Litšobotsi tsa motheo tsa boto ea potoloho e hatisitsoeng li itšetlehile ka ts'ebetso ea boto ea substrate.Ho ntlafatsa ts'ebetso ea tekheniki ea boto ea potoloho e hatisitsoeng, ts'ebetso ea boto ea substrate e hatisitsoeng e tlameha ho ntlafatsoa pele.E le ho finyella litlhoko tsa nts'etsopele ea boto ea potoloho e hatisitsoeng, lisebelisoa tse ncha tse sa tšoaneng E ntse e ntlafatsoa butle-butle le ho sebelisoa.

Lilemong tsa morao tjena, 'maraka oa PCB o tlositse maikutlo ho tloha ho likhomphutha ho ea ho likhokahano, ho kenyeletsoa liteishene tsa mantlha, li-server le liteishene tsa mehala.Lisebelisoa tsa puisano tsa mehala tse emeloang ke li-smartphone li tsamaisitse li-PCB ho teteaneng ho hoholo, ho fokola, le ts'ebetso e phahameng.Theknoloji ea potoloho e hatisitsoeng ha e arohane le lisebelisoa tsa substrate, tse kenyeletsang litlhoko tsa tekheniki tsa li-substrates tsa PCB.Likahare tse amehang tsa thepa ea substrate joale li hlophisitsoe hore e be sengoloa se ikhethileng bakeng sa litšupiso tsa indasteri.

1 Tlhokahalo ea li-high-density le line-line

1.1 Tlhokahalo ea foil ea koporo

Li-PCB kaofela li ntse li tsoela pele ho ea ho nts'etsopele ea sekhahla se phahameng le se tšesaane, 'me liboto tsa HDI li hlahella ka ho khetheha.Lilemong tse leshome tse fetileng, IPC e hlalositse boto ea HDI e le bophara ba mela/sekheo sa mela (L/S) ea 0.1mm/0.1mm le ka tlase.Hona joale indasteri ha e le hantle e finyella L / S e tloaelehileng ea 60μm, le L / S e tsoetseng pele ea 40μm.Japane 2013 phetolelo ea ho instola tse thekenoloji ya data roadmap ke hore ka 2014, e tloaelehileng L/S ea HDI boto e ne e le 50μm, e tsoetseng pele L/S ne 35μm, le teko-hlahiswa L/S ne 20μm.

PCB potoloho sebopeho sebopeho, mokhoa o tloaelehileng oa lik'hemik'hale etching (mokhoa subtractive) ka mor'a hore photoimaging ka koporo foil substrate, bonyane moedi oa subtractive mokhoa bakeng sa ho etsa mela e metle ke hoo e ka bang 30μm, 'me tšesaane koporo foil (9 ~ 12μm) substrate ho hlokahala .Ka lebaka la theko e phahameng ea foil e tšesaane ea koporo ea CCL le mefokolo e mengata ea foil ea koporo e tšesaane, lifeme tse ngata li hlahisa foil ea koporo ea 18μm ebe li sebelisa etching ho tšesaane lera la koporo nakong ea tlhahiso.Mokhoa ona o na le mekhoa e mengata, taolo e thata ea botenya, le litšenyehelo tse phahameng.Ho molemo ho sebelisa foil e nyenyane ea koporo.Ho phaella moo, ha PCB ea potoloho L/S e ka tlaase ho 20μm, foil e tšesaane ea koporo hangata e thata ho sebetsana le eona.E hloka foil ea koporo e tšesaane haholo (3 ~ 5μm) le pampiri ea koporo e tšesaane haholo e khomaretsoeng ho sejari.

Ho phaella ho li-foil tse nyenyane tsa koporo, mela e metle ea hona joale e hloka hore ho be le boima bo tlaase holim'a sefahleho sa koporo.Ka kakaretso, e le ho ntlafatsa matla a maqhama pakeng tsa foil ea koporo le substrate le ho etsa bonnete ba hore mokhanni o ebola matla, lera la koporo le entsoe ka thata.Bokhopo ba foil e tloaelehileng ea koporo e kholo ho feta 5μm.Ho kenngoa ha litlhōrō tsa litlhōrō tsa koporo ka har'a substrate ho ntlafatsa khanyetso ea peeling, empa e le ho laola ho nepahala ha terata nakong ea etching ea mohala, ho bonolo ho boloka litlhōrō tsa substrate li ntse li le teng, tse bakang lipotoloho tse khutšoanyane pakeng tsa mela kapa ho fokotseha ha mocheso. , e leng ea bohlokoa haholo bakeng sa mela e metle.Mohala o tebile ka ho khetheha.Ka hona, li-foil tsa koporo tse nang le mahlahahlaha a tlaase (tlase ho 3 μm) esita le ho fokotseha ho tlase (1.5 μm) hoa hlokahala.

