Kwizixhobo ze-elektroniki, umlinganiselo othile wokushisa uveliswa ngexesha lokusebenza, ukwenzela ukuba ukushisa kwangaphakathi kwezixhobo kukhuphuke ngokukhawuleza.Ukuba ubushushu abuchithwanga ngexesha, izixhobo ziya kuqhubeka zifudumala, kwaye isixhobo siya kusilela ngenxa yokushisa.Ukuthembeka kwezixhobo ze-elektroniki Ukusebenza kuya kuncipha.
Ngoko ke, kubaluleke kakhulu ukuqhuba unyango olufanelekileyo lokutshatyalaliswa kobushushu kwibhodi yesiphaluka.Ukutshatyalaliswa kobushushu bebhodi yesekethe ye-PCB yinxalenye ebaluleke kakhulu, ngoko yintoni ubuchule bokutshatyalaliswa kobushushu bebhodi yesekethe ye-PCB, masiyixoxe kunye ngezantsi.
Ukutshatyalaliswa kobushushu ngebhodi ye-PCB ngokwayo Iibhodi ze-PCB ezisetyenziswa ngoku ngokubanzi zi-copper clad/epoxy glasscloth substrates okanye i-phenolic resin glass substrates zelaphu, kunye nenani elincinci leebhodi zobhedu ezisekelwe ephepheni ziyasetyenziswa.
Nangona ezi substrates zineempawu ezigqwesileyo zombane kunye nepropathi yokusetyenzwa, zinokuphelisa ubushushu.Njengendlela yokutshatyalaliswa kobushushu kumacandelo aphezulu okufudumeza, phantse akunakwenzeka ukulindela ukushisa kwi-PCB ngokwayo ukuqhuba ubushushu, kodwa ukutshabalalisa ubushushu ukusuka kumphezulu wecandelo ukuya kumoya ojikelezayo.
Nangona kunjalo, njengoko iimveliso ze-elektroniki ziye zangena kwixesha le-miniaturization yamacandelo, ukunyuka kwe-high-density mounting, kunye ne-high-heating assembly, akwanelanga ukuthembela kumphezulu wecandelo kunye nommandla omncinci kakhulu wokukhupha ukushisa.
Kwangaxeshanye, ngenxa yokusetyenziswa okukhulu kwezixhobo zokunyuka komphezulu ezifana ne-QFP kunye ne-BGA, ubushushu obuveliswa ngamacandelo budluliselwa kwibhodi yePCB ngesixa esikhulu.Ke ngoko, eyona ndlela ilungileyo yokusombulula ukutshatyalaliswa kobushushu kukuphucula amandla okuphelisa ubushushu bePCB ngokwayo enxibelelana ngqo ne-PCB.
▼Into yobushushu obudlulayo.Yenziwa okanye isasazwe.
▼Ubushushu obugqitha ngasezantsi bubushushu obuVia
Ukubonakaliswa kobhedu ngasemva kwe-IC kunciphisa ukuxhathisa kwe-thermal phakathi kobhedu kunye nomoya
Uyilo lwePCB
Izixhobo ezibuthathaka zobushushu zibekwe kwindawo yomoya obandayo.
Isixhobo sokubona ubushushu sibekwe kwindawo eshushu kakhulu.
Izixhobo ezikwibhodi eprintiweyo efanayo kufuneka zicwangciswe ngokusemandleni ngokwexabiso le-calorific kunye neqondo lokutshatyalaliswa kobushushu.Izixhobo ezinexabiso eliphantsi le-calorific okanye ukunganyangeki kobushushu (ezifana ne-transistors encinci yesignali, iisekethe ezihlanganisiweyo ezincinci, i-electrolytic capacitors, njl. njl.) kufuneka zifakwe kwi-airflow yokupholisa.Ukuhamba okuphezulu (ekungeneni), izixhobo ezinokushisa okukhulu okanye ukumelana nobushushu (njengama-transistors amandla, iisekethe ezinkulu ezidibeneyo, njl.)
Kwicala elithe tye, izixhobo eziphezulu zamandla zibekwe ngokusondeleyo kumda webhodi eprintiweyo ngokusemandleni ukunciphisa indlela yokudlulisa ukushisa;kwicala elithe nkqo, izixhobo eziphezulu zamandla zibekwe ngokusondeleyo kumphezulu webhodi eprintiweyo ngokusemandleni ukunciphisa impembelelo yezi zixhobo kubushushu bezinye izixhobo .
Ukutshatyalaliswa kobushushu bebhodi eprintiweyo kwisixhobo ikakhulu kuxhomekeke ekuhambeni komoya, ngoko ke indlela yokuhamba komoya kufuneka ifundwe ngexesha loyilo, kwaye isixhobo okanye ibhodi yesekethe eprintiweyo kufuneka iqwalaselwe ngokufanelekileyo.
Xa umoya uhamba, uhlala uhamba kwiindawo ezinokuxhatshazwa okuphantsi, ngoko xa ulungiselela izixhobo kwibhodi yesekethe eprintiweyo, gwema ukushiya indawo enkulu yomoya kwindawo ethile.Ukucwangciswa kweebhodi zeesekethe ezininzi eziprintiweyo kuwo wonke umatshini kufuneka kwakhona ingqalelo ingxaki efanayo.
Isixhobo esingeva ngamaqondo obushushu sibekwe ngcono kweyona ndawo isezantsi yobushushu (njengamazantsi esixhobo).Ungaze uyibeke ngqo phezu kwesixhobo sokufudumeza.Kungcono ukugxadazela izixhobo ezininzi kwinqwelomoya ethe tye.
Izixhobo ezisebenzisa amandla aphezulu kunye nokuveliswa kobushushu zicwangciswe kufuphi neyona ndawo ingcono yokuchitha ubushushu.Musa ukubeka izixhobo zokufudumeza okuphezulu kwiikona kunye nemida ye-peripheral yebhodi eprintiweyo, ngaphandle kokuba i-heat sink ilungiselelwe kufuphi nayo.
Xa uyila i-resistor yamandla, khetha isixhobo esikhulu kangangoko kunokwenzeka, kwaye usenze sibe nesithuba esaneleyo sokutshatyalaliswa kobushushu xa uhlengahlengisa ukwakheka kwebhodi eprintiweyo.
Isithuba selungu esicetyiswayo: