwisisombululo se-plating. Xa befikelela kumphezulu womsebenzi phantsi kwesenzo sentsimi yombane, babhengezwa kuyo, echaphazela i-electrolysis. Ezi zinto eziqinileyo zifakwe kwi-In the electroplating layer, ama-bumps amancinci (i-dumps) ayenziwa. Uphawu kukuba i-convex, ayikho into ekhanyayo, kwaye akukho milo ezinzileyo. Ngamafutshane, kubangelwa yi-workpiece engcolileyo kunye nesisombululo esingcolileyo se-plating.
3. Imigca yokuhamba komoya
I-Airflow streaks ibangelwa izongezo ezigqithisileyo okanye i-cathode ephezulu yangoku okanye i-agent eyinkimbinkimbi, eyanciphisa ukusebenza kwangoku kwe-cathode kwaye ibangele ubuninzi be-hydrogen evolution. Ukuba isisombululo se-plating sahamba ngokucothayo kwaye i-cathode ihamba kancinci, igesi ye-hydrogen iya kuchaphazela ukulungelelaniswa kweekristale ze-electrolytic ngexesha lenkqubo yokunyuka ngokubhekiselele kumphezulu we-workpiece, ukwenza imivimbo yokuphuma komoya ukusuka ezantsi ukuya phezulu.
4. Ukubekwa kwemaski (okuveziweyo ezantsi)
I-mask plating ibangelwa kukuba i-flash ethambileyo kwindawo ye-pin kumphezulu we-workpiece ayisuswanga, kwaye i-electrolytic deposition coating ayinakwenziwa apha. Izinto ezisisiseko zingabonwa emva kwe-electroplating, ngoko kuthiwa yi-ezantsi evulekileyo (kuba i-flash ethambileyo yinto eguquguqukayo okanye ecacileyo ye-resin component).
5. Ukwaleka brittleness
Emva kwe-SMD electroplating kunye nokusika kunye nokwenza, kunokubonwa ukuba kukho ukuqhekeka kwi-bend yepini. Xa kukho ukuqhekeka phakathi kwe-nickel layer kunye ne-substrate, kugwetywa ukuba i-nickel layer is brittle. Xa kukho ukuqhekeka phakathi kwe-tin layer kunye ne-nickel layer, kunqunywe ukuba i-tin layer i-brittle. Uninzi lwezizathu ezibangela ubuqhophololo zizongezo, izikhanyiso ezigqithisileyo, okanye ukungcola okuninzi kwe-inorganic kunye ne-organic kwisisombululo seplating.
