YINTONI ISIFO SESODA?

Ibhola ye-solder yenye yezona ziphene zixhaphakileyo zokubuyisela kwakhona ezifunyenweyo xa usebenzisa iteknoloji ye-surface Mount kwibhodi yesekethe eprintiweyo. Ngokwenyani kwigama labo, bayibhola ye-solder eyahlulwe kumzimba ophambili owenza i-joint fusing surface mount components ebhodini.

Iibhola ze-Solder zizinto eziqhubayo, oku kuthetha ukuba ukuba zijikeleza kwibhodi yesiphaluka eprintiweyo, zinokubangela iifutshane zombane, ezichaphazela kakubi ukuthembeka kwebhodi yesiphaluka eprintiweyo.

NgokweIPC-A-610, iPCB enebhola ezingaphezulu kwe-5 zesolder (<=0.13mm) phakathi kwe-600mm² inesiphene, njengoko idiameter enkulu kuno-0.13mm ityeshela owona mgaqo uphantsi wokukhutshwa kombane. Nangona kunjalo, nangona le migaqo ichaza ukuba iibhola ze-solder zingashiywa zikhuselekile ukuba zigcinwe ngokukhuselekileyo, akukho ndlela yokwenyani yokwazi ngokuqinisekileyo ukuba zikhona.

INDLELA YOKULUNGISA IIBHOLA ZASESODA NGAPHAMBI KWENZEKE

Iibhola zeSolder zinokubangelwa zizinto ezahlukeneyo, ukwenza ukuxilongwa kwengxaki kube ngumngeni. Kwezinye iimeko, zinokuthi zibe ngokungakhethi ngokupheleleyo. Nazi ezimbalwa izizathu eziqhelekileyo solder iibhola ifomu kwinkqubo PCB ibandla.

Ukufuma-Ukufumaiye yanda ukuba ngomnye wemiba emikhulu kubavelisi bebhodi yesekethe eprintiweyo namhlanje. Ngaphandle kwesiphumo se-popcorn kunye nokuqhekeka kwe-microscopic, kunokubangela ukuba iibhola ze-solder zenze ngenxa yokuphunyuka emoyeni okanye emanzini. Qinisekisa ukuba iibhodi zeesekethe eziprintiweyo zomiswe ngokufanelekileyo ngaphambi kokusetyenziswa kwe-solder, okanye wenze utshintsho ekulawuleni ukufuma kwindawo yokuvelisa.

Intlama yeSolder- Iingxaki kwi-solder paste ngokwayo zinokufaka isandla ekubunjweni kwebhola ye-solder. Ngoko ke, akucetyiswa ukuba uphinde usebenzise i-solder paste okanye uvumele ukusetyenziswa kwe-solder paste kudlule umhla wokuphelelwa kwayo. I-solder paste kufuneka igcinwe ngokufanelekileyo kwaye iphathwe ngokwezikhokelo zomenzi. Intlama yesolder enyibilikayo emanzini inokuba negalelo ekufuma okugqithisileyo.

Uyilo lweStencil- Ibhola le-Solder lingenzeka xa i-stencil ihlanjululwe ngokungafanelekanga, okanye xa i-stencil ingabhalwanga kakuhle. Ngaloo ndlela, ukuthembela kwi-ibhodi yesekethe enamava eprintiweyo yenziwekunye nendlu yendibano inokukunceda uphephe ezi mpazamo.

Hlaziya kwakhona inkangeleko yeqondo lobushushu– Isinyibilikisi esithambileyo sifuna ukujika sibe ngumphunga ngesantya esichanekileyo. Ai-ramp-up ephezuluokanye izinga lokushisa kwangaphambili lingakhokelela ekubunjweni kwebhola ye-solder. Ukusombulula oku, qinisekisa ukuba i-ramp-up yakho ingaphantsi kwe-1.5°C/sec ukusuka kumndilili wobushushu begumbi ukuya kwi-150°C.

UKUSUSWA KWEBHOLA ESOLDER

Chitha kwiinkqubo zomoyayeyona ndlela ilungileyo yokususa ungcoliseko lwebhola ye-solder. Aba matshini basebenzisa imilomo yomoya yoxinzelelo oluphezulu olususa ngenkani iibhola ze-solder kumphezulu webhodi yesekethe eprintiweyo ngenxa yoxinzelelo lwazo oluphezulu.

Nangona kunjalo, olu hlobo lokususa alusebenzi xa unobangela uvela kwiiPCB ezingaprintwanga kunye nemiba yokuncamathisela kwangaphambili.

Ngenxa yoko, kungcono ukuxilonga unobangela weebhola ze-solder kwangethuba, njengoko ezi nkqubo zinokuphembelela kakubi ukwenziwa kunye nemveliso yePCB yakho. Uthintelo lubonelela ngezona ziphumo zibalaseleyo.

THIBEKA IZIPHUMLO NGE-IMAGINEERING INC

Kwi-Imagineering, siyaqonda ukuba amava yeyona ndlela ilungileyo yokuphepha i-hiccups eza kunye nokwenziwa kwe-PCB kunye nokuhlanganisa. Sinikezela ngomgangatho ogqwesileyo wodidi oluthembekileyo kwizicelo zomkhosi kunye ne-aerospace, kwaye sibonelela ngoguquko olukhawulezayo kwiprototyping kunye nemveliso.

Ngaba ukulungele ukubona umahluko we-Imagineering?Qhagamshelana nathi namhlanjeukufumana ikowuti kwi-PCB yethu yokwenziwa kunye neenkqubo zokuhlanganisa.