I-aluminiyam substrate yintsimbi esekwe kwi-copper clad laminate kunye nomsebenzi omhle wokutshatyalaliswa kobushushu. Yimathiriyeli efana nepleyiti eyenziwe ngelaphu lefayibha yeglasi ye-elektroniki okanye ezinye izinto zokuqinisa ezifakwe kwintlaka, intlaka enye, njl njl njengomaleko wokuncamathelisa ogqunywe ngefoyile yobhedu kwelinye okanye macala omabini kwaye icinezelwe eshushu, ekubhekiswa kuyo njengealuminiyam- ipleyiti esekelwe ubhedu. ISekethe yaseKangxin yazisa ukusebenza kwe-aluminium substrate kunye nonyango lomphezulu wezixhobo.
Ukusebenza kwe-Aluminiyam substrate
1.Umsebenzi ogqwesileyo wokutshatyalaliswa kobushushu
Iipleyiti ze-aluminium ezisekelwe kwi-copper-clad zinomsebenzi obalaseleyo wokutshatyalaliswa kobushushu, eyona nto ibalaseleyo yolu hlobo lweplate. I-PCB eyenziwe ngayo ayinakunqanda kuphela ngokufanelekileyo ubushushu obusebenzayo bamacandelo kunye ne-substrates elayishwe kuyo ekuphakameni, kodwa ngokukhawuleza ubushushu obuveliswa ngamacandelo e-amplifier yamandla, amacandelo ombane aphezulu, ukutshintshwa kwamandla wesekethe enkulu kunye namanye amacandelo. Ikwasasazwa ngenxa yobuninzi bayo obuncinci, ubunzima obulula (2.7g/cm3), i-anti-oxidation, kunye nexabiso eliphantsi, ngoko iye yaba yeyona nto iguquguqukayo kunye nesixa esikhulu sephepha elihlanganisiweyo kwi-laminates ye-copper esekelwe kwisinyithi. Ukumelana ne-thermal ye-thermal ye-substrate ye-aluminium egqunyiweyo yi-1.10 ℃ / W kunye ne-thermal resistance yi-2.8 ℃ / W, ephucula kakhulu i-fusing current yocingo lobhedu.
2.Ukuphucula ukusebenza kakuhle kunye nomgangatho womatshini
I-aluminium esekelwe kwi-copper-clad laminates inamandla amakhulu omatshini kunye nokuqina, okungcono kakhulu kune-resin eqinile-esekelwe kwi-copper-clad laminates kunye ne-ceramic substrates. Iyakwazi ukuqonda ukuveliswa kweebhodi eziprintiweyo kwindawo enkulu kwii-substrates zetsimbi, kwaye ifaneleke ngokukodwa ukuxhoma amacandelo anzima kwii-substrates ezinjalo. Ukongeza, i-aluminiyam substrate nayo ine-flatness elungileyo, kwaye inokudityaniswa kwaye iqhutywe kwi-substrate ngokubethelwa, ukugoba, njl njl. i-laminate ene-copper esekelwe ayikwazi.
3.Uzinzo oluphezulu lwe-dimensional
Kuba laminates ezahlukeneyo zobhedu wanxiba, kukho ingxaki yokwandiswa thermal (uzinzo dimensional), ingakumbi ukwanda thermal kwicala ubukhulu (Z-axis) yebhodi, nto leyo echaphazela umgangatho imingxuma metallized kunye neengcingo. Isizathu esona sizathu kukuba i-coefficients yokwandisa i-linear yamacwecwe ahlukeneyo, njengobhedu, kunye ne-coefficient yokwandisa i-epoxy glass fiber cloth substrate yi-3. Ukwandiswa komgca wesibini kwahluke kakhulu, okulula ukubangela Umahluko ekwandisweni kwe-thermal ye-substrate, ebangela ukuba isiphaluka sobhedu kunye nomngxuma owenziwe ngesinyithi ukuba uphuke okanye wonakaliswe. I-coefficient yokwandiswa komgca we-aluminium substrate iphakathi, incinci kakhulu kune-resin substrate ye-resin jikelele, kwaye isondele kwi-coefficient yokwandisa umgca wobhedu, ohambelana nokuqinisekisa umgangatho kunye nokuthembeka kwesekethe eprintiweyo.
Ukunyangwa komphezulu we-aluminium substrate material
1. Ukususa ioli
Umphezulu weplate esekelwe kwi-aluminium ifakwe kwi-oyile ye-oyile ngexesha lokucubungula kunye nokuthutha, kwaye kufuneka ihlambuluke ngaphambi kokusetyenziswa. Umgaqo-siseko kukusebenzisa i-petroli (i-petroli ye-aviation jikelele) njenge-solvent, enokuthi inyibilike, kwaye emva koko isebenzise i-agent yokucoca i-soluble yamanzi ukususa i-oyile ye-oyile. Hlanza umphezulu ngamanzi abalekayo ukuze ucoceke kwaye ungabi namathontsi amanzi.
2. Ukunciphisa amafutha
I-aluminiyam substrate emva kolu nyango lungentla isenayo igrisi engasuswanga kumphezulu. Ukuyisusa ngokupheleleyo, yifake nge-alkali eqinile ye-sodium hydroxide kwi-50 ° C imizuzu emi-5, uze uhlambulule ngamanzi acocekileyo.
3. I-alkaline etching. Umphezulu weplate ye-aluminium njengesiseko sezinto kufuneka sibe noburhabaxa obuthile. Ekubeni i-aluminiyam substrate kunye ne-aluminium oxide yefilimu umaleko kumphezulu zizinto zombini ze-amphoteric, umphezulu wesiseko se-aluminiyam unokwenziwa rhabaxa ngokusebenzisa i-acidic, alkaline okanye inkqubo ye-alkaline edibeneyo yesisombululo. Ukongeza, ezinye izinto kunye nezongezo kufuneka zongezwe kwisisombululo esirhabaxa ukufezekisa ezi njongo zilandelayo.
4. I-Chemical polishing (dipping). Ngenxa yokuba isiseko se-aluminiyam sinezinye isinyithi ezingcolileyo, kulula ukwenza iikhompawundi ze-inorganic ezibambelela kumphezulu we-substrate ngexesha lenkqubo yokucoca, ngoko ke iikhompawundi ze-inorganic ezenziwe phezu komhlaba kufuneka zihlalutywe. Ngokweziphumo zokuhlalutya, lungiselela isisombululo esifanelekileyo sokuntywila, kwaye ubeke i-substrate ye-aluminium egayiweyo kwisisombululo sokudipha ukuqinisekisa ixesha elithile, ukwenzela ukuba umphezulu wepleyiti ye-aluminiyam ucoceke kwaye ucwebezele.