1. Sekoti

Pinhole e bakoa ke ho kenngoa ha khase ea hydrogen holim'a likarolo tse pentiloeng, tse ke keng tsa lokolloa nako e telele. Tharollo ea plating e ke ke ea kolobisa bokaholimo ba likarolo tse pentiloeng, e le hore sekhahla sa plating sa electrolytic se ke ke sa hlahlojoa ka mokhoa oa electrolytically. Ha botenya ba ho roala bo ntse bo eketseha sebakeng se potolohileng ntlha ea ho iphetola ha haedrojene, ho thehoa sekoti sebakeng sa ho iphetola ha hydrogen. E khetholloa ka lesoba le chitja le benyang mme ka nako e 'ngoe e le mohatla o monyane o otlolohileng. Ha ho na le khaello ea sesebelisoa sa ho koloba ka har'a tharollo ea plating 'me boima ba hona joale bo phahame, li-pinholes li bonolo ho theha.

2. Pitting

Li-pockmarks li bakoa ke hore bokaholimo bo koahetsoeng ha bo hloeke, ho na le lintho tse tiileng tse adsorbed, kapa lintho tse tiileng li emisitsoe ka har'a tharollo ea plating. Ha ba fihla ka holim'a workpiece tlas'a ketso ea tšimo ea motlakase, ba adsorbed ho eona, e amang electrolysis. Lintho tsena tse tiileng li kenngoa ka har'a Lera la electroplating, li-bumps tse nyenyane (li-dumps) li thehoa. Tšobotsi ke hore e convex, ha ho na ketsahalo e khanyang, 'me ha ho na sebopeho se tsitsitseng. Ka bokhutšoanyane, e bakoa ke workpiece e litšila le tharollo e litšila ea plating.

3. Methapo ea phallo ea moea

Li-streaks tsa moea li bakoa ke li-additives tse feteletseng kapa li-cathode tse phahameng tsa hona joale kapa li-complexing agent, tse fokotsang katleho ea hona joale ea cathode 'me e fella ka palo e kholo ea hydrogen evolution. Haeba tharollo ea plating e phalla butle-butle 'me cathode e tsamaea butle-butle, khase ea hydrogen e ne e tla ama tlhophiso ea likristale tsa electrolytic nakong ea ts'ebetso ea ho phahama khahlanong le holim'a workpiece, ho etsa metsero ea moea ho tloha tlase ho ea holimo.

4. Ho roala maske (ka tlase ho pepesitsoe)

Ho roala maske ho bakoa ke taba ea hore khanya e bonolo sebakeng sa pini e holim'a sebaka sa mosebetsi ha e e-s'o tlosoe, 'me seaparo sa electrolytic deposition se ke ke sa etsoa mona. Thepa ea motheo e ka bonoa ka mor'a electroplating, kahoo e bitsoa ho pepeseha tlase (hobane lebone le bonolo ke karolo ea resin e translucent kapa e hlakileng).

5. Ho roala brittleness

Ka mor'a hore SMD electroplating le ho itšeha le ho theha, ho ka bonoa hore ho na le ho phunyeha ha mokokotlo oa pini. Ha ho na le lekhalo pakeng tsa lera la nickel le substrate, ho ahloloa hore lera la nickel le brittle. Ha ho e-na le lekhalo pakeng tsa lesela la thini le lesela la nickel, ho lekoa hore lesela la thini le brittle. Bongata ba lisosa tsa brittleness ke li-additives, likhantši tse feteletseng, kapa litšila tse ngata haholo tsa tlhaho le tsa manyolo ka har'a tharollo ea plating.