Ebile, PCB warping e boetse e bua ka ho kobeha ha boto ea potoloho, e bolelang boto ea pele ea potoloho e bataletseng. Ha li behiloe komporong, lipheletsong tse peli kapa bohareng ba boto li hlaha hanyane holimo. Ketsahalo ena e tsejoa e le PCB warping indastering.
Foromo ea ho bala warpage ea boto ea potoloho ke ho beha boto ea potoloho e bataletseng holim'a tafole le likhutlo tse 'nè tsa boto ea potoloho fatše le ho lekanya bophahamo ba arch bohareng. Foromo e tjena:
Warpage = bophahamo ba arch / bolelele ba lehlakore le lelelele la PCB * 100%.
Tekanyetso ea indasteri ea "circuit board warpage": Ho ea ka IPC — 6012 (khatiso ea 1996) "Specification for Identication and Performance of Rigid Printed Boards", "warpage" e kholo le ho sotha ho lumelletsoeng bakeng sa tlhahiso ea liboto tsa potoloho li pakeng tsa 0.75% le 1.5%. Ka lebaka la bokhoni bo fapaneng ba ts'ebetso ea feme e 'ngoe le e' ngoe, ho boetse ho na le phapang e itseng ho litlhoko tsa taolo ea leqephe la ntoa la PCB. Bakeng sa boto ea 1.6 e teteaneng e tloaelehileng e nang le mahlakoreng a mabeli a mahlakoreng a mabeli, boholo ba baetsi ba boto ea potoloho ba laola ntoa ea PCB pakeng tsa 0.70-0.75%, liboto tse ngata tsa SMT, BGA, litlhoko tse ka hare ho 0.5%, lifeme tse ling tsa boto ea potoloho tse nang le matla a matla a tshebetso li ka phahamisa PCB warpage standard ho fihla ho 0.3%.
Joang ho qoba warping ea boto ea potoloho nakong ea tlhahiso?
(1) Tlhophiso e phekotsoeng lipakeng tsa lera ka 'ngoe e lokela ho lekana, karolo ea liboto tsa potoloho ea mekhahlelo e tšeletseng, botenya bo pakeng tsa 1-2 le 5-6 le palo ea likotoana tse folisitsoeng e lokela ho ts'oana;
(2) Multi-layer PCB core board le folisa sheet li lokela ho sebelisa lihlahisoa tse tšoanang tsa morekisi;
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Joang ho thibela warping board board?
1.Moqapi oa boenjiniere: tlhophiso ea li-interlayer semi-curing sheet e lokela ho ba e loketseng; Multilayer core board le semi-cured sheet li tla etsoa ho tsoa ho morekisi a le mong; Sebaka sa setšoantšo sa sefofane sa ka ntle sa C / S se haufi ka hohle kamoo ho ka khonehang, 'me grid e ikemetseng e ka sebelisoa.
2.Drying plate pele e koala: ka kakaretso likhato tse 150 lihora tse 6-10, ntle le mouoane oa metsi ka poleiti, ho etsa hore resin e fole ka ho feletseng, e felise khatello ea kelello ka poleiti; Letlapa la ho baka pele le buloa, lesela le ka hare le mahlakore a mabeli li hloka!
3.Pele li-laminates, tlhokomelo e lokela ho lefshoa ho tataiso ea warp le weft ea poleiti e tiileng: karo-karolelano ea warp le weft shrinkage ha e tšoane, 'me ho lokela ho lefshoa ho khetholla tataiso ea warp le weft pele ho laminating lakane e tiileng-thata; Letlapa la mantlha le boetse le lokela ho ela hloko tataiso ea warp le weft; Tataiso e akaretsang ea letlapa la pheko ea poleiti ke tataiso ea meridian; Tsela e telele ea poleiti ea koporo ke meridional; Likarolo tse 10 tsa lakane ea koporo e matla ea 4OZ
4.the botenya ba lamination ho felisa khatello ea kelello ka mor'a hore batang tobetsa, trimming bohale e tala;
5.Letlapa la ho baka pele ho cheka: likhato tse 150 bakeng sa lihora tsa 4;
6.Ho molemo hore u se ke ua tsamaea ka borashe ba ho sila ka mechine, ho khothalletsoa ho hloekisa lik'hemik'hale; Sebopeho se khethehileng se sebelisoa ho thibela poleiti hore e se ke ea kobeha le ho phutha
7.Ka mor'a ho fafatsa thini holim'a 'mabole o bataletseng kapa poleiti ea tšepe pholileng ea tlhaho ho mocheso oa kamore kapa moea o pholileng oa bethe ka mor'a ho hloekisa;
