Liboto tsa potoloho tse hatisitsoeng (PCBs) li theha motheo o tšehetsang 'mele le ho hokahanya likarolo tsa elektronike ho sebelisa mekhoa ea koporo e tsamaisang le liphahlo tse kopantsoeng le substrate e sa sebetseng. Li-PCB li bohlokoa ho sesebelisoa se seng le se seng sa elektroniki, se nolofalletsang ho phethahala ha meralo e rarahaneng ea potoloho hore e be lifomate tse kopaneng le tse hlahisoang ka bongata. Ntle le theknoloji ea PCB, indasteri ea lisebelisoa tsa elektroniki e ka be e le sieo kamoo re e tsebang kajeno.
Ts'ebetso ea ho etsa PCB e fetola lisebelisoa tse tala tse kang lesela la fiberglass le foil ea koporo hore e be liboto tse entsoeng ka nepo. E kenyelletsa mehato e fetang leshome le metso e mehlano e rarahaneng ea ho sebelisa li-automation tse tsoetseng pele le taolo e thata ea ts'ebetso. Phallo ea ts'ebetso e qala ka ho ts'oaroa ha moralo le moralo oa khokahano ea potoloho ho software ea electronic design automation (EDA). Li-mask tsa bonono li hlalosa libaka tsa morao-rao tse pepesang li-laminate tsa koporo ka mokhoa o ikhethileng li sebelisa litšoantšo tsa photolithographic. Etching e tlosa koporo e sa pepesoang hore e tlohele litsela tse ka thoko tsa conductive le li-pads tsa ho ikopanya.
Multi-layer boards sandwich hammoho e thata koporo clad laminate le prepreg bonding sheets, fusing mesaletsa holim'a lamination tlas'a khatello e phahameng le mocheso. Mechini e chekang e ne e e-na le masoba a manyane a likete a hokahantsoeng lipakeng tsa masela, a ntan'o koaheloa ka koporo ho phethela lits'ebetso tsa potoloho ea 3D. Ho cheka, ho pola, le ho tsamaisa liboto ho fihlela li loketse ho roala sekirini sa silika. Tlhahlobo e ikemetseng ea optical le liteko li tiisa khahlanong le melao ea moralo le litlhaloso pele ho thomello ea bareki.
Baenjineri ba khanna lintlafatso tse tsoelang pele tsa PCB tse nolofalletsang lisebelisoa tsa elektroniki tse teteaneng, tse potlakileng le tse tšepahalang haholoanyane. High density interconnect (HDI) le mahlale a mofuta ofe kapa ofe a se a kopanya mekhahlelo e fetang 20 ho tsamaisa li-processor tse rarahaneng tsa dijithale le litsamaiso tsa maqhubu a seea-le-moea (RF). Liboto tsa rigid-flex li kopanya lisebelisoa tse thata le tse tenyetsehang ho fihlela litlhoko tse hlokahalang tsa sebopeho. Ceramic le insulation metal backing (IMB) substrates e tšehetsa maqhubu a phahameng haholo ho fihla ho millimeter-wave RF. Indasteri e boetse e amohela mekhoa le lisebelisoa tse baballang tikoloho.
Phetoho ea indasteri ea PCB ea lefats'e e feta $75 bilione ho bahlahisi ba fetang 2,000, e holile ho 3.5% CAGR nalaneng. Karohano ea 'maraka e ntse e le holimo le hoja ho kopanya ho tsoela pele butle-butle. China e emetse setsi se seholo sa tlhahiso se nang le karolo e fetang 55% ha Japane, Korea le Taiwan li latela ka holimo ho 25% ka kopanelo. Amerika Leboea e ikarabella ka tlase ho 5% ea lihlahisoa tsa lefats'e. Boemo ba indasteri bo fetohela molemong oa Asia ka sekhahla, litšenyehelo, le ho ba haufi le liketane tse kholo tsa phepelo ea lisebelisoa tsa elektroniki. Leha ho le joalo, linaha li boloka bokhoni ba PCB ba lehae bo tšehetsang ts'ireletso le ts'ireletso ea thepa ea mahlale.
Ha lintlafatso tsa lisebelisoa tsa bareki li ntse li hola, lits'ebetso tse ntseng li hlaha molemong oa likhokahano, motlakase oa lipalangoang, li-automation, aerospace, le lits'ebetso tsa bongaka li khothaletsa kholo ea nako e telele ea indasteri ea PCB. Lintlafatso tse tsoelang pele tsa theknoloji li boetse li thusa ho eketsa lisebelisoa tsa elektroniki ka bophara ho feta maemong a ts'ebeliso ea indasteri le ea khoebo. Li-PCB li tla tsoelapele ho sebeletsa sechaba sa rona sa dijithale le se bohlale lilemong tse mashome tse tlang.