Multi-Layer Fr4 Bluetooth PCB Circuit Board Assembly Moetsi oa PCB

Multi-Layer Fr4 Bluetooth PCB Circuit Board Assembly PCB e tumme ka sehlahisoa sa Elektroniki. Re tsepamisitse maikutlo ho indasteri ea PCBA ka lilemo tse fetang 10, 'me haholo-holo re sebeletsa limmaraka tsa Europe le Amerika, hammoho le limmaraka tsa leboea le Amerika Boroa le Asia Boroa-bochabela. Ehlile, ke sehlahisoa se ikhethileng, re se etsa joalo ka faele ea hau ea tlhahiso e hlokahalang.Re tšepa ho u thusa ho hlahisa lihlahisoa tsa boleng bo holimo 'marakeng oa heno le ho theha likamano tsa nako e telele tsa khoebo le uena.

Lintlha tsa Sehlahisoa

Li-tag tsa Sehlahisoa

Multi-Layer Fr4 Bluetooth PCB Circuit Board Assembly Moetsi oa PCB

1.Selelekela saFr4 LED Electronic PCB& PCBA

PCBA Technology:

1) Theknoloji ea professional Surface-mounting le through-hole soldering Technology.
2) Mefuta e fapaneng e kang 1206,0805,0603,0201, 1005 likarolo tsa theknoloji ea SMT.
3) Theknoloji ea ICT (In Circuit Test), FCT(Teko e sebetsang ea potoloho).
4) Kopano ea PCB Ka UL, CE, FCC, RoHs Kamohelo.
5) Theknoloji ea ho hlahisa khase ea naetrojene bakeng sa SMT.
6) Boemo bo phahameng ba SMT & Solder Assembly Line.
7) Boima bo phahameng bo hokahaneng ba theknoloji ea ho bea boto.

Bokhoni ba Tlhahiso ea PCBA:
Fastline Circuits Co., Limited e na le mahlale a fapaneng ka ho fetesisa a hatisitsoeng a boto ea potoloho a fumanehang, ho kenyelletsa PCB e lehlakoreng le le leng, Multilayer PCB, Aluminium based PCB, HDI PCB, Rigid-flex PCB, Flexible PCB, Heavy Copper PCB, Ceramic PCB, Ehlile ho ntse ho le teng. hangata ke PCB kopano.
94v0 UL Rigid e theko e tlaase ka ho fetisisa ea Tšebeletso ea Prototype ea PCBA
Mefuta ea Kopano: THD (Sesebelisoa sa Thru-Hole); SMT (Surface-Mount Technology) ; SMT & THD e tsoakiloeng; Kopano ea 2 e mahlakoreng a SMT le THD
SMT Line Bongata:30
SMT Line Bongata: 01005
SMT Min Pitch-QFPbophahamo: 0.3 limilimithara
BGA-Min Pitchbophahamo: 0.25 limilimithara
Sephutheloana sa Karolo: Reels ; Seha tape; Tube le terei ;Likarolo tse hlephileng le bongata
Litekanyo tsa boto: Boholo bo bonyenyane: 50 * 50mm; Boholo bo boholo: 520 * 420mm
Sebopeho sa boto: Rectangular ; Round ;Slots and Cut Outs ;E rarahane ebile ha e tloaelehe
Mofuta oa boto: E thata FR-4; mapolanka a Rigid-Flex; Aluminium PCB
Ts'ebetso ea kopano: E sa Keneng Pele (RoHS)
Etsa sebopeho sa faele: Gerber RS-274X ; BOM (Bill of Materials) (.xls, .csv, . xlsx)
Mekhoa ea Tlhahlobo: Tlhahlobo ea pono; Tlhahlobo ea X-ray ;AOI (Tlhahlobo e Ikemetseng ea Optical); ICT (Teko ea ka-Circuit); Teko e sebetsang
Nako ea ho fetoha: 1-5 matsatsi a mosebetsi bakeng sa kopano ea PCB feela; Matsatsi a 10-16 a mosebetsi bakeng sa kopano e felletseng ea konopo ea PCB.

