Selelekela saBoto ea Potoloho ea Koporo e teteanengThekenoloji

(1) Ho lokisoa esale pele le kalafo ea electroplating

Sepheo se seholo sa ho tiisa koporo ea koporo ke ho etsa bonnete ba hore ho na le lesela le lekaneng le lekaneng la koporo ka sekoting ho netefatsa hore boleng ba ho hanyetsa bo ka har'a mefuta e hlokahalang ke ts'ebetso. Joaloka plug-in, ke ho lokisa boemo le ho netefatsa matla a ho hokahanya; e le sesebelisoa se phahamisitsoeng holim'a metsi, likoti tse ling li sebelisoa feela ka likoti, tse phethang karolo ea ho tsamaisa motlakase mahlakoreng ka bobeli.

(2) Lintho tsa tlhahlobo

1. Haholo-holo hlahloba boleng ba metallization ea sekoti, 'me u netefatse hore ha ho na ho feteletseng, burr, lesoba le letšo, lesoba, joalo-joalo ka sekoting;

2. Hlahloba hore na ho na le litšila le lintho tse ling tse feteletseng holim'a substrate;

3. Sheba palo, nomoro ea ho taka, tokomane ea ts'ebetso le tlhaloso ea ts'ebetso ea substrate;

4. Fumana boemo bo ntseng bo eketseha, litlhoko tsa ho kenya le sebaka sa ho roala seo tanka ea plating e ka se jarang;

5. Sebaka sa plating le mekhoa ea ts'ebetso e lokela ho hlaka ho netefatsa botsitso le ho khoneha ha mekhoa ea ts'ebetso ea electroplating;

6. Ho hloekisa le ho lokisa likarolo tsa conductive, phekolo ea pele ea motlakase ho etsa hore tharollo e sebetse;

7. Etsa qeto ea hore na ho hlophisoa ha mokelikeli oa ho hlapa hoa tšoaneleha le sebaka sa holim'a poleiti ea electrode; haeba anode ea spherical e kentsoe kholomong, ts'ebeliso le eona e tlameha ho hlahlojoa;

8. Sheba ho tiea ha likarolo tsa ho kopana le mefuta e fapaneng ea ho fetoha ha motlakase le ea hona joale.

(3) Taolo ea boleng ba ho roala koporo e teteaneng

1. Bala ka nepo sebaka sa plating 'me u bue ka tšusumetso ea ts'ebetso ea sebele ea tlhahiso ho ea hona joale, ho tseba hantle boleng bo hlokahalang ba hona joale, ho laola phetoho ea hona joale ts'ebetsong ea electroplating,' me u netefatse botsitso ba mekhoa ea electroplating. ;

2. Pele ho electroplating, qala ka ho sebelisa boto ea ho lokisa liphoso bakeng sa ho cheka liteko, e le hore bate e be boemong bo sebetsang;

3. Etsa qeto ea tataiso ea phallo ea kakaretso ea hona joale, ebe u fumana taelo ea lipoleiti tse leketlileng. Ha e le hantle, e lokela ho sebelisoa ho tloha hōle ho ea haufi; ho etsa bonnete ba ho lumellana ha kabo ea hona joale holim'a leha e le efe;

4. Ho etsa bonnete ba ho lumellana ha seaparo ka sekoting le ho tsitsisa ha botenya ba ho roala, ho phaella mehatong ea thekenoloji ea ho hlohlelletsa le ho hloekisa, ho boetse hoa hlokahala ho sebelisa motlakase oa hona joale;

5. Kamehla hlokomela liphetoho tsa hona joale nakong ea ts'ebetso ea electroplating ho netefatsa ho tšepahala le botsitso ba boleng ba hona joale;

6. Sheba hore na botenya ba lera la koporo la sekoti le kopana le litlhoko tsa tekheniki.

(4) Ts'ebetso ea ho roala koporo

Ts'ebetsong ea ho tenya koporo ea koporo, litekanyetso tsa ts'ebetso li tlameha ho beoa leihlo khafetsa, 'me tahlehelo e sa hlokahaleng hangata e bakoa ke mabaka a ikemetseng le a sepheo. Ho etsa mosebetsi o motle oa ho tiisa ts'ebetso ea koporo ea koporo, lintlha tse latelang li tlameha ho etsoa:

1. Ho ea ka boleng ba sebaka se baloang ke k'homphieutha, ho kopantsoe le phihlelo e sa khaotseng e bokelitsoeng tlhahiso ea sebele, eketsa boleng bo itseng;

2. Ho ea ka boleng ba hona joale bo baliloeng, e le ho netefatsa botšepehi ba lera la plating ka sekoting, ho hlokahala ho eketsa boleng bo itseng, ke hore, hona joale, ka boleng ba pele ba hona joale, ebe o khutlela ho boleng ba pele ka nako e khutšoanyane;

3. Ha electroplating ea boto ea potoloho e fihla metsotso ea 5, ntša substrate ho bona hore na lera la koporo holim'a metsi le lerako le ka hare la sekoti le phethehile, 'me ho molemo hore likoti tsohle li be le khanya ea tšepe;

4. Sebaka se itseng se tlameha ho bolokoa pakeng tsa substrate le substrate;

5. Ha plating ea koporo e teteaneng e fihla nako e hlokahalang ea electroplating, palo e itseng ea hona joale e tlameha ho bolokoa nakong ea ho tlosoa ha substrate ho etsa bonnete ba hore bokaholimo le masoba a substrate e latelang li ke ke tsa fifala kapa tsa fifala.

Mehato ya tlhokomelo:

1. Sheba litokomane tsa ts'ebetso, bala litlhoko tsa ts'ebetso 'me u tloaelane le moralo oa machining oa substrate;

2. Sheba bokaholimo ba substrate bakeng sa li-scratches, indentations, likarolo tsa koporo tse pepesitsoeng, joalo-joalo;

3. Etsa ts'ebetso ea liteko ho latela mochini oa floppy disk, etsa tlhahlobo ea pele, ebe o sebetsana le lisebelisoa tsohle ka mor'a ho finyella litlhoko tsa theknoloji;

4. Lokisetsa lisebelisoa tsa ho lekanya le lisebelisoa tse ling tse sebelisetsoang ho shebella litekanyo tsa geometri tsa substrate;

5. Ho ea ka thepa e tala ea substrate ea ho sebetsa, khetha sesebelisoa se loketseng sa ho sila (milling cutter).

(5) Taolo ea boleng

1. Kenya ts'ebetsong mokhoa oa pele oa tlhahlobo ea lingoloa ho netefatsa hore boholo ba sehlahisoa bo kopana le litlhoko tsa moralo;

2. Ho ea ka lisebelisoa tse tala tsa boto ea potoloho, ka mokhoa o utloahalang khetha mekhoa ea ho sila;

3. Ha u lokisa boemo ba boto ea potoloho, u e qobelle ka hloko ho qoba tšenyo ea lera la solder le mask a solder holim'a boto ea potoloho;

4. Ho etsa bonnete ba ho lumellana ha litekanyo tsa ka ntle tsa substrate, ho nepahala ha boemo ho tlameha ho laoloa ka thata;

5. Ha ho qhaqhoa le ho bokana, tlhokomelo e khethehileng e lokela ho lefshoa ho padding lera ea motheo ea substrate ho qoba tšenyo ea lera la ho roala holim'a boto ea potoloho.