3 Litlhoko tse phahameng tsa mocheso le mocheso oa mocheso

Ka miniaturization, ts'ebetso e phahameng, le tlhahiso ea mocheso o phahameng oa lisebelisoa tsa elektroniki, litlhoko tsa taolo ea mocheso oa lisebelisoa tsa elektroniki li ntse li eketseha, 'me e' ngoe ea litharollo tse khethiloeng ke ho theha liboto tsa potoloho tse hatisitsoeng ka thermally conductive.Boemo bo ka sehloohong bakeng sa li-PCB tse thibelang mocheso le tse senyang mocheso ke thepa e thibelang mocheso le ho senya mocheso ea substrate.Hona joale, ntlafatso ea lisebelisoa tsa motheo le ho eketsoa ha li-fillers li ntlafalitse thepa e thibelang mocheso le ho tlosa mocheso ho isa tekanyong e itseng, empa ntlafatso ea conductivity ea mocheso e fokotsehile haholo.Ka tloaelo, substrate ea tšepe (IMS) kapa boto ea potoloho e hatisitsoeng ea tšepe e sebelisoa ho qhala mocheso oa karolo ea ho futhumatsa, e fokotsang molumo le litšenyehelo ha e bapisoa le radiator ea setso le pholileng ea fan.

Aluminium ke thepa e khahlehang haholo.E na le lisebelisoa tse ngata, theko e tlaase, conductivity e ntle ea mocheso le matla, 'me e na le botsoalle ba tikoloho.Hajoale, likarolo tse ngata tsa tšepe kapa li-cores tsa tšepe ke aluminium ea tšepe.Melemo ea liboto tsa potoloho tse thehiloeng ho aluminium li bonolo ebile li na le moruo, likhokahano tsa elektroniki tse tšepahalang, ts'ebetso e phahameng ea mocheso le matla, ts'ireletso ea tikoloho e sa rekisoang le e se nang lead, joalo-joalo, 'me e ka etsoa le ho sebelisoa ho tloha lihlahisoa tsa bareki ho isa likoloing, lihlahisoa tsa sesole. le sefofane.Ha ho na pelaelo ka conductivity ea mocheso le ho hanyetsa mocheso oa substrate ea tšepe.Ntho ea bohlokoa e teng ts'ebetsong ea sekhomaretsi se sireletsang pakeng tsa tšepe ea tšepe le lera la potoloho.

Hona joale, matla a ho khanna a tsamaiso ea mocheso o lebisitsoe ho li-LED.Hoo e ka bang 80% ea matla a kenyang a LED a fetoloa mocheso.Ka hona, taba ea tsamaiso ea mocheso oa li-LED e nkoa e le ea bohlokoa haholo, 'me ho tsepamisitsoe maikutlo holim'a mocheso oa mocheso oa substrate ea LED.Sebopeho sa lisebelisoa tse thibelang mocheso o phahameng le tse sa sireletsehang tikolohong li rala motheo oa ho kena 'marakeng oa mabone a LED a khanyang haholo.

4 Lisebelisoa tsa elektronike tse feto-fetohang le tse hatisitsoeng le litlhoko tse ling

4.1 Litlhoko tsa boto tse feto-fetohang

The miniaturization le thinning ea thepa ea elektronike tla ke keng ea qojoa ho sebelisa palo e kholo ea flexible printed circuit boards (FPCB) and rigid-flex printed circuit boards (R-FPCB).Mmaraka oa lefats'e oa FPCB hajoale o hakanngoa hore o ka ba lidolara tse limilione tse likete tse 13, 'me sekhahla sa kholo ea selemo se lebelletsoe ho ba holimo ho feta sa li-PCB tse thata.

Ka ho atolosoa ha kopo, ntle le keketseho ea palo, ho tla ba le litlhoko tse ngata tse ncha tsa tshebetso.Lifilimi tsa Polyimide li fumaneha ka mebala e se nang 'mala le e pepeneneng, e tšoeu, e ntšo le e mosehla, 'me e na le mocheso o phahameng oa ho hanyetsa le thepa e tlaase ea CTE, e loketseng liketsahalo tse fapaneng.Li-substrates tsa lifilimi tsa polyester tse theko e tlaase le tsona lia fumaneha 'marakeng.Mathata a macha a ts'ebetso a kenyelletsa elasticity e phahameng, botsitso ba sebopeho, boleng ba sefahleho sa filimi, le khokahano ea photoelectric ea filimi le khanyetso ea tikoloho ho fihlela litlhoko tse lulang li fetoha tsa basebelisi ba ho qetela.

