Kwi-miniaturization kunye nenkqubo yokudibanisa izixhobo zombane zanamhlanje, i-PCB (ibhodi yesekethe eprintiweyo) idlala indima ebalulekileyo. Njengebhulorho phakathi kwamacandelo e-elektroniki, i-PCB iqinisekisa ukuhanjiswa okusebenzayo kwemiqondiso kunye nonikezelo oluzinzileyo lwamandla. Nangona kunjalo, ngexesha lenkqubo yokuvelisa echanekileyo kunye neyinkimbinkimbi, iziphene ezahlukahlukeneyo zenzeka ngezikhathi ezithile, ezichaphazela ukusebenza kunye nokuthembeka kweemveliso. Eli nqaku liza kuxoxa nawe ngeentlobo zesiphene eziqhelekileyo zeebhodi zesekethe ze-PCB kunye nezizathu ezisemva kwazo, zibonelela ngesikhokelo esineenkcukacha "sokukhangela impilo" yoyilo kunye nokuveliswa kweemveliso zombane.
1. Isiphaluka esifutshane kunye nesekhethi evulekileyo
Uhlalutyo lwesizathu:
Iimpazamo zokuyila: Ukungakhathali ngexesha lesigaba sokuyila, njengezithuba eziqinileyo zomzila okanye imiba yokulungelelanisa phakathi kweengqimba, kunokukhokelela kwiifutshane okanye ukuvula.
Inkqubo yokuvelisa: I-etching engaphelelanga, ukutenxa ukugrumba okanye ukuxhathisa i-solder eseleyo kwi-pad kunokubangela isiphaluka esifutshane okanye isiphaluka esivulekileyo.
2. Iziphene zemaski yesolder
Uhlalutyo lwesizathu:
Ukugqoka okungalinganiyo: Ukuba i-solder ixhathisa isasazwa ngokungafaniyo ngexesha lenkqubo yokugubungela, i-foil yobhedu inokuvezwa, ikhulise umngcipheko weesekethe ezimfutshane.
Ukunyangwa okungalunganga: Ukulawulwa okungafanelekanga kobushushu bokubhaka okanye ixesha kubangela ukuba i-solder ixhathise ingaphumeleli ukunyanga ngokupheleleyo, okuchaphazela ukukhuselwa kwayo kunye nokuqina.
3. Ushicilelo lwesikrini sesilika esineziphene
Uhlalutyo lwesizathu:
Ukuchaneka koshicilelo: Isixhobo sokuprinta isikrini asinakuchaneka ngokwaneleyo okanye ukusebenza ngokungafanelekanga, okukhokelela kufiphalo, okungekho okanye oonobumba be-offset.
Imiba yomgangatho we-Ink: Ukusetyenziswa kwe-inki engaphantsi okanye ukungahambelani kakubi phakathi kwe-inki kunye nepleyiti kuchaphazela ukucaca kunye nokunamathela kwelogo.
4. Iziphene zemingxuma
Uhlalutyo lwesizathu:
Ukutenxa kokugrumba: i-drill bit wear okanye indawo engachanekanga ibangela ukuba umngxuma ube mkhulu okanye uphambuke kwindawo eyilelweyo.
Ukususwa kweglue engaphelelanga: I-resin eseleyo emva kokugaya ayisuswanga ngokupheleleyo, eya kuchaphazela umgangatho we-welding olandelayo kunye nokusebenza kombane.
5. Ukwahlula phakathi kwe-Interlayer kunye ne-foaming
Uhlalutyo lwesizathu:
Uxinzelelo lwe-Thermal: Ukushisa okuphezulu ngexesha lenkqubo ye-soldering ye-reflow kunokubangela ukungafani kwi-coefficients yokwandisa phakathi kwezinto ezahlukeneyo, okubangela ukuhlukana phakathi kweengqimba.
Ukungena kobumanzi: IiPCB ezingabhakwanga ngaphantsi zifunxa ukufuma phambi kokuba zihlanganiselwe, zenze amaqamza omphunga ngexesha le-soldering, ebangela ukudumba kwangaphakathi.
6. Ukufakwa kwesitya esibi
Uhlalutyo lwesizathu:
I-plating engalinganiyo: Ukusabalalisa okungafaniyo koxinano lwangoku okanye ukubunjwa okungazinzanga kwesisombululo se-plating kubangela ukutyeba okungalinganiyo komgangatho we-copper plating, okuchaphazela ukuqhuba kunye ne-solderability.
Ungcoliseko: Ubuninzi bokungcola kwisisombululo se-plating buchaphazela umgangatho wokugquma kwaye kude kuvelise imingxunya okanye iindawo ezirhabaxa.
Isicwangciso sesisombululo:
Ukuphendula kwezi ziphene zingentla, amanyathelo athathiweyo abandakanya kodwa akaphelelanga koku:
Uyilo oluLungileyo: Sebenzisa isoftware yeCAD ekwinqanaba eliphambili loyilo oluchanekileyo kwaye ungene nzulu kwi-DFM (uYilo lokuVelisa) uphononongo.
Ukuphucula ulawulo lwenkqubo: Yomeleza ukubeka iliso ngexesha lenkqubo yokuvelisa, njengokusebenzisa izixhobo ezichanekileyo kunye nokulawula ngokungqongqo iiparitha zenkqubo.
Ukukhetha izinto eziphathekayo kunye nolawulo: Khetha imathiriyeli ekrwada ekumgangatho ophezulu kwaye uqinisekise iimeko ezifanelekileyo zokugcina ukuthintela imathiriyeli ekufumeni okanye ukuwohloka.
Ukuhlolwa komgangatho: Ukuphumeza inkqubo yokulawula umgangatho obanzi, kubandakanywa i-AOI (ukuhlola okuzenzekelayo), ukuhlolwa kwe-X-ray, njl., ukufumanisa kunye nokulungisa iziphene ngexesha elifanelekileyo.
Ngokuqonda ngokunzulu iziphene eziqhelekileyo zebhodi yesekethe ye-PCB kunye nezizathu zabo, abavelisi banokuthatha amanyathelo asebenzayo okuthintela ezi ngxaki, ngaloo ndlela kuphuculwe isivuno semveliso kunye nokuqinisekisa umgangatho ophezulu kunye nokuthembeka kwezixhobo zombane. Ngokuqhubela phambili okuqhubekayo kobuchwepheshe, kukho imingeni emininzi kwinkalo yokwenziwa kwe-PCB, kodwa ngolawulo lwezenzululwazi kunye nokuveliswa kwezinto ezintsha zobuchwepheshe, ezi ngxaki ziyoyiswa nganye nganye.