0.2mm Hole PCB Rigid -Flexible PCB Board Layer Stack
1.Selelekela sa0.2mm Hole PCB Rigid -Flexible PCB Board Layer Stack
Fastline Circuits e khona ho fana ka litšebeletso tsa kopano ea boto ea potoloho e felletseng le li-turnkey tse sa fellang. Bakeng sa turnkey e felletseng, re hlokomela ts'ebetso eohle, ho kenyeletsoa ho lokisoa ha Maboto a Potoloho a Hatisitsoeng, ho reka lisebelisoa, ho lata odara ea inthanete, ho lekola boleng bo tsoelang pele le kopano ea ho qetela. Athe bakeng sa turnkey e sa fellang, moreki a ka fana ka li-PCB le likarolo tse itseng, 'me likarolo tse setseng li tla sebetsoa ke rona.
Litšobotsi-Molemo oa Lihlahisoa tsa rona
1. Ho feta lilemo tse 10 phihlelo moetsi PCB Kopana le PCB tšimo.
2. Tekanyo e kholo ea tlhahiso e etsa bonnete ba hore theko ea hau e tlase.
3. Mohala o tsoetseng pele oa tlhahiso o tiisa boleng bo tsitsitseng le nako e telele ea bophelo.
4. Hlahisa hoo e ka bang PCB efe kapa efe e le tlhokahalo ea hau.
5. 100% teko bakeng sa lihlahisoa tsohle customized PCB.
6. One-stop Service, re ka thusa ho reka likarolo.
Lisebelisoa tse Tloaelehileng tsa Flex:
Polyimide (Kapton) 0.5 mil ho isa ho 5 mils (.012mm - .127mm)
Adhesiveless Copper Clad Base Material 1 mil ho isa ho 5 mils
Flame Retardant Laminate, Base Material, le Coverlay
Ts'ebetso e phahameng ea Epoxy Laminate le Prepreg
High Performance Polyimide Laminate le Prepreg
Litaba tse lumellanang le UL le RoHS ha u kopa
Tg e Phahameng FR4 (170+ Tg), Polyimide (260+ Tg)
Base Copper:
1/3 oz. - .00047 in. (.012mm)–e sebelisoa seoelo
1/2 oz. - .0007 ho. (.018mm)
1 oz. - .0014 in. (.036mm)
2 oz. - .0028 in. (.071mm)
Mask ea Solder: E hlophisitsoe
Polyimide Coverlay: 0.5 mil ho isa ho 5 mils Kapton (.012mm - .127mm)
e nang le Sekhomaretsi sa 0.5 ho isa ho 2 mil (.012mm - .051mm)
LPI le LDI Flexible Soldermasks
Flex PCB Bokhoni
| Fastline Circuits Co., Limited | |
| Theknoloji le Bokhoni ba FPC | |
| Lintho tse bonahalang | FR4, Polyimide / Polyester |
| Lipalo | Flex: 1 ~ 8L; Regid-Flex: 2 ~ 8L |
| Botenya ba Boto | Min.0.05mm; Max. 0.3 limilimithara |
| Botenya ba Koporo | 1/3 oz - 2 oz |
| CNC Drill Size (Max) | 6.5 limilimithara |
| CNC Drill Size (Mits) | Bophahamo: 0.15mm |
| Mamello ea Sebaka sa Likoti | ± 0.05 limilimithara |
| Boholo ba Kopo ea Coverlay (Mots) | 0.6 limilimithara |
| Hole to Coverlay Ho bula Windows (Min) | 0.15 limilimithara |
| Bophara ba Mola oa Min / Sebaka | 0.1/0.1mm |
| Botenya ba Koporo Leboteng la Hole | Flex: 12-22μm |
| Min Pad Size | φ0.2mm |
| Etch Tolerance | E qetile ho mamella bophara ba mola ± 20% |
| Mamello ea ho Ngolisa mohlala | ± 0.1mm (Boholo ba Panel e Sebetsang: 250 * 300mm) |
| Coverlay Ngoliso Mamello | ± 0.15 limilimithara |
| Mamello ea Ngoliso ea Mask ea Solder | ± 0.2 limilimithara |
| Solder Mask ho PAD | Ha e utloe bohloko: 0.2mm |
| Ho utloisisa lifoto: 0.1mm | |
| Min. Letamo la Mask la Solder | 0.1 limilimithara |
| Mamello ea Boingoliso bo fosahetseng | ± 0.30 limilimithara |
| bakeng sa Stiffener, Adhesive, Glue paper | |
| Surface Finish | Plating Ni / Au ; Chemical Ni / Au ; OSP |
Re lumela hore boleng ke moea oa khoebo 'me e fana ka litšebeletso tsa boenjiniere le tlhahiso ea nako e telele, e tsoetseng pele ea theknoloji le indasteri bakeng sa indasteri ea lisebelisoa tsa elektroniki.
