Kalafo pele koporo e teba

1. Deburring: The substrate e feta ka mokhoa oa ho phunya pele koporo e teba. Le hoja ts'ebetso ena e tloaelehile ho li-burrs, ke kotsi ea bohlokoa ka ho fetisisa e patiloeng e bakang metallization ea likoti tse tlaase. E tlameha ho sebelisa mokhoa oa theknoloji oa deburring ho rarolla. Hangata mekhoa ea mechine e sebelisoa ho etsa moeli oa lesoba le lerako le ka hare la lesoba ntle le li-barbs kapa plugging.
2. Ho theola mafura
3. Kalafo ea ho rohakana: haholo-holo ho netefatsa matla a maqhama a matle pakeng tsa ho roala tšepe le substrate.
4. Kalafo ea ts'ebetso: haholo-holo e theha "setsi sa ho qala" ho etsa seaparo sa koporo sa koporo.

Lisosa tsa li-voids ka har'a lebota la lesoba:
Mokoti oa lesoba la lebota le bakoang ke 1PTH
(1) Likahare tsa koporo, sodium hydroxide le mahloriso a formaldehyde ka siling ea koporo
(2) Mocheso oa bateng
(3) Taolo ea tharollo ea ts'ebetso
(4) Ho hloekisa mocheso
(5) Mocheso oa tšebeliso, mahloriso le nako ea pore modifier
(6) Sebelisa mocheso, mahloriso le nako ea ho fokotsa moemeli
(7) Oscillator le swing

2 Hole lebota plating voids e bakoang ke phetiso ea mohlala
(1) poleiti ea borashe pele ho kalafo
(2) Sekhomaretsi se setseng sebakeng se orifice
(3) Pretreatment micro-etching

3 Hole lebota le koalehileng likheo tse bakoang ke mokhoa oa ho pola
(1) Micro-etching ea mohlala plating
(2) Tinning (loto tin) e na le phallo e mpe

Ho na le lintlha tse ngata tse bakang li-voids tsa ho roala, tse tloaelehileng haholo ke PTH coating voids, e ka fokotsang ka katleho tlhahiso ea li-voids tsa PTH ka ho laola mekhoa e nepahetseng ea potion. Leha ho le joalo, lintlha tse ling li ke ke tsa hlokomolohuoa. Ke feela ka ho shebella ka hloko le ho utloisisa lisosa tsa ho roala li-voids le litšoaneleho tsa bofokoli mathata a ka rarolloang ka nako le ka mokhoa o sebetsang 'me boleng ba lihlahisoa bo ka bolokoa.