1.CAPPIVA:
| bokaholimo | 1-50 Karolo |
| TLHOKOMELISO E PHETHANG KOTSI (HDI) | 2 + n + 2 |
| Mofuta oa thepa | FR-4, HIGH TG, Halagen Free, Rogers, Terq, Whengyi, Taisa, Taxic, Alon, Teflon, Roger, koporo e thehiloeng |
| Botenya ba boto | 0.21 ho isa ho 7.0mm |
| Botenya ba copper | 0.5 oz ho isa ho 10 oz |
| Boholo | Max. Boholo ba boto: 580mm × 1100mmm |
| Min. Boholo ba lesoba: 0,15 mm (6 mil) min. Laser Drill 0,1mm (4mil) | |
| Min. Bophara: 3mil (0.075mm) | |
| Min. Line Spacing: 3mil (0.075mm) | |
| Ho qeta | Hasl / hasl lead |
| 'Mala oa mask mask | Botala / botala / botala / bosoeu / bosoeu / bofubelu / boputsoa |
| Ho mamella | Ho mamella ha sebopeho: ± 0.13 (5mil) |
| Ho Mabomo Ho Hole: Pth: ± 0.075 (3mil) NPTH: ± 0.05 (2mil) | |
| Setifikeiti | Ul, Iso 9001, ISO 14001 |
| Litlhokahalo tse Khethehileng | O patiloe mme o foufetse ka imppentance + bga |
| Profiling | Ho putlama, ho roala, v-cut, bikeng |
TLHOKOMELISO:
3.Factory:
4. TLHOKOMELISO EABoto e phahameng ea menoang ea marang-rang ea marang-rang
Re behile lefapha le arohaneng moo moralo oa tlhahiso o khethehileng o tla latela tlhahiso ea hau ea odara kamora tefo ea hau, ho fihlela tlhahiso ea hau ea PCB ea PCB ea PCB.
Re na le boleng bo tlase ba ho paka Pcba ea rona.
1 Etela:
Sekhechana sa 6:
Re sebelisa Vacuum le Carton ho ea thatela thepa, ho etsa bonnete ba hore kaofela ba ka u fihlela ka botlalo.
7.deaver le ho sebeletsa:
U ka khetha k'hamphani efe kapa efe ea ho bontša hore u na le ak'haonte ea hau, kapa ak'haonte ea rona, bakeng sa sephutheloana sa boima, thepa ea leoatleng e tla ba teng.