Phallo ea PCBA:

38O`6R~(O6R`D[@_@4B}1$S

Re lumela hore boleng ke moea oa khoebo 'me e fana ka litšebeletso tsa boenjiniere le tlhahiso ea nako e telele, e tsoetseng pele ea theknoloji le indasteri bakeng sa indasteri ea lisebelisoa tsa elektroniki.
Boleng ba molumo bo fumana botumo bo botle bakeng sa Fastline. Bareki ba tšepahalang ba sebelisane le rona khafetsa mme bareki ba bacha ba tla ho Fastline ho theha likamano tsa tšebelisano ha ba utloa ka botumo bo botle. Re labalabela ho fana ka litšebeletso tsa boleng bo holimo ho uena!

2. Lintlha tsa Tlhahiso ea Multi-Layer Fr4 Bluetooth PCB Circuit Board Assembly PCB

Multi-Layer Fr4 Bluetooth PCB Circuit Board Assembly PCB (3)

Multi-Layer Fr4 Bluetooth PCB Circuit Board Assembly PCB (2)

Multi-Layer Fr4 Bluetooth PCB Circuit Board Assembly PCB

3.Kopo ofMulti-Layer Fr4 Bluetooth PCB Circuit Board Assembly PCB

Re sebelelitse PCBA ea boleng bo holimo ho ea linaheng tse ngata, ho tloha ho lisebelisoa tsa elektronike tsa bareki ho ea ho lithelefono, matla a macha, sefofane, likoloi, joalo-joalo.

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Sehlahisoa sa Elektronike

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Indasteri ea Lipuisano

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Sepakapaka

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Taolo ea indasteri

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Moetsi oa Likoloi

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Indasteri ea Sesole

4. Tšoaneleho eaMulti-Layer Fr4 Bluetooth PCB Circuit Board Assembly PCB

Re behile lefapha le arohaneng moo moralo o khethehileng oa tlhahiso o tla latela tlhahiso ea hau ea tlhahiso ka mor'a tefo ea hau, ho kopana le tlhahiso ea hau ea pcb le tlhokahalo ea kopano.
Re na le ka tlase ho tsoaneleha ho paka pcba rona.

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5.Ketelo ea bareki
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6.Pakete ea rona

Re sebelisa vacuum le lebokose ho phuthela thepa, ho netefatsa hore kaofela li ka fihla ho uena ka botlalo.

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7.Delive and Serving
U ka khetha k'hamphani efe kapa efe ea Express eo u nang le eona ka ak'haonte ea hau, kapa ak'haonte ea rona, bakeng sa sephutheloana se boima haholo, ho tla ba le thepa ea likepe ea leoatleng le eona.

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Ha o fumana pcba, u se ke ua lebala ho hlahloba le ho li hlahloba,
Haeba ho na le bothata, amohela ho ikopanya le rona!

8. FAQ
Q1: Na u feme kapa k'hamphani ea khoebo?
A1: Re na le feme ea rona ea ho etsa PCB le ea Kopano.

Q2: Odara ea hau e tlase ke bokae?
A2: MOQ ea rona ha e tšoane ho latela lintho tse fapaneng. Litaelo tse nyane le tsona lia amoheloa.

Q3: ke faele efe eo re lokelang ho fana ka eona?
A3: PCB: Gerber faele e molemo, ( Protel, matla pcb, PADs faele), PCBA : Gerber faele le BOM lenaneng.

Q4: Ha ho faele ea PCB / faele ea GBR, u na le sampole ea PCB feela, na u ka ntlhahisetsa eona?
A4: E, re ka u thusa ho kopanya PCB. Re romelle mohlala oa PCB ho rona, re ka kopanya moralo oa PCB mme ra o sebetsa.

Q5: Ke lintlha life tse ling tse lokelang ho fanoa ntle le faele?
A5: Litlhaloso tse latelang lia hlokahala bakeng sa khotheishene:
a) Boitsebiso ba motheo
b) Botenya ba boto:
c) Botenya ba koporo
d) Phekolo ea holim'a metsi:
e) 'mala oa mask a solder le silkscreen
f) Bongata

Q6: Ke khotsofetse haholo ka mor'a hore ke bale tlhahisoleseding ea hau, nka qala joang ho reka odara ea ka?
A6: Ka kopo ikopanye le thekiso ea rona leqepheng la maqephe a marang-rang, kea leboha!

Q7: Lipehelo le nako ea ho fana ke eng?
A7: Re tloaetse ho sebelisa mantsoe a FOB mme re romella thepa ka matsatsi a 7-15 a mosebetsi ho latela bongata ba odara ea hau, mokhoa oo u o tloaetseng.