1. Habka wax-ku-kordhinta

Lakabka naxaasta kiimikada waxaa loo isticmaalaa korriinka tooska ah ee xariiqyada kirishbooyada maxalliga ah ee dusha sare ee substrate-ka ee aan maareeyaha ahayn iyadoo la kaashanayo horjooge dheeraad ah.

Hababka isku-darka ah ee guddiga wareegga waxaa loo qaybin karaa isku-dar buuxa, isku-darka nuska ah iyo qayb ka mid ah iyo siyaabo kale oo kala duwan.

2. Dhabarka dambe, Duullimaadyada

Waa dhumuc weyn (sida 0.093″,0.125″) looxa wareegga, gaar ahaan loo isticmaalo in lagu xidho oo lagu xidho looxyada kale. Taas waxa lagu sameeyaa iyada oo la geliyo isku-xidhaha multi-pin ee godka cidhiidhiga ah, laakiin maaha in la geliyo, ka dibna mid mid loogu xidho siligga uu Xidhiidhiyuhu soo dhex maro looxa. Xidhiidhiyaha waxaa si gooni ah loo gelin karaa guddiga wareegga guud. Sababtoo ah tani waa guddi gaar ah, iyada 'dalool ma alxan karo, laakiin ha derbiga godka iyo hagitaan silig kaarka si toos ah isticmaalka adag, si ay tayada iyo aperture shuruudaha si gaar ah u adag yihiin, tirada amarka ma aha wax badan oo ka mid ah, warshad guddiga wareegga guud. Ma rabo mana fududa in la aqbalo nidaamkan oo kale, laakiin waxa ay ku dhowdahay inay noqoto darajo sare oo warshadaha takhasuska leh ee Maraykanka.

3. Habka BuildUp

Tani waa beer cusub oo loo sameeyo multilayer khafiif ah, iftiinka hore waxaa laga soo qaatay habka IBM SLC, in ay Japanese Yasu wax soo saarka tijaabada tijaabo bilaabay 1989, habka ku salaysan yahay guddi double dhaqanka, tan iyo labada guddi dibadda ugu horeysay tayada dhamaystiran. Sida Probmer52 ka hor inta aanad daboolin dareeraha sawir-qaadista, ka dib markii nus adag iyo xal xasaasi ah la sameeyo sida miinooyinka leh lakabka xiga ee qaab-gacmeedka "dareenka daloolka indhaha" (Photo - Via), ka dibna kiimikooyinka korodhka dhamaystiran ee naxaasta iyo naxaasta lakabka, iyo sawirida xariiqda iyo etching ka dib, waxay heli kartaa siliga cusub iyo isku xidhka hoose ee godka lagu aasay ama dalool indho la'aan ah. Lakabyada soo noqnoqda waxay dhalin doontaa tirada lakabyada loo baahan yahay. Habkani kaliya kama fogaan karo kharashka qaaliga ah ee qodista farsamada, laakiin sidoo kale wuxuu yareeyaa dhexroorka daloolka in ka yar 10mil. In ka badan 5 ~ 6 sano ee la soo dhaafay, dhammaan noocyada kala duwan ee jebinta lakabka dhaqanka qaataan a technology multilayer isku xigta, in warshadaha Yurub hoos riixaya, ka dhigi habka BuildUp sida, alaabta jira waxaa lagu taxay in ka badan 10 nooc. Marka laga reebo "daloolka dareenka leh"; Ka dib markii laga saaro daboolka naxaasta ee godadka, hababka "samaynta daloolka" ee kala duwan sida kiimikooyinka alkaline Etching, Laser Ablation, iyo Plasma Etching ayaa loo qaataa saxannada organic. Intaa waxaa dheer, Faylka cusub ee Resin Coated Copper Foil (Resin Coated Copper Foil) ee lagu dahaadhay resin-adag ayaa sidoo kale loo isticmaali karaa in lagu sameeyo saxan lakabyo badan oo dhuuban, yar iyo dhuuban leh oo isku xigta. Mustaqbalka, alaabada elektiroonigga ah ee shakhsi ahaaneed ee kala duwan waxay noqon doontaa noocaan oo kale ah oo dhab ahaantii dhuuban oo gaaban adduunka guddiga lakabyada badan.