FPCB le liboto tse thata tsa HDI li tlameha ho fihlela litlhoko tsa phetisetso ea mats'oao a lebelo le phahameng.Tahlehelo ea kamehla ea dielectric le dielectric ea substrates e tenyetsehang le eona e tlameha ho lebisoa tlhokomelo ho eona.Polytetrafluoroethylene le substrates e tsoetseng pele ea polyimide li ka sebelisoa ho theha maemo a bonolo.Potoloho.Ho kenyelletsa phofo ea inorganic le carbon fiber filler ho resin ea polyimide ho ka hlahisa sebopeho sa mekhahlelo e meraro sa substrate e feto-fetohang ea thermally conductive.Li-filler tsa inorganic tse sebelisoang ke aluminium nitride (AlN), aluminium oxide (Al2O3) le hexagonal boron nitride (HBN).The substrate e na le 1.51W/mK thermal conductivity 'me e khona ho mamella 2.5kV mamella voltage le 180 degree ea ho kobeha teko.

Limmaraka tsa likopo tsa FPCB, joalo ka lifono tse bohlale, lisebelisoa tse aparoang, lisebelisoa tsa bongaka, liroboto, joalo-joalo, li hlahisitse litlhoko tse ncha mabapi le sebopeho sa ts'ebetso sa FPCB, 'me li hlahisitse lihlahisoa tse ncha tsa FPCB.Tse kang ultra-thin flexible multilayer board, FPCB ea mekhahlelo e mene e fokotsehile ho tloha ho 0.4mm e tloaelehileng ho ea ho 0.2mm;boto e feto-fetohang ea lebelo le phahameng, e sebelisang substrate ea Dk e tlase le e tlase-Df polyimide, ho fihlela litlhoko tsa lebelo la phetisetso ea 5Gbps;e kholo Boto e feto-fetohang ea matla e sebelisa conductor e ka holimo ho 100μm ho finyella litlhoko tsa lipotoloho tse matla le tse phahameng;boto e feto-fetohang ea tšepe e thehiloeng mocheso o phahameng ke R-FPCB e sebelisang karoloana ea tšepe ea tšepe ka mokhoa o sa fellang;tactile flexible board ke khatello ea maikutlo Lera le electrode li kenngoa pakeng tsa lifilimi tse peli tsa polyimide ho etsa mochine o bonolo oa tactile;boto e tenyetsehang e otlolohileng kapa boto e thata-thata, substrate e tenyetsehang ke elastomer, 'me sebopeho sa mohala oa tšepe oa tšepe se ntlafatsoa hore se otlolle.Ehlile, li-FPCB tsena tse khethehileng li hloka li-substrates tse sa tloaelehang.

4.2 Litlhoko tsa elektronike tse hatisitsoeng

Lisebelisoa tsa elektronike tse hatisitsoeng li se li tsoetse pele lilemong tsa morao tjena, 'me ho hakanngoa hore bohareng ba lilemo tsa 2020, lisebelisoa tsa elektronike tse hatisitsoeng li tla ba le' maraka oa liranta tse fetang limilione tse likete tse 300 tsa US.Tšebeliso ea theknoloji ea elektronike e hatisitsoeng ho indasteri ea potoloho e hatisitsoeng ke karolo ea theknoloji ea potoloho e hatisitsoeng, e fetohileng tumellano ho indasteri.Theknoloji ea elektroniki e hatisitsoeng ke eona e haufi le FPCB.Hona joale baetsi ba PCB ba tsetelitse ho elektronike e hatisitsoeng.Ba ile ba qala ka liboto tse feto-fetohang le liboto tsa potoloho tse hatisitsoeng (PCB) ka li-circuits tsa elektronike tse hatisitsoeng (PEC).Hona joale, ho na le li-substrates tse ngata le lisebelisoa tsa enke, 'me hang ha ho e-na le katleho ea ts'ebetso le litšenyehelo, li tla sebelisoa haholo.Baetsi ba PCB ha baa lokela ho fetoa ke monyetla.