1.2 Tlhokahalo ea lishiti tsa dielectric tsa laminated

Tšobotsi ea botekgeniki ea boto ea HDI ke hore mokhoa oa ho haha ​​​​(BuildingUpProcess), foil ea koporo e entsoeng ka resin-coated (RCC), kapa lesela la laminated ea lesela la khalase ea epoxy le foil ea koporo ho thata ho fihlella mela e metle.Hajoale, mokhoa oa semi-additive (SAP) kapa mokhoa o ntlafalitsoeng oa semi-processed (MSAP) o atisa ho amoheloa, ke hore, filimi ea dielectric e sireletsang e sebelisoa bakeng sa stacking, ebe ho sebelisoa koporo e se nang electroless ho etsa koporo. lera la conductor.Kaha lera la koporo le tšesaane haholo, ho bonolo ho etsa mela e metle.

E 'ngoe ea lintlha tsa bohlokoa tsa mokhoa oa semi-additive ke lisebelisoa tsa laminated dielectric.E le hore u finyelle litlhoko tsa mela e metle e phahameng, lisebelisoa tsa laminated li beha litlhoko tsa thepa ea motlakase ea dielectric, ho pata, ho hanyetsa mocheso, matla a ho kopanya, joalo-joalo, hammoho le mokhoa oa ho ikamahanya le maemo oa boto ea HDI.Hona joale, lihlahisoa tsa machaba tsa HDI laminated media haholo-holo lihlahisoa tsa ABF / GX tsa Japane Ajinomoto Company, tse sebelisang resin ea epoxy le mahlahana a fapaneng a pheko ho eketsa phofo ea inorganic ho ntlafatsa ho tiea ha thepa le ho fokotsa CTE, le lesela la fiber ea khalase. e boetse e sebelisoa ho eketsa boima ba 'mele..Ho boetse ho na le lisebelisoa tse tšoanang tsa filimi e tšesaane ea Sekisui Chemical Company ea Japane, 'me Setsi sa Patlisiso ea Theknoloji ea Taiwan le sona se hlahisitse lisebelisoa tse joalo.Lisebelisoa tsa ABF le tsona li ntlafatsoa le ho ntlafatsoa khafetsa.Moloko o mocha oa lisebelisoa tse entsoeng ka laminated haholo-holo o hloka ho fokotseha ha holimo holimo, katoloso e tlase ea mocheso, tahlehelo e tlase ea dielectric, le ho matlafatsa ka thata.

Ka har'a sephutheloana sa semiconductor ea lefats'e, li-substrate tsa IC tsa ho paka li nkile sebaka sa li-ceramic substrates ka li-organic substrates.Bophahamo ba liphutheloana tsa liphutheloana tsa flip chip (FC) bo ntse bo fokotseha.Hona joale bophara ba mela e tloaelehileng / sebaka sa mela ke 15μm, 'me e tla ba mosesaane nakong e tlang.Ts'ebetso ea mochini o nang le likarolo tse ngata haholo e hloka thepa e tlase ea dielectric, coefficient e tlase ea katoloso ea mocheso le ho hanyetsa mocheso o phahameng, le ho lelekisa li-substrates tse theko e tlase motheong oa ho fihlela sepheo sa ts'ebetso.Hajoale, tlhahiso e kholo ea lipotoloho tse ntle e amohela mokhoa oa MSPA oa ho kenya laminated le foil e nyane ea koporo.Sebelisa mokhoa oa SAP ho etsa lipaterone tsa potoloho ka L/S ka tlase ho 10μm.

Ha li-PCB li fetoha tse teteaneng le tse tšesaane, theknoloji ea HDI ea boto e fetohile ho tloha ho li-laminates tse nang le coreless ho ea ho li-laminate tsa ho kopanya tsa Anylayer (Anylayer).Leha e le efe lera interconnection laminate HDI mapolanka a nang le mosebetsi o tšoanang molemo ho feta konokono e nang le mapolanka HDI HDI.Sebaka le botenya bo ka fokotsoa ka hoo e ka bang 25%.Tsena li tlameha ho sebelisa tse tšesaane le ho boloka thepa e ntle ea motlakase ea lera la dielectric.

