Mokhoa oa ho etsa PCB e phahameng ka nepo?

Boto ea potoloho e nepahetseng e bua ka tšebeliso ea bophara ba mela e metle / sebaka, likoti tse nyenyane, bophara bo fokolang ba selikalikoe (kapa ha ho na bophara ba selikalikoe) le likoti tse patiloeng le tse foufetseng ho finyella boima bo phahameng.

Ho nepahala ho phahameng ho bolela hore sephetho sa "tse ntle, tse nyane, tse tšesaane le tse tšesaane" li tla lebisa litlhoko tse phahameng tsa ho nepahala. Nka bophara ba mola e le mohlala:

0.20mm bophara ba mola, 0.16~0.24mm e hlahisoang ho latela melao ea tsamaiso e tšoaneleha, 'me phoso ke (0.20±0.04) mm; ha bophara ba mohala oa 0.10mm, phoso ke (0.1 ± 0.02) mm, ho hlakile hore ho nepahala ha ho qetela ho eketsoa ka ntlha ea 1, joalo-joalo ha ho thata ho utloisisa, kahoo litlhoko tse phahameng tsa ho nepahala li ke ke tsa tšohloa. ka thoko. Empa ke bothata bo hlahelletseng theknolojing ea tlhahiso.

Theknoloji ea terata e nyenyane le e teteaneng

Nakong e tlang, bophara ba mela e phahameng e tla tloha ho 0.20mm-0.13mm-0.08mm-0.005mm ho fihlela litlhoko tsa SMT le liphutheloana tsa li-multi-chip (Mulitichip Package, MCP). Ka hona, theknoloji e latelang ea hlokahala.
①Substrate

Ho sebelisa foil e tšesaane kapa e tšesaane haholo ea koporo (<18um) substrate le theknoloji e ntle ea kalafo ea holim'a metsi.
②Ts'ebetso

Ho sebelisa filimi e omeletseng e mosesaane le mokhoa oa ho peista o kolobileng, filimi e ommeng e tšesaane le e ntle e ka fokotsa ho sotha ha mela le mefokolo. Filimi e metsi e ka tlatsa likheo tse nyane tsa moea, ea eketsa khokahano ea sehokelo, 'me ea ntlafatsa botšepehi ba terata le ho nepahala.
③Electrodeposited photoresist filimi

Electro-deposited Photoresist (ED) e sebelisoa. Botenya ba eona bo ka laoloa ho tloha ho 5-30 / umm, 'me e ka hlahisa lithapo tse ntle tse phethahetseng haholoanyane. E loketse ka ho khetheha bakeng sa bophara bo moqotetsane ba lesale, ha ho na bophara ba lesale le electroplating e tletseng poleiti. Hajoale, ho na le mela e fetang leshome ea tlhahiso ea ED lefatšeng.
④ Theknoloji ea ho pepeseha mabone a tšoanang

Ho sebelisa theknoloji ea ho pepeseha ha mabone a bapileng. Kaha khanya e ts'oanang ea khanya e ka hlōla tšusumetso ea phapang ea bophara ba mela e bakoang ke mahlaseli a oblique a mohloli o khanyang oa "point", terata e ntle e nang le boholo bo nepahetseng ba bophara ba mela le metse e boreleli e ka fumanoa. Leha ho le joalo, lisebelisoa tsa ho pepeseha tse tšoanang li theko e boima, matsete a holimo, 'me ho hlokahala ho sebetsa sebakeng se hloekileng haholo.
⑤Theknoloji ea ho hlahloba ka mokhoa o itekanetseng

Ho sebelisa theknoloji ea tlhahlobo ea optical ea othomathike. Theknoloji ena e fetohile mokhoa oa bohlokoa oa ho lemoha ha ho etsoa lithapo tse ntle, 'me e ntse e khothaletsoa ka potlako, e sebelisoa le ho ntlafatsoa.

