I-PCB yocingo yobhedu iyawa (ekwabizwa ngokuba kukulahla ubhedu). Iifektri zePCB zonke zithi yingxaki yelaminate kwaye ifuna ukuba iifektri zabo zemveliso zithwale ilahleko embi.
1. I-foil yobhedu i-over-etched. Ifoyile yobhedu ye-electrolytic esetyenziswa emarikeni idla ngokuba yigalvanized enecala elinye (eyaziwa ngokuba yi-ashing foil) kunye necala elinye-icwecwe lobhedu (eyaziwa ngokuba yifoyile ebomvu). Ubhedu oluqhelekileyo oluphoswayo luba yikopolo eyenziwe ngesinyithi engaphezulu kwe-70um yeFoil, ifoyile ebomvu kunye nefoyile yothuthu engaphantsi kwe-18um ayinakwaliwa yibhetshi yobhedu. Xa uyilo lwesekethe yomthengi lungcono kunomgca we-etching, ukuba iinkcukacha zefoyile yobhedu zitshintshiwe kodwa iiparitha ze-etching zihlala zingatshintshi, ixesha lokuhlala kwi-foil yobhedu kwisisombululo se-etching lide kakhulu. Ngenxa yokuba i-zinc ekuqaleni iyintsimbi esebenzayo, xa ucingo lobhedu kwi-PCB luntywiliselwa kwisisombululo se-etching ixesha elide, ngokuqinisekileyo luya kukhokelela kwi-corrosion engaphezulu yecala lesekethe, ebangela ukuba isekethe enqabileyo exhasayo i-zinc layer ukuba isabele ngokupheleleyo kwaye yahlulwe kwi-substrate. Oko kukuthi, ucingo lobhedu luyawa. Enye imeko kukuba akukho ngxaki kunye ne-PCB etching parameters, kodwa emva kokuba i-etching ihlanjwe ngamanzi kunye nokomisa okungahambi kakuhle, ucingo lobhedu lukwajikelezwe sisisombululo se-residual etching kumphezulu we-PCB. Ukuba ayicutshungulwanga ixesha elide, oko kuya kubangela ukubaleka okugqithisileyo kwecala locingo lobhedu. Phosa ubhedu. Le meko ibonakaliswa ngokubanzi njengokugxila kwimigca ebhityileyo, okanye ngamaxesha emozulu efumileyo, iziphene ezifanayo ziya kuvela kuyo yonke iPCB. Hlubula ucingo lobhedu ukuze ubone ukuba umbala wendawo yokudibanisa kunye nomgangatho wesiseko (into ebizwa ngokuba yi-roughened surface) itshintshile. Umbala we-copper foil uhluke kwi-foil yobhedu eqhelekileyo. Umbala wokuqala wobhedu womgangatho ongezantsi uyabonakala, kwaye amandla okuxobula ifoyile yobhedu kumgca ongqindilili nawo aqhelekile.
2. Ungquzulwano lwenzeka kwindawo kwinkqubo yePCB, kwaye ucingo lobhedu luhlulwe kwi-substrate ngamandla omatshini angaphandle. Lo msebenzi ulambathayo kukuma kakubi okanye ukuziqhelanisa. Ucingo lobhedu oluwisiweyo luya kuba nokujika okucacileyo okanye imikrwelo/amanqaku achaphazelekileyo kwicala elinye. Ukuba uxobula ucingo lobhedu kwindawo enesiphene kwaye ujonge indawo erhabaxa yefoyile yobhedu, unokubona ukuba umbala wobuso oburhabaxa befoyile yobhedu uyinto eqhelekileyo, akuyi kubakho ukukhukuliseka kwecala, kunye namandla e-peel. yefoyile yobhedu iqhelekile.
3. Uyilo lwesekethe yePCB alunangqiqo. Ukuba ifoyile yobhedu etyebileyo isetyenziselwa ukuyila isekethe ebhityileyo kakhulu, iya kubangela ukubamba okugqithisileyo kwesekethe kunye nokwaliwa kobhedu.
2. Izizathu zenkqubo yokwenziwa kwelaminate:
Phantsi kweemeko eziqhelekileyo, nje ukuba i-laminate ishushu icinezelwe ngaphezu kwemizuzu engama-30, i-foil yobhedu kunye ne-prepreg iya kudibaniswa ngokupheleleyo, ngoko ke ukucinezela akuyi kuchaphazela amandla okudibanisa kwi-foil yobhedu kunye ne-substrate kwi-laminate. . Nangona kunjalo, kwinkqubo yokupakisha kunye nokupakisha i-laminates, ukuba i-PP ingcolisekile okanye i-foil yobhedu yonakalisiwe, amandla okudibanisa phakathi kwe-foil yobhedu kunye ne-substrate emva kokuqhawula kwakhona kuya kunganelanga, okukhokelela ekubekweni (kuphela kumacwecwe amakhulu) Amagama ) okanye iingcingo zobhedu ezingaqhelekanga ziyawa, kodwa amandla exolo efoyile yobhedu kufuphi neengcingo ezivaliweyo akayi kuba yinto engaqhelekanga.
3. Izizathu ze-laminate ekrwada:
1. Njengoko kukhankanyiwe ngasentla, iifoyile zobhedu eziqhelekileyo ze-electrolytic zizo zonke iimveliso ezifakwe igalvanized okanye i-copper-plated. Ukuba i-peak ayiqhelekanga ngexesha lokuvelisa i-foil yoboya, okanye ngexesha lokugcoba / ukubethelwa kobhedu, amasebe e-crystal e-plating abi, abangela ukuba i-foil yobhedu ngokwayo Amandla okuhlamba akwanele. Xa i-foil icinezele i-sheet material yenziwe kwi-PCB kunye ne-plug-in kumzi-mveliso we-electronics, ucingo lobhedu luya kuwa ngenxa yempembelelo yamandla angaphandle. Olu hlobo lokwaliwa kobhedu olubi aluyi kubangela umhlwa ocacileyo wecala emva kokuxobula ucingo lobhedu ukuze lubone indawo erhabaxa yefoyile yobhedu (oko kukuthi, umphezulu wokudibana kunye ne-substrate), kodwa amandla exolo efoyile yobhedu yonke aya kuba mbi. .
2. Ukulungelelaniswa okungahambi kakuhle kwe-foil yobhedu kunye ne-resin: ezinye iilaminates ezineempawu ezikhethekileyo, ezifana namaphepha e-HTg, asetyenziswa ngoku ngenxa yeenkqubo ezahlukeneyo ze-resin. I-agent ephilisayo esetyenziswayo ngokuqhelekileyo i-PN resin, kunye ne-resin ye-molecular chain structure ilula. Iqondo le-crosslinking liphantsi, kwaye kuyimfuneko ukusebenzisa i-foil yobhedu kunye nencopho ekhethekileyo ukuyifanisa. Xa uvelisa i-laminates, ukusetyenziswa kwe-foil yobhedu ayihambelani nenkqubo ye-resin, okubangela ukungonelanga amandla okukhupha i-sheet metal-clad metal foil, kunye nokuchithwa kocingo olubi xa ufaka.