PCB aluminium substrate na le mabitso a mangata, aluminium cladding, aluminium PCB, tšepe clad hatisitsoeng potoloho boto (MCPCB), thermally conductive PCB, joalo-joalo Molemo oa PCB aluminium substrate ke hore mocheso dissipation ke haholo molemo ho feta FR-4 sebopeho se tloaelehileng, 'me dielectric e sebelisoang hangata Ke makhetlo a 5 ho isa ho a 10 mocheso oa mocheso oa khalase e tloaelehileng ea epoxy,' me index ea mocheso oa karolo ea leshome ea botenya e sebetsa hantle ho feta PCB ea setso e thata. Ha re utloisise mefuta ea li-substrates tsa aluminium tsa PCB tse ka tlase.
1. Flexible aluminium substrate
E 'ngoe ea lintlafatso tsa morao-rao ho thepa ea IMS ke li-dielectric tse feto-fetohang. Lisebelisoa tsena li ka fana ka tšireletso e ntle ea motlakase, ho feto-fetoha ha maemo le ho tsamaisa mocheso. Ha e sebelisoa ho lisebelisoa tsa aluminium tse tenyetsehang tse kang 5754 kapa tse ling tse joalo, lihlahisoa li ka thehoa ho finyella libopeho le li-angles tse sa tšoaneng, tse ka felisang lisebelisoa tse theko e boima tsa ho lokisa, lithapo le lihokelo. Le hoja lisebelisoa tsena li tenyetseha, li etselitsoe ho kobeha sebakeng le ho lula li le teng.
2. Motsoako oa aluminium aluminium substrate
Ka sebopeho sa "hybrid" IMS, "likaroloana tse nyane" tsa lintho tse se nang mocheso li sebetsoa ka boithaopo, ebe li-PCB tsa Amitron Hybrid IMS li tlamahanngoa le substrate ea aluminium ka thepa ea mocheso. Sebopeho se tloaelehileng ka ho fetisisa ke 2-layer kapa 4-layer subassembly e entsoeng ka setso sa FR-4, e ka kopanngoang le substrate ea aluminium e nang le thermoelectric ho thusa ho felisa mocheso, ho eketsa ho tiea, le ho sebetsa e le thebe. Melemo e meng e kenyelletsa:
1. Theko e tlaase ho feta lisebelisoa tsohle tse tsamaisang mocheso.
2. Fana ka ts'ebetso e ntle ea mocheso ho feta lihlahisoa tse tloaelehileng tsa FR-4.
3. Licheso tsa mocheso tse theko e boima le mehato e amanang le kopano li ka felisoa.
4. E ka sebelisoa lits'ebetsong tsa RF tse hlokang litšobotsi tsa tahlehelo tsa RF tsa PTFE top layer.
5. Sebelisa lifensetere tsa karolo ka aluminium ho amohela likarolo tsa lesoba, tse lumellang likhokahano le likhoele hore li fete sehokelo ka substrate ha u ntse u tjheseletsa likhutlong tse chitja ho theha tiiso ntle le tlhokahalo ea li-gaskets tse khethehileng kapa li-adapter tse ling tse theko e boima.
Tse tharo, substrate ea aluminium ea multilayer
Mmarakeng oa phepelo ea motlakase o sebetsang hantle, li-PCB tsa IMS tse ngata li entsoe ka li-dielectric tsa multilayer thermally conductive. Meaho ena e na le mekhahlelo e le 'ngoe kapa ho feta ea lipotoloho tse patiloeng ka har'a dielectric,' me li-vias tse foufetseng li sebelisoa e le litsela tsa mocheso kapa litsela tsa pontšo. Le hoja meralo ea lera le le leng e theko e boima haholo ebile e sa sebetse hantle ho fetisa mocheso, e fana ka tharollo e bonolo le e sebetsang ea ho pholisa bakeng sa meralo e rarahaneng.
Tse 'ne, substrate ea aluminium ka lesoba
Sebakeng se rarahaneng ka ho fetisisa, lera la aluminium le ka etsa "mokono" oa mohaho oa mocheso oa multilayer. Pele ho lamination, aluminium e electroplated 'me e tlatsitsoe ka dielectric esale pele. Lisebelisoa tsa mocheso kapa likaroloana tse nyenyane li ka etsoa laminated mahlakoreng ka bobeli a aluminium ho sebelisa thepa ea ho khomarela mocheso. Hang ha laminated, kopano e phethiloeng e tšoana le substrate e tloaelehileng ea aluminium ea multilayer ka ho cheka. Polated ka masoba feta ka likheo ka aluminium ho boloka ho insured motlakase. Ntle le moo, mokokotlo oa koporo o ka lumella khokahanyo e tobileng ea motlakase le li-vias tsa insulating.