1.Bokhoni:
| lera | 1-50 lera |
| High Density Interconnect(HDI) | 2+N+2 |
| Mofuta oa thepa | FR-4, High TG, Halogen Free, Rogers, ITEQ,ShengYi, Isola, Taconic, Arlon, Teflon, Rogers, Copper Based |
| Botenya ba boto | Ho tloha ho 0.21 ho isa ho 7.0 mm |
| Botenya ba koporo | 0.5 OZ ho 10 oz |
| Boholo | Max. Boto ea boholo: 580mm×1100mm |
| Min. Lesoba le Chesitsoeng Bogolo: 0.15 mm (6 mil)Mots. Laser Drill 0.1mm(4mil) | |
| Min. Bophara ba Mola: 3mil (0.075mm) | |
| Min. Sekhahla sa Mola: 3mil (0.075mm) | |
| Ho qeta bokahodimo | HASL / HASL e etella pele mahala, ENIG, Chemical Tin, Silivera ea ho qoelisoa / Khauta, OSP, Ho cheka khauta |
| Mobala oa Mask oa Solder | Botala / Bosehla / Botsho / Bosoeu / Bofubelu / Boputsoa |
| Mamello | Mamello ea sebopeho: ±0.13(5mil) |
| Ho mamella lesoba: PTH: ±0.075(3mil) NPTH: ±0.05(2mil) | |
| Setifikeiti | UL, ISO 9001, ISO 14001 |
| Litlhoko tse khethehileng | E patoa ebile e foufetse ka + Controlled impedance + BGA |
| Profileing | Ho otla, ho tsamaisa, V-CUT, Beveling |
2.Products Kopo:
3.Feme:
4. Tšoaneleho eaHigh Density Online Rogers Pcb Circuits Board:
Re behile lefapha le arohaneng moo moralo o khethehileng oa tlhahiso o tla latela tlhahiso ea hau ea tlhahiso ka mor'a tefo ea hau, ho kopana le tlhahiso ea hau ea pcb le tlhokahalo ea kopano.
Re na le ka tlase ho tsoaneleha ho paka pcba rona.
5.Ketelo ea bareki:
6.Sephutheloana sa rona:
Re sebelisa vacuum le lebokose ho phuthela thepa, ho netefatsa hore kaofela li ka fihla ho uena ka botlalo.
7.Delive and Serving:
U ka khetha k'hamphani efe kapa efe ea Express eo u nang le eona ka ak'haonte ea hau, kapa ak'haonte ea rona, bakeng sa sephutheloana se boima haholo, ho tla ba le thepa ea likepe ea leoatleng le eona.
