Ukwenzela ukuqhuba imveliso kunye nemveliso, iBhodi yeSekethe ye-PCBPPCB ngokubanzi kufuneka iyile inqaku lamanqaku, i-v-groove, kunye nokulungisa umda.
Uyilo lwembonakalo yePCB
1. Isakhelo (umda wokudibanisa) Indlela yokubeka i-PCB kufuneka yamkele iNkqubo yokuLawulwa kweLoop yokuLawula i-loop yokuqinisekisa ukuba indlela ye-PCB ibonakale ngokulula emva kokuba ilungisiwe kwi-fect.
2. Ububanzi bubo bonke bububanzi be-PCB ye-PCB yi-≤260mm (umgca we-NIGEMP) okanye ≤300mm (umgca we-fuji); Ukuba i-gling ngokuzenzekelayo iyafuneka, ububanzi bebonke buyindlela yokubeka i-PCB yi-125mm × 180mm.
3. Uyilo lokubonakala lwendlela yokukhwela i-PCB isondele kwisikwere kangangoko kunokwenzeka, kwaye kuyacetyiswa kakhulu ukuba usebenzise i-2 × 2, 3 × 3, ... kunye nendlela yebhodi; kodwa akunyanzelekanga ukuba ipele iibhodi eziqinisekileyo nezingalunganga;
I-PCBV-Sika
1. Emva kokuvula i-v-i-cutred, ububanzi buka-x kufuneka bube (1/4 ~ 1/3) ipleyiti i-l, kodwa ubuncinci be-X kufuneka ibe ≥0.4mm. Izithintelo ziyafumaneka ukuba iibhodi ezinemithwalo enzima, kwaye imida esezantsi ziyafumaneka iibhodi ezinemithwalo elula.
2. Ukufudukela kwenxeba kumacala asekhohlo nasekunene we-V-capi kufuneka kungabi ngaphantsi kwe-0 mm; Ngenxa yobuncinci obuqinayo obufanelekileyo, indlela ye-V-Ukusikwa kwe-V-Ukusikwa ayifanelekanga kwiBhodi kunye nobunzima obungaphantsi kwe-1.3mm.
Inqaku lamanqaku
1. Xa useta indawo yokhetho emiselweyo, phuma kwindawo engaphindwanga yindawo engachanekanga i-1.5 mm enkulu kuno-pipifitha yendawo yokhetho.
2. Isetyenziselwa ukunceda oochwephesha bohlobo lwe-smt bokubekwa endaweni yokufumana ngokuchanekileyo ikona ephezulu yebhodi ye-PCB enezinto ze-chip. Ubuncinci ubuncinci amanqaku amabini ahlukeneyo. Amanqaku emilinganiselo yokuma ngokuchanekileyo kwe-PCB yonke ngokubanzi kwiqhekeza elinye. Indawo yokuhlala yekona ephezulu yePCB; Amanqaku emilinganiselo yokubeka i-SPCIC ye-elektroniki ye-elektroniki ngokubanzi kwikona ephezulu yeBhodi yePakethi yePCB yePCB yePCB.
I-3. Kwizinto ze-QFP (iphakheji ye-Square Squere) nge-wire spacling ≤0.5 mm kunye ne-BGA
Itekhnoloji yeTekhnoloji
1. Umda phakathi kwesakhelo kunye neBhodi yaNgaphakathi, indawo phakathi kweBhodi ephambili kwaye iBhodi yeSixhobo se-elektroniki kufuneka ishiye ngaphezulu kwe-0.5 mm yendawo yangaphakathi. Ukuqinisekisa ukusebenza okuqhelekileyo kwe-laser cute i-cnc amaby.
Ukubeka imingxunya yokubeka kwiBhodi
1. Isetyenziselwa indawo yebhodi ye-PCB yonke yeBhodi yeSekethe yePCBPPCB kunye namanqaku asemgangathweni wokubeka icandelo elichanekileyo lezinto ezihle. Phantsi kweemeko eziqhelekileyo, i-QFP enethuba elingaphantsi kwe-0.65mm kufuneka isethwe kwikona ephezulu; Iimpawu ezisemgangathweni ezikhoyo zebhodi ye-PCB yeBhodi kufuneka isetyenziswe ngababini kwaye ichazwe kwiimbombo eziphezulu zezinto ezichanekileyo.
I-2. Iiposti zokugcina izinto okanye imingxunya yokubeka i-Precise kufuneka igcinelwe izinto ezinkulu ze-elektroniki, ezinje ngee-I / Jacks, i-jacks, i-jacks enokuphinda isebenze, i-jacks, i-entefown, njl.
Umyili we-PCB olungileyo kufuneka uthathele ingqalelo izinto zemveliso xa uphuhlisa isicwangciso soyilo soyilo ukuqinisekisa ukuveliswa okulula kunye nokufezekiswa kwemveliso, kunye nokunciphisa iindleko zemveliso.
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