1. Xa ubhaka iiPCB ezinobungakanani obukhulu, sebenzisa ilungiselelo lokupakisha elithe tye. Kucetyiswa ukuba inani eliphezulu le-stack akufanele lidlule amaqhekeza angama-30. I-oveni kufuneka ivulwe ngaphakathi kwemizuzu eyi-10 emva kokubhaka ukukhupha iPCB kwaye uyibeke caba ukuyipholisa. Emva kokubhaka, kufuneka icinezelwe. Izinto ezichasene ne-bend. IiPCB ezinobungakanani obukhulu azikhuthazwa ukuba zibhake ngokuthe nkqo, njengoko kulula ukugoba.
2. Xa ubhaka iiPCB ezincinci kunye neziphakathi, ungasebenzisa ukupakisha okucaba. Inani eliphezulu le-stack linconywa ukuba lingadluli amaqhekeza angama-40, okanye linokuthi lithe tye, kwaye inani alikhawulelwanga. Kufuneka uvule i-oven kwaye ukhuphe i-PCB phakathi kwemizuzu eyi-10 yokubhaka. Vumela ukuba ipholile, kwaye ucinezele i-jig anti-bending emva kokubhaka.
Izilumkiso xa PCB yokubhaka
1. Iqondo lokushisa lokubhaka akufanele lidlule i-Tg point ye-PCB, kwaye imfuno eqhelekileyo ayifanele idlule i-125 ° C. Ngeentsuku zokuqala, i-Tg point yezinye ii-PCB ezine-lead yayiphantsi, kwaye ngoku i-Tg yee-PCB ezingenalo i-lead ininzi ingaphezulu kwe-150 ° C.
2. I-PCB ebhakiweyo kufuneka isetyenziswe ngokukhawuleza. Ukuba ayisetyenziswanga, kufuneka ifakwe isifunxa ngokukhawuleza. Ukuba ibekwe kwindawo yokusebenzela ixesha elide, mayibhakwe kwakhona.
3. Khumbula ukufaka izixhobo zokumisa umoya kwi-oven, ngaphandle koko i-steam iya kuhlala kwi-oven kwaye yandise ukufuma kwayo, okungahambi kakuhle kwi-PCB dehumidification.
4. Ukusuka kwimbono yomgangatho, i-solder ye-PCB entsha isetyenzisiweyo, umgangatho uya kuba ngcono. Nokuba i-PCB ephelelwe lixesha isetyenziswe emva kokubhaka, kusekho umngcipheko othile womgangatho.
Iingcebiso PCB yokubhaka
1. Kucetyiswa ukuba usebenzise ubushushu obuyi-105±5℃ ukubhaka iPCB. Kuba iqondo lokubila lamanzi lili-100℃, ukuba nje lingaphezu kweqondo lokubila, amanzi aya kuba ngumphunga. Ngenxa yokuba i-PCB ayiqulathanga iimolekyuli ezininzi zamanzi, ayifuni iqondo lobushushu eliphezulu kakhulu ukunyusa izinga lokumka kwayo.
Ukuba iqondo lobushushu liphezulu kakhulu okanye izinga le-gasification likhawuleza kakhulu, liya kubangela ukuba umphunga wamanzi ukhule ngokukhawuleza, okunene awulungele umgangatho. Ngokukodwa kwiibhodi ezininzi kunye ne-PCB ezinemingxuma engcwatywe, i-105 ° C ingaphezulu nje kwendawo yokubilisa yamanzi, kwaye iqondo lokushisa aliyi kuba phezulu kakhulu. , Ngaba i-dehumidify kunye nokunciphisa umngcipheko we-oxidation. Ngaphezu koko, ukukwazi kwe-oven yangoku ukulawula ukushisa kuphuculwe kakhulu kunangaphambili.
2. Ukuba i-PCB ifuna ukubhaka kuxhomekeke ekubeni ukupakishwa kwayo kumanzi, oko kukuthi, ukujonga ukuba i-HIC (i-Humidity Indicator Card) kwi-vacuum package ibonise ukufuma. Ukuba ukupakishwa kulungile, i-HIC ayibonisi ukuba ukufuma ngokwenene Ungaya kwi-Intanethi ngaphandle kokubhaka.
3. Kucetyiswa ukuba usebenzise "ethe tye" kunye nezithuba zokubhaka xa i-PCB yokubhaka, kuba oku kunokufikelela umphumo ophezulu we-convection yomoya oshushu, kwaye ukufuma kulula ukubhaka ngaphandle kwe-PCB. Nangona kunjalo, kwiiPCB ezinobungakanani obukhulu, kunokuba yimfuneko ukuqwalasela ukuba uhlobo oluthe nkqo luya kubangela ukugoba kunye nokuguqulwa kwebhodi.
4. Emva kokuba i-PCB ibhakiwe, kucetyiswa ukuba uyibeke kwindawo eyomileyo kwaye uvumele ukuba ipholile ngokukhawuleza. Kungcono ukucinezela "i-anti-bending fixture" phezulu kwebhodi, kuba into eqhelekileyo ilula ukufunxa umphunga wamanzi ukusuka kwindawo yokushisa ephezulu ukuya kwinkqubo yokupholisa. Nangona kunjalo, ukupholisa ngokukhawuleza kunokubangela ukugoba kwepleyiti, nto leyo efuna ukulingana.
Ukungalungi kwi-PCB yokubhaka kunye nezinto ekufuneka ziqwalaselwe
1. Ukubhaka kuya kukhawulezisa i-oxidation ye-PCB surface coating, kwaye iqondo lokushisa liphezulu, ixesha elide lokubhaka, libi kakhulu.
2. Akukhuthazwa ukubhaka iibhodi ze-OSP eziphathwe phezulu kwiqondo lokushisa eliphezulu, kuba ifilimu ye-OSP iya kuncipha okanye ingaphumeleli ngenxa yokushisa okuphezulu. Ukuba kufuneka ubhaka, kucetyiswa ukubhaka kwiqondo lokushisa kwe-105 ± 5 ° C, kungekhona ngaphezu kweeyure ezingama-2, kwaye kucetyiswa ukuba uyisebenzise kwiiyure ezingama-24 emva kokubhaka.
3. Ukubhaka kunokuba nempembelelo ekubunjweni kwe-IMC, ngakumbi kwi-HASL (intshizi ye-tin), i-ImSn (ikhemikhali ye-tin, i-tin yokuntywila i-tin plating) iibhodi zonyango ezingaphezulu, kuba i-IMC layer (i-copper tin compound) iqala ngokukhawuleza kwi-PCB. isigaba Generation, oko kukuthi, iye yaveliswa phambi PCB soldering, kodwa ukubhaka kuya kwandisa ukutyeba lo maleko IMC eveliswe, kubangela iingxaki ukuthembeka.