Litšebeletso tsa moralo oa lihlahisoa tsa Turnkey

Ho Fastline re sebetsa ka thata ho meralo le tlhahiso ea lisebelisoa tsa IoT.

Sheba litšebeletso tsa rona

Moralo oa Liindasteri

Boenjiniere

Litokomane

Moqapi oa lisebelisoa

Moqapi oa Firmware

Khokahano

Libetri tse Tloaelehileng

Prototyping

Tlhahiso

Setifikeiti

Moralo oa indasteri

Ho tloha khopolong ho ea ho mosebetsi oa matsoho

Re laola ts'ebetso eohle ea moralo oa indasteri. Ho tloha ho setšoantšo sa dijithale le botle bo botle ho isa ho tsamahano ea karolo le kopano.

Boenjineri ba mechini

Fastline ka moralo

Khatello ea boholo ba lisebelisoa tse aparoang e etsa hore ho li rala e be tsebo e khethehileng. Baenjiniere ba rona ba tseba maraba le mokhoa oa ho a qoba. Ka boitseanape bo tebileng tšimong, re akaretsa karolo e 'ngoe le e 'ngoe ho tloha ho moralo ho isa ho moetsi le polokeho ea basebelisi.

Moralo oa sehlahisoa bakeng sa tlhahiso le kopano (DFMandDFA)

Moralo bakeng sa polokeho, ts'epahalo, ts'ebeliso, le modularity

Tsamaiso ea Bili ea Lisebelisoa tsa Motlakase le Mechini (BOM).

Moralo oa Tlhokahalo ea Lintho (MRP)

Tekanyo ea Geometric le Tolerancig

Tlhahlobo ea stack-up ea mamello

Ho ntlafatsa litšenyehelo

Moqapi oa khatello ea mochine le mocheso

Litokomane tsa Sehlahisoa

Litokomane tse nepahetseng bakeng sa ho nepahala
tlhahiso

Litokomane tse felletseng, tse nepahetseng li bohlokoa bakeng sa ho arolelana litlhoko tsa sehlahisoa le moetsi oa konteraka. Ho Fastline sehlopha sa rona se nang le boiphihlelo se nts'etsapele litokomane tsa litekanyetso tsa ISO tse tsebahalang lefatšeng ka bophara, tse lumellang phetoho e bonolo ea tlhahiso ea bongata.

Bakeng sa likarolo tsa mochini le li-plastiki

Metako ea karolo/SUBASSY/ASSY .Karolo/SUBASSY/ASSY CAD difaele .Karolo le disampole tsa ASSY

Bakeng sa Kopano e Hatisitsoeng ea Boto ea Potoloho

.Moetso oa faele ea Gerber le (Design for Manufacturing) tlhahlobo ea DFM
.Lifaele tse ngata tsa Gerber tse nang le tlhaloso e bonolo ea mongolo README faele
.Boto Layer Stack up
.Detailed Bill of Materials with full part names/numbers for standard pack pack quantity of 3k+ units and multiple alternatives for passive components.
.Kgetha mme o behe lenane la difaele/karolo ya ho bea .Sekemaketsi sa kopano
.PCB Golden Sample bakeng sa benchmarking

Bakeng sa taolo ea boleng ba ho kenya le ho tsoa

.Libukana tsa liteko
.Liteko tsa ho kenya bakeng sa karolo ka 'ngoe (ha ho hlokahala) le tlhahiso e lokelang ho lekanyetsoa
.Tlhahiso ea tlhahlobo ea tlhahiso bakeng sa mekhahlelo ea lisebelisoa tsa likarolo / SUBASSY / ASSY le Final Assembly (FA).
.Litlhoko tsa tlhahiso le litlhaloso
.Ho etsa liteko le lisebelisoa

Moqapi oa lisebelisoa

Ts'ebetso e phahameng ka ho fetisisa ka moralo

Moralo oa Hardware ke ntlha ea bohlokoa ho khethollang katleho ea seaparo. Boitseanape ba rona bo fella ka lisebelisoa tsa morao-rao tse lekanyang lintlha tse kang moralo o tlase oa matla le ho sebetsa hantle ha matla, ka botle le ts'ebetso.

Moralo oa PCB Stack up, khetho ea thepa le sebopeho sa sebopeho sa mantlha

Moralo oa multilayer High - Density Interconnector PCBs

Moralo oa sebopeho se rarahaneng Ultra-thin Flexible Printed Circuits (FPC)

Merero ea Hardware e sebelisang mefuta e mengata ea MCUs

Nts'etsopele ea li-circuits tsa Tsamaiso ea Matla a Motlakase (PMCs) bakeng sa lisebelisoa tse nyane tsa mefuta

Palo ea Relative Dielectric Constant (εr)

Ts'ireletso ea Electromagnetic Interference (EMI) bakeng sa li-PCB tse thata

Nts'etsopele ea mekhoa ea tlhahlobo ea kopano ea PCB

Ho kenya ts'ebetsong ea tekano ea matla a motlakase le litokisetso tsa potoloho ea ts'ireletso ea Electrostatic Discharge (ESD).