Ts'ebeliso ea hajoale ea lisebelisoa tsa elektroniki tse hatisitsoeng ke ho etsa li-tag tsa radio frequency identification (RFID) tse theko e tlase, tse ka hatisoang ka meqolo.Monyetla o libakeng tsa lipontšo tse hatisitsoeng, mabone, le li-organic photovoltaics.Mmaraka oa thekenoloji o ka roaloang hajoale ke 'maraka o motle o hlahang.Lihlahisoa tse fapaneng tsa theknoloji e ka aparoang, joalo ka liaparo tse bohlale le likhalase tsa lipapali tse bohlale, lisebelisoa tsa tšebetso, lisensara tsa boroko, lioache tse bohlale, li-headset tse ntlafalitsoeng, li-compass tsa ho tsamaea, joalo-joalo. lipotoloho tsa elektroniki tse hatisitsoeng.

Karolo ea bohlokoa ea theknoloji ea elektronike e hatisitsoeng ke lisebelisoa, ho kenyelletsa le li-substrates le li-inks tse sebetsang.Li-substrates tse feto-fetohang ha li loketse feela li-FPCB tse teng, empa hape le li-substrates tse phahameng tsa ts'ebetso.Hona joale, ho na le lisebelisoa tse phahameng tsa dielectric substrate tse entsoeng ka motsoako oa li-ceramics le li-polymer resin, hammoho le li-substrates tse nang le mocheso o phahameng, li-substrates tse nang le mocheso o tlaase le li-substrates tse bonaletsang tse se nang mebala., substrate e mosehla, joalo-joalo.

4 Lisebelisoa tsa elektronike tse feto-fetohang le tse hatisitsoeng le litlhoko tse ling

4.1 Litlhoko tsa boto tse feto-fetohang

The miniaturization le thinning ea thepa ea elektronike tla ke keng ea qojoa ho sebelisa palo e kholo ea flexible printed circuit boards (FPCB) and rigid-flex printed circuit boards (R-FPCB).Mmaraka oa lefats'e oa FPCB hajoale o hakanngoa hore o ka ba lidolara tse limilione tse likete tse 13, 'me sekhahla sa kholo ea selemo se lebelletsoe ho ba holimo ho feta sa li-PCB tse thata.

Ka ho atolosoa ha kopo, ntle le keketseho ea palo, ho tla ba le litlhoko tse ngata tse ncha tsa tshebetso.Lifilimi tsa Polyimide li fumaneha ka mebala e se nang 'mala le e pepeneneng, e tšoeu, e ntšo le e mosehla, 'me e na le mocheso o phahameng oa ho hanyetsa le thepa e tlaase ea CTE, e loketseng liketsahalo tse fapaneng.Li-substrates tsa lifilimi tsa polyester tse theko e tlaase le tsona lia fumaneha 'marakeng.Mathata a macha a ts'ebetso a kenyelletsa elasticity e phahameng, botsitso ba sebopeho, boleng ba sefahleho sa filimi, le khokahano ea photoelectric ea filimi le khanyetso ea tikoloho ho fihlela litlhoko tse lulang li fetoha tsa basebelisi ba ho qetela.

FPCB le liboto tse thata tsa HDI li tlameha ho fihlela litlhoko tsa phetisetso ea mats'oao a lebelo le phahameng.Tahlehelo ea kamehla ea dielectric le dielectric ea substrates e tenyetsehang le eona e tlameha ho lebisoa tlhokomelo ho eona.Polytetrafluoroethylene le substrates e tsoetseng pele ea polyimide li ka sebelisoa ho theha maemo a bonolo.Potoloho.Ho kenyelletsa phofo ea inorganic le carbon fiber filler ho resin ea polyimide ho ka hlahisa sebopeho sa mekhahlelo e meraro sa substrate e feto-fetohang ea thermally conductive.Li-filler tsa inorganic tse sebelisoang ke aluminium nitride (AlN), aluminium oxide (Al2O3) le hexagonal boron nitride (HBN).The substrate e na le 1.51W/mK thermal conductivity 'me e khona ho mamella 2.5kV mamella voltage le 180 degree ea ho kobeha teko.

