SHENZHEN Electronic Multilayer PCB Potoloho Board
Mabapi le Lipotoloho tsa Fastline
E thehiloe ho Shenzhen, Shenzhen Fastline Circuits Ltd e sebetsa ka mokhoa o ikhethileng ka moralo oa elektroniki, tlhahiso ea PCB, kopano ea PCB, le lits'ebeletso tsa ho fumana likarolo, le tsona li ka fana ka:
- PCB&PCBA Contract Manufacturing
- Litšebeletso tsa Reverse Engineering
- Moralo oa PCB le Kopano
- Theko ea Likarolo le Tsamaiso ea Lintho
- Moralo oa Sehlahisoa
- Mokhoa o potlakileng oa ho ngola oa PCB le PCBA
- Likopano tsa Cable le Wire
- Plastiki le hlobo
- AOI, Tlhahlobo ea X-Ray, Tšebeletso e 'ngoe ea Teko ea Mosebetsi
Bokhoni ba Ts'ebetso
Bokhoni ba ts'ebetso ea PCB (PCB Assembly):
| Tlhokahalo ea Theknoloji | Professional Surface-mounting and Through-hole soldering Technology |
| Mefuta e fapaneng e kang 1206,0805,0603 likarolo tsa theknoloji ea SMT | |
| Teko ea ICT(Tekong ea Potoloho), tekhenoloji ea FCT(Teko e sebetsang ea potoloho). | |
| Kopano ea PCB Ka UL, CE, FCC, Tumello ea Rohs | |
| Theknoloji ea ho hlahisa khase ea naetrojene bakeng sa SMT | |
| High Standard SMT&Solder Assembly Line | |
| Matla a thekenoloji a ho beoa ha boto a phahameng a hokahaneng | |
| Quote & Tlhokahalo ea Tlhahiso | Gerber File kapa PCB File bakeng sa Bare PCB Board Fabrication |
| Bom(Bill of Material) bakeng sa Kopano,PNP(Faele ea Khetha le Sebaka) le Boemo ba likarolo le tsona lia hlokahala kopanong. | |
| Ho fokotsa nako ea quote, ka kopo re fe nomoro ea karolo e felletseng bakeng sa karolo ka 'ngoe,Bongata ka boto le palo ea liodara. | |
| Tataiso ea Teko le Mokhoa oa Teko oa Mosebetsi ho etsa bonnete ba hore boleng bo fihla ho sekhahla sa sekhechana sa 0%. | |
| Litšebeletso tsa OEM / ODM / EMS | PCBA, PCB kopano: SMT & PTH & BGA |
| PCBA le moralo o koaletsoeng | |
| Ho fumana le ho reka likarolo | |
| Prototyping e potlakileng | |
| Ho bopa ente ea polasetiki | |
| Ho hatakela letlapa la tšepe | |
| Kopano ea ho qetela | |
| Teko: AOI, Teko ea Potoloho (ICT), Teko ea Mosebetsi (FCT) | |
| Tlokotsi ea tloaelo bakeng sa ho kenya thepa kantle ho naha le ho romela thepa kantle ho naha | |
| Lisebelisoa tse ling tsa Kopano ea PCB | SMT Machine: SIEMENS SIPLACE D1/D2 / SIEMENS SIPLACE S20/F4 |
| Setofo sa Reflow: FolunGwin FL-RX860 | |
| Mochini oa Soldering oa Wave: FolunGwin ADS300 | |
| Automated Optical Inspection (AOI): Aleader ALD-H-350B, X-RAY Testing Service | |
| Printer ea Stencil ea SMT e Itirisang e Felletseng: FolunGwin Win-5 |
Lintlha tsa Lihlahisoa
| Palo ea lihlopha | 1-50 mekhahlelo |
| Lintho tse bonahalang | FR4 (TG) |
| Botenya ba poleiti | 0.1-18mm |
| Mofuta | Silivera ea ho qoelisoa |
| Min. lesoba | 0.1 limilimithara |
| Ho fana ka mohlala | 5-6 matsatsi |
| Mask ea solder | Botala, Botsho, Boputsoa, Bofubedu, Matt Green |
| Max Layer | 50L |
| Tshebeletso | Litšebeletso tsa tekheniki tsa lihora tse 24 |
| PCB Standard | IPC-A-600 |
Matla a Phepelo
- Matla a Phepelo:
- 50000 Square Meter/Square Meter ka selemo
Packaging & Delivery
- Lintlha tsa Sephutheloana
- Pakete ea vacuum le lebokose
- Boema-kepe
- Shenzhen
- Lead time :
-
Bongata(Likotoana) 1 - 1000 >1000 EST. Nako(matsatsi) 21 Ho buisanoa
