Ukuze kube lula imveliso kunye nokuveliswa, PCBpcb ibhodi yesekethe Jigsaw ngokubanzi kufuneka uyilo Mark point, V-groove, kunye processing edge.
Uyilo lwembonakalo yePCB
1. Isakhelo (i-clamping edge) ye-PCB splicing method kufuneka yamkele i-closed-loop control design scheme ukuqinisekisa ukuba i-PCB splicing method ayikhubazeki ngokulula emva kokulungiswa kwifixture.
2. Ububanzi obupheleleyo bendlela ye-PCB ye-splicing ≤260Mm (umgca we-SIEMENS) okanye ≤300mm (umgca we-FUJI); ukuba i-gluing ngokuzenzekelayo iyafuneka, ububanzi bubonke bendlela ye-PCB yokudibanisa yi-125mm × 180mm.
3. Uyilo lwembonakalo yendlela yokukhwela i-PCB isondele kwisikwere ngokusemandleni, kwaye kukhuthazwa kakhulu ukuba kusetyenziswe i-2 × 2, 3 × 3, ... kunye nendlela yokukhwela; kodwa akuyomfuneko ukupela iibhodi ezintle nezimbi;
pcbV-Sika
1. Emva kokuvula i-V-cut, ubukhulu obuseleyo X kufuneka bube (1/4～1/3) ubukhulu beplate L, kodwa ubuncinci be-X kufuneka bube ≥0.4mm. Izithintelo ziyafumaneka kwiibhodi ezinemithwalo enzima, kwaye imingcele ephantsi iyafumaneka kwiibhodi ezinemithwalo elula.
2. Ukufuduka kwe-S kwesilonda kwicala lasekhohlo nasekunene kwe-V-cut kufuneka ibe ngaphantsi kwe-0 mm; ngenxa yobungakanani obuncinci bobukhulu obufanelekileyo, indlela ye-V-cut splicing ayifanelekanga kwibhodi enobunzima obungaphantsi kwe-1.3mm.
Phawula inqaku
1. Xa ubeka indawo yokukhetha esemgangathweni, shiya ngokubanzi indawo engathintekiyo yokumelana ne-1.5 mm enkulu kune-periphery yendawo yokukhetha.
2. Isetyenziselwa ukuncedisa i-electronic optics yomatshini wokubeka i-smt ukuba ibeke ngokuchanekileyo ikona ephezulu yebhodi ye-PCB enamalungu e-chip. Ubuncinci kukho imilinganiselo emibini eyahlukeneyo. Amanqaku omlinganiselo wokubekwa ngokuchanekileyo kwePCB iyonke akwiqhekeza elinye. Indawo ehambelanayo yekona ephezulu yePCB; iindawo zomlinganiselo wokubekwa ngokuthe ngqo kwe-PCB enemaleko ye-electronic optics ngokubanzi zikwikona ephezulu yebhodi yesekethe ye-PCB.
3. Kumacandelo e-QFP (i-square flat package) ene-wire spacing ≤0.5 mm kunye ne-BGA (i-ball grid array package) kunye ne-ball spacing ≤0.8 mm, ukwenzela ukuba kuphuculwe ukuchaneka kwe-chip, kucaciswe ukuseta ezimbini. iikona eziphezulu ze-IC Measuring point.
kwicala leteknoloji yokucubungula
1. Umda phakathi kwesakhelo kunye nebhodi ephambili yangaphakathi, i-node phakathi kwebhodi ephambili kunye nebhodi ephambili akufanele ibe nkulu okanye igqithise, kunye nomda wesixhobo sombane kunye nebhodi yesekethe ye-PCBpcb kufuneka ishiye ngaphezu kwe-0.5 mm yangaphakathi. indawo. Ukuqinisekisa ukusebenza okuqhelekileyo kwee-laser cutting CNC blades.
Imingxuma yokubeka ngokuchanekileyo ebhodini
1. Isetyenziselwa indawo echanekileyo yayo yonke ibhodi yesekethe yePCB yebhodi yesekethe yePCBpcb kunye namanqaku aqhelekileyo okubekwa ngokuthe ngqo kwamacandelo afakwe kakuhle. Kwiimeko eziqhelekileyo, i-QFP enekhefu elingaphantsi kwe-0.65mm kufuneka ibekwe kwikona yayo ephezulu; Amanqaku achanekileyo omgangatho wokumisa webhodi yentombi yePCB yebhodi kufuneka asetyenziswe ngababini kwaye abekwe kwiikona eziphezulu zezinto ezichanekileyo zokubeka.
2. Izithuba zokubeka ngokuchanekileyo okanye imingxuma yokubeka echanekileyo kufuneka igcinwe kumacandelo amakhulu e-elektroniki, njengeejekhi ze-I / O, ii-microphone, ii-jacks zebhetri ezihlawulelwayo, i-toggle switch, i-earphone jacks, ii-motor, njl.
Umyili we-PCB olungileyo kufuneka athathele ingqalelo izinto zemveliso kunye nemveliso xa ephuhlisa isicwangciso soyilo lwepuzzle ukuqinisekisa imveliso kunye nokulungiswa okufanelekileyo, ukuphucula imveliso, kunye nokunciphisa iindleko zemveliso.
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