EDA365 Foramo ea Elektronike

 

Theknoloji ea microporous

 

 

Likoti tse sebetsang tsa mapolanka a hatisitsoeng a sebelisetsoang ho phahamisa holim'a theknoloji ea microporous li sebelisoa haholo-holo bakeng sa ho hokahanya ha motlakase, e leng se etsang hore tšebeliso ea theknoloji ea microporous e be ea bohlokoa haholo. Ho sebelisa lisebelisoa tse tloaelehileng tsa ho cheka le mechini ea ho cheka ea CNC ho hlahisa masoba a manyane ho na le liphoso tse ngata le litšenyehelo tse phahameng.

Ka hona, boholo bo phahameng ba mapolanka a hatisitsoeng bo lebisitsoe haholo ho ntlafatso ea lithapo le liphahlo. Le hoja liphello tse kholo li fihletsoe, bokhoni ba eona bo lekanyelitsoe. Ho ntlafatsa ho feta tekano (joalo ka mehala e ka tlase ho 0.08mm), litšenyehelo li ntse li phahama. , Kahoo retelehela ho sebelisa li-micropores ho ntlafatsa densification.

Lilemong tsa morao tjena, mechine ea ho cheka palo le theknoloji ea micro-drill e entse tsoelo-pele, 'me kahoo theknoloji ea micro-hole e tsoetse pele ka potlako. Ena ke karolo e ka sehloohong e hlahelletseng tlhahisong ea hajoale ea PCB.

Nakong e tlang, theknoloji ea ho etsa likoti tse nyane haholo e tla itšetleha haholo ka mechini e tsoetseng pele ea ho cheka ea CNC le li-micro-heads tse ntle haholo, 'me likoti tse nyane tse entsoeng ka theknoloji ea laser li ntse li le tlase ho tse entsoeng ke mechini ea ho phunya ea CNC ho latela theko le boleng ba sekoti. .
① mochini oa ho cheka oa CNC

Hona joale, theknoloji ea mochine oa ho cheka oa CNC e entse tsoelo-pele e ncha le tsoelo-pele. Mme e thehile moloko o mocha oa mochini oa ho cheka oa CNC o khetholloang ka ho phunya masoba a manyane.

Bokhoni ba ho cheka likoti tse nyenyane (tse ka tlaase ho 0.50mm) tsa mochine oa ho phunya micro-hole ke makhetlo a 1 ho feta mochine o tloaelehileng oa ho phunya CNC, o nang le mefokolo e fokolang, 'me lebelo la ho potoloha ke 11-15r / min; e ka phunya masoba a manyane a 0.1-0.2mm, e sebelisa cobalt e batlang e phahame. Karolo e nyane ea boleng bo holimo e ka cheka lipoleiti tse tharo (1.6mm/block) tse phuthetsoeng ka holim'a tse ling. Ha karolo ea ho phunya e robehile, e ka ema 'me ea tlaleha boemo ka bo eona, ea nkela sebaka sa ho phunya le ho hlahloba bophara ba eona (laebrari ea lisebelisoa e ka tšoara likotoana tse makholo),' me e khona ho laola sebaka se sa khaotseng pakeng tsa ntlha ea ho phunya le sekoahelo. le botebo ba ho phunya, kahoo likoti tse foufetseng li ka phunngoa , E ke ke ea senya countertop. Bokaholimo ba tafole ea mochini oa ho phunya oa CNC o amohela mosamo oa moea le mofuta oa "magnetic levitation", o ka tsamaeang kapele, o bobebe le o nepahetseng ntle le ho hoa tafole.

Mechini e joalo ea ho cheka e ntse e batloa hajoale, joalo ka Mega 4600 e tsoang Prurite Italy, letoto la Excellon 2000 United States, le lihlahisoa tse ncha tsa Switzerland le Jeremane.
②Ho cheka ka laser

Ho na le mathata a mangata ka mechini e tloaelehileng ea ho cheka ea CNC le likotoana tsa ho phunya masoba a manyane. E sitisitse tsoelopele ea thekenoloji ea micro-hole, kahoo ablation ea laser e hohetse tlhokomelo, lipatlisiso le ts'ebeliso.