Moralo oa taolo ea betri le sistimi ea ts'ireletso bakeng sa pakete ea betri ea LiPo

Moqapi oa Firmware

Ho aha taolong e nepahetseng ea lisebelisoa

Bokhoni ba ho sebetsa ka nako ea 'nete ba IoT bo hloka hore ho be le phallo e phahameng. Ho fihlela litlhoko tsena tse boima, sehlopha sa rona sa baenjiniere ba firmware se sebetsa ka thata ho rala matla a tlase, firmware e sebetsang hantle bakeng sa taolo e nepahetseng ea lisebelisoa le matla.

Nts'etsopele e thehiloeng ho Embedded Linux, Android, RTOS, Bare-Metal

Nts'etsopele ea li-algorithms tsa biometric le motsamao bakeng sa pulse oximetry, gyroscope / accelerometer, mocheso, le galvanic skin reaction (GSR)

Khokahano e se nang mohala (BLE, Wi-fi, LTE), lisebelisoa tse sireletsehileng tsa moea (OTA)

Tsoelo-pele ea Firmware bakeng sa ESP (ESP32), ST (STM32), Nordic (NRF32), Unisoc (SL8541E), Mediatek (W350), Goodix (GR551), Telink (TLSR9), Lichaba (N32), Realtek (RTL87), Dialog ( DA14), Semtech (LR1110)

Nts'etsopele ea betri - lits'ebetso tse sebetsang hantle le li-FWdrivers

Moralo oa mojule oa mehala le khokahanyo

Ho boloka basebelisi ba hokahane ebile ba bolokehile

Khokahano ea tikoloho ea IoT e bohlokoa. Li-module tsa cellular tse hahelletsoeng kahare le khokahano li lumella basebelisi ho tsoa ho li-smartphones tsa bona. Ho Fastline sehlopha sa rona sa kahare se ikemiselitse ho fana ka khokahano ea boleng bo holimo e bolokang basebelisi ba hokahane le tlhahisoleseling ea bona e bolokehile.

01 Radiofrequency (RF) Boenjiniere ba tsela, ketsiso, le ho bapisa

02 IoTSIM Applet for Secure End-2-End Communication (IoTSAFE) e lumellana

03 IoT Security Foundation (IoTSF) e lumellana.

04 Ts'ebetsong ea SIM e Kenyelitsoeng (eSIM)/Karete e Kenyellelitsoeng ea Universal Integrated Circuit Card (eUICC) ka har'a Wafer Level Chip Scale Package (WLCSP) kapa Machine-to-machine Form Factor (MFF2)

05 RF calibration bakeng sa likhokahano tse se nang mohala tse kang LTE, GSM, Wi-Fi, BT, GNSS joalo-joalo.

Moralo oa sefofane sa fatše sa LDS le Chip antennas

.Laser Direct Structuring (LDS) le Chip Antennas fatše sefofane sa moralo oa PCB

.LDS le Chip antenna prototyping, optimization, le netefatso

Libetri tse Tloaelehileng

Matla a sebetsang hantle

Compact Fit

Tšebeliso e bohlale ea sebaka e bohlokoa haholo theknolojing e ka aparoang. Ka hona, libeteri li tlameha ho sebetsa hantle 'me li fane ka matla a phahameng a matla.
Re thusa ka ho rala le ho etsa mehloli ea matla ho fihlela litlhoko tse nepahetseng tsa sehlahisoa sa lisebelisoa tse nyane tsa mofuta o itseng.

Moqapi oa Mojule

Netefatso

Manufacturer Sourcing

Setifikeiti sa Polokeho

Setifikeiti sa UL

Prototyping

Ho nka theknoloji e ka roaloang ho tloha ho prototype ho ea ho tlhahiso

Prototyping ke ts'ebetso ea mantlha nts'etsopele ea mahlale a aparoang. Ka holim'a tsohle, e lumella lipatlisiso tsa basebelisi ba ho qetela, ho hlophisa hantle
ea boiphihlelo ba mosebelisi mme e ka eketsa tlhahiso ea boleng ba sehlahisoa sa hau. Mekhoa ea rona ea ho etsa litšoantšo e fana ka motheo o tiileng oa ho netefatsa sehlahisoa, ho bokella lintlha le ho fokotsa litšenyehelo.

Tlhahiso

Tlhahiso ea boleng bo holimo ka theko e tlase

Re fana ka lipuisano le tšehetso nakong eohle ea ts'ebetso ea tlhahiso. Sehlopha sa rona sa taolo ea tlhahiso se ikemiselitse ho boloka le ho ntlafatsa boleng ba sehlahisoa ha se ntse se fokotsa litšenyehelo tsa tlhahiso le linako tse etellang pele.

01 Phepelo ea Bafani

02 Design for Manufacturing (DFM)

03 Kopano

04 Teko ea ts'ebetso (FCT) le Taolo ea Boleng

05 Ho paka le thepa

Setifikeiti sa Sehlahisoa

Ho lumellana le 'maraka oa lefats'e

Ho fihlella maemo a machaba ke ts'ebetso e nkang nako, e rarahaneng ea bohlokoa ho nolofalletsa thekiso libakeng tsohle tsa moruo. HoFastline, re utloisisa ka botlalo melao-motheo le mekhoa ea ho netefatsa hore lihlahisoa tsa rona li finyella litekanyetso tsena tse thata.

Melao ea 01 ea radiofrequency (CE, FCC, RED, RCM)

02 Litekanyetso tse akaretsang tsa polokeho (CE, WEEE, ROHS, REACH, CPSIA),

03 Melao ea Tšireletso ea Battery (UL, UN 38.3, IEC-62133-2) le ho feta.