4. Cermet

Budada dhoobada iyo budada birta ah ayaa la isku daraa, oo koollada ayaa lagu daraa sida nooc ka mid ah daahan, kaas oo lagu daabici karo dusha sare ee guddiga wareegga (ama lakabka gudaha) filim qaro weyn ama filim khafiif ah, sida meelaynta "iska caabinta", halkii laga heli lahaa resistor dibadda inta lagu guda jiro shirka.

5. Isku-dubarid

Waa geeddi-socod loox wareeg ah oo isku-dhafan. Xadhkaha wareegga ah ee dhejiska filimka qaro weyn ee biraha qaaliga ah ee kala duwan ee lagu daabacay dusha sare ee looxa yar ayaa lagu shidaa heerkul sare. Qaadayaasha kala duwan ee dabiiciga ah ee ku jira dhejiska filimka qaro weyn waa la gubay, taasoo ka tagaysa khadadka kaariyada birta ah ee qaaliga ah in loo isticmaalo sida fiilooyinka isku xirka.

6. Gudub

Isgoysyada saddex-geesoodka ah ee laba fiilooyinka dusha sare ee looxa iyo buuxinta dhexdhexaadka ah ee u dhexeeya dhibcaha dhibcaha ayaa loo yaqaan. Guud ahaan, hal rinji oo cagaar ah oo lagu daray boodboodka filimka kaarboon, ama habka lakabka ee ka sarreeya iyo ka hooseeya fiilooyinka ayaa ah "Crossover".

7. Gudida Xadhkaha goosanaysa

Kelmad kale oo loogu talagalay looxa-xadhkaha badan , waxa uu ka samaysan yahay siligga wareegsan ee nalalka leh ee ku dheggan looxa oo daloola godad. Waxqabadka looxa Multiplex ee noocaan ah ee khadka gudbinta soo noqnoqda ee sarreeya ayaa ka wanaagsan xariiqda laba jibaaran ee siman ee uu ku xardhay PCB caadiga ah.

8. Istaraatiijiyada DYCO

Waa shirkadda Switzerland Dyconex ee horumarisay Dhismaha Geedi-socodka Zurich. Waa hab patented in meesha laga saaro bireed naxaas ah boosaska godadka dusha saxanka marka hore, ka dibna la dhigo meel vacuum ah oo xiran, ka dibna ku buuxi CF4, N2, O2 si ionize at danab sare si ay u sameeyaan Plasma aad u firfircoon. , kaas oo loo isticmaali karo in lagu daxaleeyo walxaha aasaasiga ah ee meelaha daloolsan oo ay soo saaraan godadka hagayaasha yaryar (ka hooseeya 10mil). Habka ganacsiga waxaa loo yaqaan DYCOstrate.

9. Sawir-qaade ku-meel-gaar ah

Iska caabbinta korantada, iska caabbinta elektiroonigga ah waa qaab dhismeed cusub oo "iska caabin sawir leh", oo asal ahaan loo isticmaalo muuqaalka walxaha birta ah ee adag "rinji koronto", oo dhawaan lagu soo bandhigay codsiga "photoresistance". Iyada oo la adeegsanayo koronto-uruurin, qaybo kolloidal ah oo la soo dallacay oo ah xabagta sawir-qaadista ayaa si isku mid ah loogu dhejiyay dusha naxaasta ee looxa wareegga iyada oo ah xannibaadaha ka soo horjeeda cuncunka. Waqtigan xaadirka ah, waxaa loo isticmaalay wax soo saarka ballaaran ee habka naxaasta tooska ah ee laminate gudaha. Noocan ah ED photoresist waxaa lagu dhejin karaa anode ama cathode siday u kala horreeyaan iyadoo loo eegayo hababka hawlgalka ee kala duwan, kuwaas oo loo yaqaan "anode photoresist" iyo "cathode photoresist". Marka loo eego mabda'a sawir-qaadista ee kala duwan, waxaa jira "polymerization sawir-qaadis" (Shaqo xun) iyo" furfurnaan sawir leh" (Shaqo wanaagsan) iyo laba nooc oo kale. Waqtigan xaadirka ah, nooca taban ee iska caabbinta sawir-qaadista ee ED ayaa la iibiyay, laakiin waxa kaliya oo loo isticmaali karaa wakiilka iska caabbinta qorshaysan. Sababtoo ah dhibka sawir-qaadista ee godka-god, looma isticmaali karo wareejinta sawirka saxanka dibadda. Sida "ED togan", kaas oo loo isticmaali karo sida wakiilka photoresist ee saxan dibadda ah (sababtoo ah xuubka photosensitive, la'aanta saamaynta photosensitive ee derbiga dalool aan la taaban), warshadaha Japan ayaa weli kor u qaadaya dadaalka ganacsiyeeyaan isticmaalka wax-soo-saarka baaxadda leh, si wax-soo-saarka khadadka khafiifka ah si fudud loo gaaro. Ereyga waxa kale oo loo yaqaan Electrothoretic Photoresist.

