(1) Mola
Ka kakaretso, bophara ba mohala oa pontšo ke 0.3mm (12mil), bophara ba mohala oa matla ke 0.77mm (30mil) kapa 1.27mm (50mil); sebaka se pakeng tsa mola le mola le pad e kholo ho feta kapa e lekana le 0.33mm (13mil) ). Likopong tse sebetsang, eketsa sebaka ha maemo a lumela;
Ha boima ba lithapo bo phahame, ho ka nahanoa ka mela e 'meli (empa ha e khothalletsoe) ho sebelisa li-IC pin. Bophara ba mola ke 0.254mm (10mil), mme sebaka sa mela ha se ka tlase ho 0.254mm (10mil). Tlas'a maemo a khethehileng, ha lithakhisa tsa lisebelisoa li teteaneng 'me bophara bo le moqotetsane, bophara ba mela le sebaka sa mela se ka fokotsoa ka nepo.
(2) Letlapa (PAD)
Litlhoko tsa motheo bakeng sa liphahlo (PAD) le likoti tsa phetoho (VIA) ke: bophara ba disk bo boholo ho feta bophara ba sekoti ka 0.6mm; mohlala, li-resistors tsa pin tse sebelisoang ka kakaretso, li-capacitor, le li-circuits tse kopantsoeng, joalo-joalo, li sebelisa disk / lesoba boholo ba 1.6mm/0.8 mm (63mil/32mil), li-sockets, pins le diode 1N4007, joalo-joalo, li amohela 1.8mm/ 1.0mm (71mil/39mil). Lits'ebetsong tsa sebele, e lokela ho khethoa ho latela boholo ba karolo ea sebele. Haeba maemo a lumela, boholo ba pad bo ka eketsoa ka nepo;
Karolo e kenyang lesoba le entsoeng ho PCB e lokela ho ba kholoanyane ka 0.2～0.4mm (8-16mil) ho feta boholo ba 'nete ba pinana ea motsoako.
(3) Ka (VIA)
Ka kakaretso 1.27mm/0.7mm (50mil/28mil);
Ha sekhahla sa wiring se phahame, boholo ba ka tsela bo ka fokotsoa ka nepo, empa ha ea lokela ho ba nyane haholo. Nahana ka ho sebelisa 1.0mm/0.6mm (40mil/24mil).

(4) Litlhoko tsa molumo bakeng sa li-pads, mela le li-pass
PAD le VIA: ≥ 0.3mm (12mil)
PAD le PAD: ≥ 0.3mm (12mil)
PAD le TRACK: ≥ 0.3mm (12mil)
TRACK le TRACK: ≥ 0.3mm (12mil)
Ka bongata bo phahameng:
PAD le VIA: ≥ 0.254mm (10mil)
PAD le PAD: ≥ 0.254mm (10mil)
PAD le TRACK: ≥ 0.254mm (10mil)
TRACK le TRACK: ≥ 0.254mm (10mil)