Umahluko phakathi kwenkqubo ekhokelayo kunye nenkqubo ye-lead-free ye-pcb

Ukusetyenzwa kwe-PCBA kunye ne-SMT ngokubanzi kuneenkqubo ezimbini, enye yinkqubo engahlawulelwayo kwaye enye yinkqubo ekhokelayo. Wonke umntu uyazi ukuba ilothe iyingozi ebantwini. Ngoko ke, inkqubo yokukhokela ihlangabezana neemfuno zokukhuselwa kwendalo, okuyindlela eqhelekileyo kunye nokukhetha okungenakuphepheka kwimbali. . Asicingi ukuba i-PCBA processing plants ngaphantsi kwesikali (ngaphantsi kwe-20 SMT lines) inamandla okwamkela zombini ii-odolo ze-SMT ezihamba phambili kunye ne-lead-free-free SMT, ngenxa yokuba umahluko phakathi kwezinto, izixhobo, kunye neenkqubo zokwandisa kakhulu iindleko kunye nobunzima. yolawulo. Andazi ukuba kulula kangakanani ukwenza inkqubo engahlawulelwayo ngokuthe ngqo.
Apha ngezantsi, umahluko phakathi kwenkqubo yokukhokela kunye nenkqubo engahlawulelwayo ushwankathelwa ngokufutshane ngolu hlobo lulandelayo. Kukho ukusilela, kwaye ndiyathemba ukuba ungandilungisa.

1. Ukuqulunqwa kwe-alloy kuhluke: inkqubo eqhelekileyo yokukhokela i-tin-lead i-63/37, ngelixa i-lead-free alloy composition yi-SAC 305, oko kukuthi, Sn: 96.5%, Ag: 3%, Cu: 0.5%. Inkqubo engahlawulelwayo ayinakuqinisekisa ngokupheleleyo ukuba ayinalothe kwaphela, iqulethe kuphela umxholo ophantsi kakhulu welothe, onjengelothe engaphantsi kwe-500 PPM.

2. Amanqaku okunyibilika ahlukeneyo: indawo yokunyibilika kwe-lead-tin yi-180 ° ~ 185 °, kwaye ukushisa okusebenzayo malunga ne-240 ° ~ 250 °. Indawo yokunyibilika yetoti engenalo ilothe yi-210 ° ~ 235 °, kwaye ubushushu bokusebenza ngu-245 ° ~ 280 °. Ngokutsho kwamava, kuzo zonke i-8% -10% yokwanda komxholo we-tin, indawo yokunyibilika iyanda malunga nama-degrees angama-10, kwaye ukushisa okusebenzayo kwandisa ngama-10-20 degrees.

3. Iindleko zahlukile: ixabiso letoti libiza kakhulu kunelothe. Xa i-solder ebaluleke ngokulinganayo ithathelwa indawo nge-tin, ixabiso le-solder liya kunyuka ngokukhawuleza. Ngoko ke, iindleko zenkqubo yokukhokela iphezulu kakhulu kunenkqubo yokukhokela. Izibalo zibonisa ukuba i-tin bar ye-soldering wave kunye ne-tin wire ye-soldering manual, inkqubo ye-lead-free i-2.7 ngamaxesha aphezulu kunenkqubo ekhokelayo, kunye ne-solder paste ye-reflow soldering Ixabiso linyuka malunga namaxesha angama-1.5.

4. Inkqubo iyahluka: inkqubo ekhokelayo kunye nenkqubo yokukhokela ingabonwa kwigama. Kodwa ngokuthe ngqo kwinkqubo, i-solder, amacandelo, kunye nezixhobo ezisetyenzisiweyo, ezinje ngeziko lokuntywila, iiprinta ze-solder paste, kunye nee-ayina ze-soldering ze-soldering manual, zahlukile. Esi sesona sizathu siphambili sokuba kutheni kube nzima ukuphatha iinkqubo ezikhokelayo nezingenayo i-lead kwiplanti encinci yePCBA.

Ezinye iiyantlukwano ezinje ngefestile yenkqubo, ukuthengiselana, kunye neemfuno zokhuseleko lokusingqongileyo nazo zahlukile. Ifestile yenkqubo yenkqubo yokukhokela inkulu kwaye i-solderability iya kuba ngcono. Nangona kunjalo, ngenxa yokuba inkqubo ye-lead-free ihambelana nokusingqongileyo, kwaye iteknoloji iyaqhubeka iphucula, iteknoloji yenkqubo ye-lead-free yenze ithembekile kwaye ikhulile.