10. Biyo-qaade

Waa looxa wareegga gaarka ah kaas oo si buuxda muuqaalkiisu siman yahay oo ku riixaya dhammaan xadhkaha kirishbooyada saxanka. Dhaqanka hal guddi oo keliya ayaa ah in la isticmaalo habka wareejinta sawirka si loo dhajiyo qayb ka mid ah foornada naxaasta ah ee dusha looxa ee looxa walxaha salka kaas oo ah qayb adag. Heerkulka sare iyo habka cadaadiska sare wuxuu noqon doonaa line guddiga galay saxan semi-adag, isla mar ahaantaana si ay u dhamaystiraan saxan adag shaqada adag, galay line galay dusha iyo dhammaan guddiga wareegga siman. Sida caadiga ah, lakabka naxaasta ah ee khafiifka ah ayaa laga dhejiyaa dusha wareegga dib loo rogi karo si lakabka nikkel 0.3mil, lakabka rhodium 20-inch ah, ama lakabka dahabka ah ee 10-inch ah ayaa lagu dhejin karaa si ay u bixiso iska caabin hoose oo xiriir ah iyo si fudud u simbiriirixan inta lagu jiro xiriirka . Si kastaba ha ahaatee, habkan waa in aan loo isticmaalin PTH, si looga hortago in daloolka uu dillaaco marka la riixayo. Ma fududa in la gaaro dusha sare ee looxa oo siman, waana in aan lagu isticmaalin heerkulka sare, haddii ay dhacdo in resinku uu balaadhiyo ka dibna uu xariiqda ka soo saaro dusha sare. Sidoo kale loo yaqaan Etchand-Push, Board-ka la dhammeeyay waxaa loo yaqaan Guddi-Bonded ah waxaana loo isticmaali karaa ujeeddooyin gaar ah sida Wareegtada Rotary iyo Xiriirrada tirtiridda.

11. Frit

Xabagta daabacaadda ee Poly Thick Film (PTF), marka lagu daro kiimikooyinka birta ah ee qaaliga ah, budada dhalada ayaa weli loo baahan yahay in lagu daro si ay u ciyaaraan saameynta uumiga iyo dhejiska ee dhalaalka heerkulka sare, si ay daabacadu u dhejiso substrate dhoobada maran waxay samayn kartaa nidaam wareeg ah oo bir qaali ah oo adag.

12. Habka Wax-ku-kordhinta Buuxda

Waxay ku taal dusha xaashida ee dahaarka dhamaystiran, iyada oo aan lahayn koronto-soo-saarka habka birta (inta badan waa naxaas kiimikaad ah), kobaca dhaqanka wareegga xulashada, odhaah kale oo aan sax ahayn waa "Fully Electroless".

13. Isku-dhafka Isku-dhafka ah ee Wareegga

Waa substrate dhuuban yar yar, ee habka daabacaadda si aad u dalbato khadka khad biraha sharafta leh, ka dibna by heerkulka sare khad arrinta organic gubtay, tegaayo line a on dusha sare, oo fulin kara qaybaha xidhitaanka dusha ee alxanka. Waa nooc ka mid ah gudbiyaha wareegga tignoolajiyada filimka qaro weyn ee u dhexeeya guddiga wareegga daabacan iyo aaladda wareegga isku dhafan ee semiconductor. Markii hore loo isticmaali jiray codsiyada militariga ama soo noqnoqda sare, Hybrid ayaa si aad u yar u koray sannadihii la soo dhaafay sababtoo ah kharashkeeda sare, hoos u dhaca awoodaha militariga, iyo dhibaatada wax soo saarka otomatiga ah, iyo sidoo kale kordhinta miniaturization iyo casriyeynta guddiyada wareegga.

