Aluminium substrate ke tšepe e entsoeng ka koporo e nang le laminate e nang le mosebetsi o motle oa ho senya mocheso. Ke thepa e kang poleiti e entsoeng ka lesela la khalase ea elektronike kapa lisebelisoa tse ling tse matlafatsang tse kenngoeng ka resin, resin e le 'ngoe, joalo-joalo e le sekhomaretsi sa sekhomaretsi, se koahetsoeng ka foil ea koporo mahlakoreng a le mong kapa ka bobeli le ho hatelloa ka ho chesa, ho thoeng ke aluminium- e thehiloeng koporo-clad plate . Kangxin Circuit e hlahisa ts'ebetso ea substrate ea aluminium le kalafo ea bokaholimo ba lisebelisoa.
Ts'ebetso ea substrate ea aluminium
1.Ts'ebetso e ntle ea ho senya mocheso
Lipoleiti tse entsoeng ka koporo tse entsoeng ka aluminium li na le ts'ebetso e babatsehang ea ho senya mocheso, e leng tšobotsi e hlaheletseng ea mofuta ona oa poleiti. PCB e entsoeng ka eona e ke ke ea thibela ka katleho mocheso o sebetsang oa likarolo le li-substrates tse jereng ho eona hore li se ke tsa phahama, empa hape le mocheso o potlakileng o hlahisoang ke likarolo tsa amplifier ea matla, likarolo tse matla tsa matla, li-switches tse kholo tsa potoloho le likarolo tse ling. E boetse e ajoa ka lebaka la boima ba eona bo bonyenyane, boima bo bobebe (2.7g / cm3), anti-oxidation, le theko e tlaase, kahoo e fetohile e ngata ka ho fetisisa le e kholo ka ho fetisisa ea lakane e entsoeng ka li-laminates tsa koporo tse entsoeng ka tšepe. The saturated thermal resistance of the insulated aluminium substrate ke 1.10 ℃/W mme thermal resistance ke 2.8℃/W, e leng ho ntlafatsang haholo ho kopanya ha terata ea koporo.
2.Ntlafatsa katleho le boleng ba machining
Li-laminates tse entsoeng ka koporo tse entsoeng ka aluminium li na le matla a phahameng a mochine le ho tiea, tse molemo haholo ho feta li-laminate tse entsoeng ka koporo tse entsoeng ka resin le li-substrates tsa ceramic. E khona ho hlokomela ho etsoa ha liboto tse hatisitsoeng sebakeng se seholo holim'a li-substrates tsa tšepe, 'me e loketse ka ho khetheha bakeng sa ho kenya likarolo tse boima holim'a li-substrates tse joalo. Ho phaella moo, substrate ea aluminium e boetse e na le flatness e ntle, 'me e ka bokelloa le ho sebetsoa holim'a substrate ka hammering, riveting, joalo-joalo kapa e kobehile le ho sotheha hammoho le karolo e seng ea wiring ho PCB e entsoeng ka eona, ha resin ea setso- e thehiloeng koporo clad laminate ke ke.
3.High dimensional botsitso
Bakeng sa tse fapa-fapaneng koporo clad laminates, ho na le bothata ba katoloso ea mocheso (dimensional botsitso), haholo-holo katoloso ea mocheso ka tataiso botenya (Z-axis) ea boto, e leng ama boleng ba masoba metallized le wiring. Lebaka le ka sehloohong ke hore li-coefficients tsa katoloso ea linear tsa lipoleiti li fapane, tse kang koporo, le coefficient ea ho atolosa linear ea epoxy glass fiber cloth substrate ke 3. Katoloso ea mela ea tse peli e fapane haholo, e leng bonolo ho baka Phapang ka ho atolosoa ha mocheso oa substrate, ho etsa hore potoloho ea koporo le lesoba la metallized le robehe kapa le senyehe. Mohala oa katoloso ea karoloana ea aluminium substrate e pakeng tsa, e nyane haholo ho feta substrate e akaretsang ea resin, mme e haufi le mohala oa katoloso ea mohala oa koporo, o loketseng ho netefatsa boleng le ts'epahalo ea potoloho e hatisitsoeng.
Phekolo ea bokaholimo ba thepa ea aluminium substrate
1. Deoiling
Bokaholimo ba poleiti e entsoeng ka aluminium e koahetsoe ka lera la oli nakong ea ts'ebetso le lipalangoang, 'me e tlameha ho hloekisoa pele e sebelisoa. Molao-motheo ke ho sebelisa peterole (peterole e akaretsang ea sefofane) e le sehlaseli, se ka qhibilihang, ebe se sebelisa sesebelisoa sa ho hloekisa se nang le metsi ho tlosa litšila tsa oli. Hlatsoa bokaholimo ka metsi a phallang ho etsa hore bo hloeke ebile bo se na marotholi a metsi.
2. Fokotsa
Substrate ea aluminium ka mor'a phekolo e ka holimo e ntse e e-na le mafura a sa tlosoang holim'a metsi. Ho e tlosa ka ho feletseng, e kolobise ka alkali sodium hydroxide e matla ho 50 ° C metsotso e 5, ebe o hlatsoa ka metsi a hloekileng.
3. Etching ea alkaline. Bokaholimo ba poleiti ea aluminium joalo ka thepa ea motheo e lokela ho ba le bofokoli bo itseng. Kaha substrate ea aluminium le lera la filimi ea aluminium oxide e holim'a metsi ke lisebelisoa tsa amphoteric ka bobeli, bokaholimo ba lisebelisoa tsa motheo tsa aluminium bo ka senyeha ka ho sebelisa sistimi ea asiti, ea alkaline kapa e kopaneng ea alkaline. Ntle le moo, lintho tse ling le li-additives li hloka ho kenyelletsoa tharollong e thata ho fihlela merero e latelang.
4. Ho belisoa ka lik'hemik'hale (ho qoelisoa). Hobane lisebelisoa tsa motheo tsa aluminium li na le litšepe tse ling tse sa hloekang, ho bonolo ho etsa metsoako ea inorganic e khomarelang holim'a substrate nakong ea ts'ebetso ea roughening, kahoo metsoako ea inorganic e entsoeng holim'a metsi e lokela ho hlahlojoa. Ho ea ka liphetho tsa tlhahlobo, lokisetsa tharollo e loketseng ea ho qoela, 'me u behe substrate ea aluminium e roughened ka har'a tharollo ea ho qoela ho netefatsa nako e itseng, e le hore bokaholimo ba poleiti ea aluminium bo hloeke ebile bo benye.