Boleng ba molumo bo fumana botumo bo botle bakeng sa Fastline. Bareki ba tšepahalang ba sebelisane le rona khafetsa mme bareki ba bacha ba tla ho Fastline ho theha likamano tsa tšebelisano ha ba utloa ka botumo bo botle. Re labalabela ho fana ka litšebeletso tsa boleng bo holimo ho uena!
2.Production Details of 0.2mm Hole PCB Rigid -Flexible PCB Board Layer Stack
3.Kopo of0.2mm Hole PCB Rigid -Flexible PCB Board Layer Stack
Re sebelelitse PCBA ea boleng bo holimo ho ea linaheng tse ngata, ho tloha ho lisebelisoa tsa elektronike tsa bareki ho ea ho lithelefono, matla a macha, sefofane, likoloi, joalo-joalo.
Sehlahisoa sa Elektronike
Indasteri ea Lipuisano
Sepakapaka
Taolo ea indasteri
Moetsi oa Likoloi
Indasteri ea Sesole
4. Tšoaneleho ea0.2mm Hole PCB Rigid -Flexible PCB Board Layer Stack
Re behile lefapha le arohaneng moo moralo o khethehileng oa tlhahiso o tla latela tlhahiso ea hau ea tlhahiso ka mor'a tefo ea hau, ho kopana le tlhahiso ea hau ea pcb le tlhokahalo ea kopano.
Re na le ka tlase ho tsoaneleha ho paka pcba rona.
5.Ketelo ea bareki
6.Pakete ea rona
Re sebelisa vacuum le lebokose ho phuthela thepa, ho netefatsa hore kaofela li ka fihla ho uena ka botlalo.
7.Delive and Serving
U ka khetha k'hamphani efe kapa efe ea Express eo u nang le eona ka ak'haonte ea hau, kapa ak'haonte ea rona, bakeng sa sephutheloana se boima haholo, ho tla ba le thepa ea likepe ea leoatleng le eona.
Ha o fumana pcba, u se ke ua lebala ho hlahloba le ho li hlahloba,
Haeba ho na le bothata, amohela ho ikopanya le rona!
8. FAQ
Q1: Na u feme kapa k'hamphani ea khoebo?
A1: Re na le feme ea rona ea ho etsa PCB le ea Kopano.
Q2: Odara ea hau e tlase ke bokae?
A2: MOQ ea rona ha e tšoane ho latela lintho tse fapaneng. Litaelo tse nyane le tsona lia amoheloa.
Q3: ke faele efe eo re lokelang ho fana ka eona?
A3: PCB: Gerber faele e molemo, ( Protel, matla pcb, PADs faele), PCBA : Gerber faele le BOM lenaneng.
Q4: Ha ho faele ea PCB / faele ea GBR, u na le sampole ea PCB feela, na u ka ntlhahisetsa eona?
A4: E, re ka u thusa ho kopanya PCB. Re romelle mohlala oa PCB ho rona, re ka kopanya moralo oa PCB mme ra o sebetsa.
Q5: Ke lintlha life tse ling tse lokelang ho fanoa ntle le faele?
A5: Litlhaloso tse latelang lia hlokahala bakeng sa khotheishene:
a) Boitsebiso ba motheo
b) Botenya ba boto:
c) Botenya ba koporo
d) Phekolo ea holim'a metsi:
e) 'mala oa mask a solder le silkscreen
f) Bongata
Q6: Ke khotsofetse haholo ka mor'a hore ke bale tlhahisoleseding ea hau, nka qala joang ho reka odara ea ka?
A6: Ka kopo ikopanye le thekiso ea rona leqepheng la maqephe a marang-rang, kea leboha!
Q7: Lipehelo le nako ea ho fana ke eng?
A7: Re tloaetse ho sebelisa mantsoe a FOB mme re romella thepa ka matsatsi a 7-15 a mosebetsi ho latela bongata ba odara ea hau, mokhoa oo u o tloaetseng.