14. Dhexdhexaadiye

Interposer waxa loola jeedaa laba lakab oo kirishbooyeyaal ah oo uu qaado jidhka dahaarka ah kaas oo ku daraya qaar ka mid ah buuxinta korantada meesha lagu qabanayo. Tusaale ahaan, godka qaawan ee saxan badan, alaabta sida buuxinta koollada qalinka ama koollada naxaasta si loogu beddelo derbiga godka naxaasta ah, ama alaabta sida lakabka caagga ah ee toosan ee unidirectional ah, dhammaantood waa dhexdayaal noocan ah.

15. Sawirka Tooska ah ee Laser (LDI)

Waa in la riixo saxanka ku dheggan filimka qalalan, mar dambe ha u isticmaalin soo-gaadhista taban ee wareejinta sawirka, laakiin halkii aad ka isticmaali lahayd kombuyuutarka amarrada laser-ka, si toos ah filimka qalalan ee sawir-qaadista degdega ah ee sawir-qaadista. Darbiga dhinaca filimka qalalan ka dib sawir-qaadista ayaa si toos ah u taagan sababtoo ah iftiinka soo baxaya wuxuu la mid yahay hal tamar oo xoog leh. Si kastaba ha ahaatee, habka ayaa kaliya u shaqeyn kara guddi kasta si gaar ah, sidaas darteed xawaaraha wax soo saarka tirada badan ayaa aad uga dhaqso badan isticmaalka filimka iyo soo-gaadhista dhaqameed. LDI kaliya waxay soo saari kartaa 30 loox oo cabbir dhexdhexaad ah saacaddii, markaa waxay mararka qaarkood ka muuqan kartaa qaybta caddaynta xaashida ama qiimaha cutubka sare. Sababtoo ah qiimaha sarreeya ee dhalmada, way adagtahay in kor loo qaado warshadaha

16.Maching Laser

In warshadaha elektarooniga ah, waxaa jira processing badan oo sax ah, sida goynta, qodista, alxanka, iwm, sidoo kale loo isticmaali karaa si ay u fuliyaan tamarta iftiinka laser, loo yaqaan habka processing laser. LASER waxa loola jeedaa soo gaabinta "Light Amplification Stimulated Emission of Radiation", oo loo tarjumay "LASER" ee warshadaha dhul weynaha si loogu tarjumo bilaash, in ka badan ilaa barta. Laser waxa sameeyay 1959 kii fiisigiste Maraykan ah th moser, kaas oo isticmaalay hal iftiin oo iftiin ah si uu u soo saaro iftiinka leysarka Sannado cilmi-baaris ah ayaa abuuray hab habayn cusub. Marka laga reebo warshadaha elektaroonigga ah, waxaa sidoo kale loo isticmaali karaa dhinacyada caafimaadka iyo militariga

17. Micro Wire Board

Guddiga wareegga gaarka ah ee leh isku xirka PTH interlayer waxaa badanaa loo yaqaan MultiwireBoard. Marka cufnaanta fiilooyinka ay aad u sarreeyaan (160 ~ 250in / in2), laakiin dhexroorka siligga ayaa aad u yar (in ka yar 25mil), waxaa sidoo kale loo yaqaannaa guddiga wareegga-yar ee xiran.

18. Cirxuit caaraysan

Waxay adeegsanaysaa caaryada saddex-geesoodka ah, samee qaabaynta cirbadeynta ama habka beddelka si ay u dhammaystirto habka looxa wareegga isteeriyo, oo loo yaqaan wareegga isku xirka nidaamka Molded

19 Gudida Xadhkaha Goynta
Waxa ay isticmaalaysaa silig aad u khafiif ah oo dhalaal ah, oo si toos ah dusha uga saaran iyada oo aan lahayn saxan naxaas ah oo loogu talagalay fiilooyinka saddex-geesoodka ah, ka dibna iyada oo dahaadhidda go'an iyo qodista iyo dalool laysarka, guddiga wareegga isku-xidhka-lakabka badan, oo loo yaqaan "board multi-fire board" ”. Tan waxaa soo saartay PCK, oo ah shirkad Mareykan ah, waxaana weli soo saara Hitachi oo leh shirkad Japan ah. MWB-gan wuxuu badbaadin karaa wakhtiga naqshadeynta wuxuuna ku habboon yahay tiro yar oo mashiinno ah oo leh wareegyo adag.