2 Maqhubu a phahameng le tlhokeho ea lebelo le holimo

Theknoloji ea puisano ea elektronike e tloha ho tse nang le mehala ho ea ho waelese, ho tloha ho maqhubu a tlaase le lebelo le tlaase ho ea ho maqhubu a phahameng le lebelo le phahameng.Ts'ebetso ea hajoale ea mohala oa thekeng e kene ho 4G mme e tla fetela ho 5G, ke hore, lebelo la phetisetso le lebelo le leholo la phetisetso.Ho fihla ha nako ea lefats'e ea cloud computing ho imenne habeli sephethephethe sa data, 'me lisebelisoa tsa puisano tse phahameng le tse potlakileng ke mokhoa o ke keng oa qojoa.PCB e loketse phetiso ea maqhubu a holimo le lebelo le holimo.Ntle le ho fokotsa tšitiso ea matšoao le tahlehelo ea moralo oa potoloho, ho boloka botsitso ba matšoao, le ho boloka tlhahiso ea PCB ho fihlela litlhoko tsa moralo, ho bohlokoa ho ba le substrate e sebetsang hantle.

E le ho rarolla bothata ba PCB e eketsa lebelo le botšepehi ba pontšo, baenjiniere ba meralo ba shebana haholo le thepa ea tahlehelo ea lets'oao la motlakase.Lintlha tse ka sehloohong tsa khetho ea substrate ke dielectric constant (Dk) le tahlehelo ea dielectric (Df).Ha Dk a le tlase ho 4 le Df0.010, ke Dk/Df laminate ea mahareng, ha Dk a le tlase ho 3.7 ha Df0.005 e le tlase, ke li-laminate tsa Dr/Df grade, joale ho na le mefuta e fapaneng ea substrates. ho kena mmarakeng ho khetha.

Hajoale, li-substrates tsa boto ea potoloho ea maqhubu a phahameng haholo ke li-resin tse thehiloeng ho fluorine, li-polyphenylene ether (PPO kapa PPE) le li-epoxy resin tse fetotsoeng.Li-dielectric substrates tse thehiloeng ho fluorine, joalo ka polytetrafluoroethylene (PTFE), li na le thepa e tlase ea dielectric mme hangata li sebelisoa ka holimo ho 5 GHz.Ho boetse ho na le li-substrates tsa epoxy FR-4 kapa PPO tse fetotsoeng.

Ho phaella ho resin e boletsoeng ka holimo le lisebelisoa tse ling tse sireletsang holim'a metsi, sekhahla sa holim'a metsi (profile) ea koporo ea conductor le eona ke ntho ea bohlokoa e amang tahlehelo ea phetisetso ea matšoao, e amehang ke phello ea letlalo (SkinEffect).Phello ea letlalo ke motlakase oa motlakase o hlahisoang ka terata nakong ea phetisetso ea matšoao a phahameng-frequency, 'me inductance e kholo bohareng ba karolo ea terata, e le hore hona joale kapa pontšo e atisa ho tsepamisa mohopolo holim'a terata.Bokaholimo ba mokhanni bo ama tahlehelo ea lets'oao la phetisetso, 'me tahlehelo ea bokaholimo bo boreleli e nyane.

Ka nako e ts'oanang, ho thatafala ha bokaholimo ba koporo, ho na le tahlehelo e kholo ea pontšo.Ka hona, ka tlhahiso ea sebele, re leka ho laola botenya ba bokaholimo ba koporo ka hohle kamoo ho ka khonehang.The roughness ke e nyenyane kamoo ho ka khonehang ntle le ho ama matla a tlamahano.Haholo-holo bakeng sa matšoao a marang-rang a ka holimo ho 10 GHz.Ho 10GHz, ho thatafala ha foil ea koporo ho hloka ho ba ka tlase ho 1μm, 'me ho molemo ho sebelisa foil ea koporo e holimo-limo (bokhopo ba 0.04μm).Bokaholimo ba foil ea koporo bo boetse bo hloka ho kopanngoa le kalafo e loketseng ea oxidation le sistimi ea bonding ea resin.Haufinyane, ho tla ba le foil ea koporo e koahetsoeng ka resin e batlang e se na kemiso, e ka bang le matla a phahameng a peel 'me e ke ke ea ama tahlehelo ea dielectric.