Iibhodi zesekethe eziprintiweyo ezisetyenziswa kwi-Elektronikhi yanamhlanje kunye nezixhobo zinezinto ezininzi ze-elektroniki eziqulunqwe kakhulu. Le yinto eyinyani ebaluleke kakhulu, njengoko inani leenxalenye ze-elektroniki kwiBhodi yeSiphaluka eprintiweyo inyuka, kunjalo ke ubungakanani beBhodi yeSiphaluka. Nangona kunjalo, ukutyholwa kweBhodi yeBhodi yeSisekethe, iphakheji ye-BGA isetyenziswa ngoku.

Nazi ezona zibonelelo ziphambili zephakheji ye-BGA ekufuneka uyazi malunga noku. Ke, jonga ulwazi olunikezwe ngezantsi:

I-1. Iphakheji ethengisiweyo ye-BGA kunye noxinzelelo oluphezulu

I-BGAS yenye yezona zisombululo zisebenzayo kwingxaki yokudala iiphakheji ezincinci zemithi ehlanganisiweyo equkethe inani elikhulu lezikhonkwane. Intaba-mbini ye-in-intanethi yengozi kwaye iPIN ye-Grid Iiphakheji ze-grid ziveliswa ngokunciphisa i-voids yamakhulu eepins enendawo phakathi kwezi zikhonkwane.

Ngelixa oku kusetyenziswa ukuzisa amanqanaba aphezulu obuxinaniselweyo, oku kwenza inkqubo yokufaka izikhonkwane ezithengisweleyo kunzima ukuyilawula. Kungenxa yokuba umngcipheko wokuvala ngengozi ukudibanisa i-header-to-header ikhula njengoko isithuba phakathi kwezikhonkwane zihla. Nangona kunjalo, i-BGA ithengise iphakheji inokusombulula le ngxaki ngcono.

I-2. Ukuqulunqwa kobushushu

Enye yezibonelelo ezimangalisayo zephakheji ye-BGA kukuncitshiswa kwe-thermal encitshisiweyo phakathi kwePCB kunye nephakeji. Oku kuvumela ubushushu obuvelisiweyo ngaphakathi kwephakeji ukuba bahambe ngcono ngesekethe elihlanganisiweyo. Ngapha koko, iya kuthi inqande i-chip ukusuka ekuhambeni kweyona ndlela inokwenzeka.

I-3. Ukukhuphela ezantsi

Ngokuqaqambileyo, abaqhubi boMbane oMfutshane bacacisa ukuba kuphantsi. Ukukhuphela luphawu olunokubangela ukugqwetha okungafunekiyo kwimiqondiso kwiziphaluka ezihamba ngesantya esiphezulu. Kuba i-BGA inomgama omfutshane phakathi kwePCB kunye nephakheji, iqulethe i-Insoct Eppercy, iya kubonelela ngentsebenzo engcono yezixhobo.