20. Birta Sharafta leh

Waa koollada korantada ee daabacaadda wareegga filimka qaro weyn. Marka lagu daabaco substrate dhoobada daabacaadda shaashadda, ka dibna sidaha organic waxaa lagu gubay heerkul sare, wareegga birta sharafta leh ayaa muuqda. Budada korantada ah ee lagu daro koollada waa inay noqotaa bir sharaf leh si looga fogaado samaynta oksaydhyada heerkulka sare. Isticmaalayaasha alaabtu waxay leeyihiin dahab, platinum, rhodium, palladium ama macdano kale oo qaali ah.

21. Pads Kaliya Board

Maalmihii hore ee qalabaynta daloolka-daloolka, qaar ka mid ah looxyada isku-kalsoonida sare leh ayaa si fudud uga tagay godka iyo giraanta alxanka ee ka baxsan saxanka oo waxay qariyeen khadadka isku xira lakabka hoose ee gudaha si loo hubiyo tayada iibka iyo badbaadada khadka. Noocan ah laba lakab oo dheeri ah oo guddiga ah lama daabici doono alxanka cagaarka cagaaran, muuqaalka dareenka gaarka ah, kormeerka tayada waa mid aad u adag.

Waqtigan xaadirka ah cufnaanta fiilooyinka ayaa kordhay, alaabooyin badan oo elektiroonig ah oo la qaadi karo (sida taleefanka gacanta), guddiga wareegga wajiga oo ka tagaya oo kaliya SMT alxanka ama dhowr xariiq, iyo isku xirka xadhkaha cufan ee lakabka gudaha, interlayer sidoo kale waa adag tahay. Dhererka macdanta ayaa jabay dalool indho la'aan ah ama dalool indho la'aan ah "daboolan" (Pads-On-Hole), sida isku-xirnaanta si loo yareeyo xiritaanka godka oo dhan oo leh waxyeello dusha sare ah oo naxaas ah, saxanka SMT sidoo kale waa Pads Only Board

22. Filim Dhumuc Leh Polymer (PTF)

Waa koollada dahabiga ah ee daabacaadda ee loo isticmaalo samaynta wareegyada, ama koollada daabacaadda samaynta filim iska caabin ah oo daabacan, oo ku yaal substrate dhoobada, oo leh daabacaadda shaashadda iyo gubashada heerkulka sare ee xiga. Marka sidaha dabiiciga ah uu gubto, waxaa la sameeyaa nidaam wareegyo wareeg ah oo adag. Taarikada noocaan ah waxaa guud ahaan loo tixraacaa sida wareegyada isku-dhafka ah.

23. Geedi socodka nus-wax-ku-kordhinta

Waa in la tilmaamo alaabta saldhigga ah ee dahaarka, koraan wareegga u baahan marka hore si toos ah naxaas kiimikaad ah, beddelka mar kale electroplate copper macnaheedu waa in la sii wado dhumucdiisuna soo socda, wac "Semi-Additive" habka.

Haddii habka naxaasta kiimikada loo isticmaalo dhammaan dhumucda xariiqda, habka waxaa loo yaqaan "isku darka wadarta". Ogow in qeexitaanka sare uu ka yimid * qeexida ipc-t-50e ee la daabacay Julaay 1992, taas oo ka duwan ipc-t-50d asalka ah (Noofambar 1988). Nooca hore ee "D", sida inta badan loo yaqaan warshadaha, waxaa loola jeedaa substrate ka mid ah ama qaawan, aan shaqayn, ama bireed naxaas khafiif ah (sida 1/4oz ama 1/8oz). Wareejinta sawirka wakiilka iska caabinta taban ayaa la diyaariyey waxaana wareegga loo baahan yahay lagu dhumucayaa naxaasta kiimikada ama dahaadhka naxaasta ah. 50E cusub ma xuso ereyga "naxaas khafiif ah". Farqiga u dhexeeya labada odhaah waa weyn yahay, fikradaha akhristayaasha waxaad mooddaa inay la soo baxeen The Times.