Empa ho na le bofokoli bo bolaeang, ke hore, ho thehoa ha lesoba la lenaka, le fetohang le leholo le ho feta ha botenya ba poleiti bo ntse bo eketseha. Ho kopantsoe le tšilafalo e phahameng ea mocheso (haholo-holo liboto tse ngata), bophelo le tlhokomelo ea mohloli oa leseli, ho pheta-pheta ha masoba a kutu, le litšenyehelo, ho phahamisa le ho sebelisoa ha li-micro-holes tlhahiso ea liboto tse hatisitsoeng li thibetsoe. . Leha ho le joalo, laser ablation e ntse e sebelisoa lipoleiting tsa microporous tse tšesaane le tse phahameng haholo, haholo ho theknoloji ea MCM-L high-density interconnect (HDI), joalo ka polyester film etching le metal deposition ho MCMs. (Theknoloji ea Sputtering) e sebelisoa ka har'a khokahanyo e kopantsoeng ea high-density interconnection.

Sebopeho sa vias patoa ka phahameng segokanyipalo interconnect mapolanka multilayer le patoa le foufetseng ka mehaho e ka boela sebelisoa. Leha ho le joalo, ka lebaka la tsoelo-pele le tsoelo-pele ea theknoloji ea mechine ea ho cheka ea CNC le li-micro-drill, li ile tsa khothaletsoa ka potlako le ho sebelisoa. Ka hona, ts'ebeliso ea ho phunya laser ka holim'a liboto tsa potoloho ea holim'a thaba e ke ke ea theha boemo bo ka sehloohong. Empa e ntse e na le sebaka tšimong e itseng.

 

③ Theknoloji e patiloeng, e foufetseng, le ea ho phunyeletsa

Theknoloji ea ho patoa, e foufetseng, le ea ho kopanya likoti ke mokhoa oa bohlokoa oa ho eketsa bongata ba lipotoloho tse hatisitsoeng. Ka kakaretso, likoti tse patiloeng le tse foufetseng ke masoba a manyenyane. Ntle le ho eketsa palo ea lithapo holim'a boto, likoti tse patiloeng le tse foufetseng li kopantsoe ke "haufi" lera le ka hare, le fokotsang haholo palo ea ka likoti tse entsoeng, 'me sebaka sa ho itšehla thajana sa disk se tla fokotsa haholo, kahoo se eketsa palo ea lithapo tse sebetsang hantle le li-inter-layer interconnection botong, le ho ntlafatsa matla a khokahanyo.

Ka hona, boto e nang le li-multi-layer e nang le motsoako oa likoti tse patiloeng, tse foufetseng, le ka-ho-ho-ho na le bonyane makhetlo a 3 a phahameng a hokahaneng ho feta sebopeho sa boto e tloaelehileng ka tlas'a boholo bo lekanang le palo ea lihlopha. Haeba ho patoa, ho foufetse, boholo ba mapolanka a hatisitsoeng a kopantsoe le ka mekoting e tla fokotseha haholo kapa palo ea lihlopha e tla fokotseha haholo.

Ka hona, ka mapolanka a hatisitsoeng a holimo-limo a holimo-limo, theknoloji e patiloeng le e foufetseng e 'nile ea sebelisoa ka ho eketsehileng, eseng feela ka liboto tse hatisitsoeng holim'a lik'homphieutha tse kholo, lisebelisoa tsa puisano, joalo-joalo, empa hape le lits'ebetsong tsa sechaba le tsa indasteri. E boetse e sebelisoa haholo tšimong, esita le libotong tse ling tse tšesaane, tse kang likarete tsa PCMCIA, Smart, IC le liboto tse ling tse tšesaane tse nang le likarolo tse tšeletseng.

Liboto tsa potoloho tse hatisitsoeng tse nang le meaho ea likoti tse patiloeng le tse foufetseng hangata li phethoa ka mekhoa ea tlhahiso ea "sub-board", e bolelang hore li tlameha ho phethoa ka ho penya ka makhetlo a mangata, ho phunya le ho phunya likoti, kahoo ho beha maemo ho bohlokoa haholo.