Iibhodi zesekethe eziprintiweyo ezisetyenziswa kwii-electronics zanamhlanje kunye nezixhobo zineekhomponenti ezininzi zombane ezidityanisiweyo. Oku kuyinyani ebalulekileyo, njengoko inani lamacandelo e-elektroniki kwibhodi yesekethe eprintiweyo lisanda, ngokunjalo nobukhulu bebhodi yesekethe. Nangona kunjalo, ubungakanani bebhodi yesekethe eprintiweyo, iphakheji ye-BGA iyasetyenziswa ngoku.

Nazi iingenelo eziphambili zephakheji ye-BGA ekufuneka uyazi malunga nalo mba. Ke, jonga ulwazi olunikwe ngezantsi:

1. Iphakheji ye-BGA ethengiswayo enoxinano oluphezulu

Ii-BGA zezona zisombululo zisebenzayo kwingxaki yokudala iipakethe ezincinci zeesekethe ezisebenzayo ezidityanisiweyo eziqulethe inani elikhulu lezikhonkwane. I-Dual in-line surface mount kunye ne-pin grid array packages ziveliswa ngokunciphisa i-voids Amakhulu ezikhonkwane anesithuba phakathi kwezi zikhonkwane.

Ngelixa oku kusetyenziselwa ukuzisa amanqanaba aphezulu oxinaniso, oku kwenza inkqubo yezikhonkwane ze-soldering kube nzima ukuyilawula. Oku kungenxa yokuba umngcipheko wokudibanisa ngempazamo i-header-to-header pins uyanda njengoko isithuba phakathi kwezikhonkwane sincipha. Nangona kunjalo, i-BGA Soldering iphakheji inokusombulula le ngxaki ngcono.

2. Ukuqhuba kobushushu

Enye yeenzuzo ezimangalisayo ngakumbi kwiphakheji ye-BGA kukunciphisa ukuchasana kwe-thermal phakathi kwe-PCB kunye nephakheji. Oku kuvumela ukushisa okwenziwa ngaphakathi kwepakethe ukuba kuhambe ngcono kunye nesekethe edibeneyo. Ngaphezu koko, iya kuthintela i-chip ekutshiseni ngeyona ndlela ingcono kakhulu.

3. I-inductance ephantsi

Ngokugqwesileyo, ii-conductor zombane ezimfutshane zithetha ukuthotywa okuphantsi. I-Inductance luphawu olunokubangela ukuphazamiseka okungafunekiyo kweempawu kwiisekethe ze-elektroniki ezikhawulezayo. Ekubeni i-BGA iqulethe umgama omfutshane phakathi kwe-PCB kunye nephakheji, iqulethe i-lead inductance ephantsi, iya kubonelela ngentsebenzo engcono yezixhobo ze-pin.