24.Hab-socod hoose

Waa dusha sare ee ka saarista xaashida naxaasta ah ee aan faa'iidada lahayn, habka guddiga wareegga ee loo yaqaan "habka dhimista", waa habka caadiga ah ee guddiga wareegga sanado badan. Tani waxay ka duwan tahay habka "ku dar" ee ku darida xadhkaha korantada si toos ah substrate-ka aan naxaasta lahayn.

25. Wareegga Filimka Dhumucda

PTF (Polymer Thick Film Paste), oo ka kooban biro qaali ah, ayaa lagu daabacaa substrate-ka dhoobada ah (sida aluminium trioxide) ka dibna lagu shido heerkul sare si loo sameeyo nidaamka wareegga leh birta, kaas oo loo yaqaan "circuit film dhumuc". Waa nooc ka mid ah wareegga yar ee Isku-dhafka ah. Jumper-ka Silver Paste Jumper ee PCBS-da hal dhinac ah sidoo kale waa daabacaadda filim dhumuc weyn leh laakiin uma baahna in lagu shido heerkul sare. Khadadka lagu daabaco dusha sare ee substrates kala duwan ayaa loo yaqaan "filim qaro weyn" oo kaliya marka dhumucdiisu ay ka badan tahay 0.1mm [4mil], iyo tignoolajiyada wax soo saarka ee "nidaamka wareegga" ee noocan oo kale ah waxaa loo yaqaan "teknoolajiyada filimka dhumucda leh".

26. Tignoolajiyada Filimka khafiifka ah
Waa kaari iyo wareegga isku xira ee ku xiran substrate-ka, halkaas oo dhumucdiisu ay ka yar tahay 0.1mm [4mil], oo ay sameeyeen Vacuum Uumi, Dahaarka Pyrolytic, Cathodic Sputtering, Kiimikada Uumiga Dhigashada, electroplating, anodizing, iwm, kaas oo loo yaqaan "dhuuban Tignoolajiyada filimada”. Alaabooyinka la taaban karo waxay leeyihiin Wareegga Isku-dhafka ah ee Filimka khafiifka ah iyo Wareegga Isku-dhafan ee khafiifka ah, iwm

27. Wareejinta Wareegga Laminatied

Waa hab cusub oo wax soo saarka guddiga wareegga, iyadoo la adeegsanayo dhumucdiisuna tahay 93mil ayaa laga baaraandegay saxan bir ah oo siman, marka hore samee wareejinta sawirada filimka qalalan ee qalalan, ka dibna xariiqda xawaaraha sare ee naxaasta. Ka dib markii la iska xayuubiyo filimka qalalan, dusha sare ee saxanka birta ah ee fiilada ah waxaa lagu cadaadin karaa heerkul sare filimka nus-adag. Ka dibna ka saar saxanka birta ah ee aan nadiifka ahayn, waxaad ka heli kartaa dusha sare ee wareegga wareegga ee wareegga wareegga. Waxaa ku xigi kara qodid iyo godadka dhejinta si loo helo isku xirka interlayer.

CC - 4 coppercomplexer4; Edelectro-deposited photoresist waa habka wax lagu daro oo ay samaysay shirkadda American PCK on substrate gaar ah oo aan naxaas lahayn (eeg maqaalka gaarka ah ee qodobka 47aad ee joornaalka macluumaadka guddiga wareegga si aad u hesho faahfaahin). MLC (Multilayer Ceramic) (laminar maxalli ah oo dhex mara dalool);PID saxan yar (Photo imagible Dielectric) looxyada wareegyada dhoobada badan; PTF (warbaahinta sawir-qaadista) Wareegga filim dhumuc weyn leh (oo leh xaashida dhejiska filimka qaro weyn ee guddiga wareegga daabacan) SLC (Surface Laminar Circuits); Xariiqda dahaarka dusha sare waa tignoolajiyad cusub oo ay daabacday shaybaadhka IBM Yasu, Japan bishii Juun 1993. Waa khad isku xidhid badan oo lakabyo ah oo leh daah Dahaarka rinjiga cagaaran iyo korantada ku dhejinaya bannaanka saxanka laba-geesoodka ah, taas oo meesha ka saaraysa baahida loo qabo qodista iyo godadka godadka saxanka.