Limmaraka tsa likopo tsa FPCB, joalo ka lifono tse bohlale, lisebelisoa tse aparoang, lisebelisoa tsa bongaka, liroboto, joalo-joalo, li hlahisitse litlhoko tse ncha mabapi le sebopeho sa ts'ebetso sa FPCB, 'me li hlahisitse lihlahisoa tse ncha tsa FPCB.Tse kang ultra-thin flexible multilayer board, FPCB ea mekhahlelo e mene e fokotsehile ho tloha ho 0.4mm e tloaelehileng ho ea ho 0.2mm;boto e feto-fetohang ea lebelo le phahameng, e sebelisang substrate ea Dk e tlase le e tlase-Df polyimide, ho fihlela litlhoko tsa lebelo la phetisetso ea 5Gbps;e kholo Boto e feto-fetohang ea matla e sebelisa conductor e ka holimo ho 100μm ho finyella litlhoko tsa lipotoloho tse matla le tse phahameng;boto e feto-fetohang ea tšepe e thehiloeng mocheso o phahameng ke R-FPCB e sebelisang karoloana ea tšepe ea tšepe ka mokhoa o sa fellang;tactile flexible board ke khatello ea maikutlo Lera le electrode li kenngoa pakeng tsa lifilimi tse peli tsa polyimide ho etsa mochine o bonolo oa tactile;boto e otlolohileng e tenyetsehang kapa boto e thata-thata, substrate e tenyetsehang ke elastomer, 'me sebopeho sa mohala oa tšepe oa tšepe se ntlafatsoa hore se otlolle.Ehlile, li-FPCB tsena tse khethehileng li hloka li-substrates tse sa tloaelehang.

4.2 Litlhoko tsa elektronike tse hatisitsoeng

Lisebelisoa tsa elektronike tse hatisitsoeng li se li tsoetse pele lilemong tsa morao tjena, 'me ho hakanngoa hore bohareng ba lilemo tsa 2020, lisebelisoa tsa elektronike tse hatisitsoeng li tla ba le' maraka oa liranta tse fetang limilione tse likete tse 300 tsa US.Tšebeliso ea theknoloji ea elektronike e hatisitsoeng ho indasteri ea potoloho e hatisitsoeng ke karolo ea theknoloji ea potoloho e hatisitsoeng, e fetohileng tumellano ho indasteri.Theknoloji ea elektroniki e hatisitsoeng ke eona e haufi le FPCB.Hona joale baetsi ba PCB ba tsetelitse ho elektronike e hatisitsoeng.Ba ile ba qala ka liboto tse tenyetsehang 'me ba nkela liboto tsa potoloho tse hatisitsoeng (PCB) sebaka ka li-circuits tsa elektronike tse hatisitsoeng (PEC).Hona joale, ho na le li-substrates tse ngata le lisebelisoa tsa enke, 'me hang ha ho e-na le katleho ea ts'ebetso le litšenyehelo, li tla sebelisoa haholo.Baetsi ba PCB ha baa lokela ho fetoa ke monyetla.

Ts'ebeliso ea hajoale ea lisebelisoa tsa elektroniki tse hatisitsoeng ke ho etsa li-tag tsa radio frequency identification (RFID) tse theko e tlase, tse ka hatisoang ka meqolo.Monyetla o libakeng tsa lipontšo tse hatisitsoeng, mabone, le li-organic photovoltaics.Mmaraka oa thekenoloji o ka roaloang hajoale ke 'maraka o motle o hlahang.Lihlahisoa tse fapaneng tsa theknoloji e ka aparoang, joalo ka liaparo tse bohlale le likhalase tsa lipapali tse bohlale, lisebelisoa tsa tšebetso, lisensara tsa boroko, lioache tse bohlale, li-headset tse ntlafalitsoeng, li-compass tsa ho tsamaea, joalo-joalo. lipotoloho tsa elektroniki tse hatisitsoeng.

Karolo ea bohlokoa ea theknoloji ea elektronike e hatisitsoeng ke lisebelisoa, ho kenyelletsa le li-substrates le li-inks tse sebetsang.Li-substrates tse feto-fetohang ha li loketse feela li-FPCB tse teng, empa hape le li-substrates tse phahameng tsa ts'ebetso.Hona joale, ho na le lisebelisoa tse phahameng tsa dielectric substrate tse entsoeng ka motsoako oa li-ceramics le li-polymer resin, hammoho le li-substrate tse nang le mocheso o phahameng, li-substrates tse nang le mocheso o tlaase le li-substrate tse se nang mebala tse hlakileng., Yellow substrate, joalo-joalo.