(1) Sadar
Guud ahaan, ballaca xariiqda calaamaduhu waa 0.3mm (12mil), ballaca xadhka korontadu waa 0.77mm (30mil) ama 1.27mm (50mil); Masaafada u dhaxaysa xariiqda iyo xariiqda iyo suufka ayaa ka weyn ama la mid ah 0.33mm (13mil) ). Codsiyada la taaban karo, kordhi masaafada marka xaaladuhu oggolaadaan;
Marka cufnaanta fiilooyinka ay sarreeyaan, laba xariiq ayaa loo tixgelin karaa (laakin laguma talinayo) si loo isticmaalo biinanka IC. Ballaca xariiqu waa 0.254mm (10mil), kala dheerayntu waa mid aan ka yarayn 0.254mm (10mil). Xaalado gaar ah, marka biinanka qalabku ay cufan yihiin oo ballaciisu cidhiidhi yahay, ballaca xariiqda iyo kala dheeraynta xariiqda ayaa si habboon loo dhimi karaa.
(2) suuf (PAD)
Shuruudaha aasaasiga ah ee pads (PAD) iyo godadka kala-guurka (VIA) waa: dhexroorka saxanka ayaa ka weyn dhexroorka daloolka 0.6mm; tusaale ahaan, caabiyeyaasha biinanka ah ee ujeeddada guud, capacitors, iyo wareegyada isku dhafan, iwm., isticmaal xajmiga diskka/daloolada 1.6mm/0.8 mm (63mil/32mil), saldhigyada, biinanka iyo diodes 1N4007, iwm, qaataan 1.8mm/ 1.0mm (71mil/39mil). Codsiyada dhabta ah, waa in lagu go'aamiyaa iyadoo loo eegayo xajmiga qaybta dhabta ah. Haddii shuruuduhu oggolaadaan, cabbirka suufka si habboon ayaa loo kordhin karaa;
Aperture-ka ku rakibida ka kooban ee loogu talagalay PCB-ga waa in uu ahaadaa 0.2-0.4mm (8-16mil) oo ka weyn cabbirka dhabta ah ee biinka qaybta.
(3) Iyadoo loo marayo (VIA)
Guud ahaan 1.27mm/0.7mm (50mil/28mil);
Marka cufnaanta fiilooyinka ay sarreeyaan, cabbirka iyada oo loo marayo si habboon ayaa loo dhimi karaa, laakiin waa inaanay noqon mid aad u yar. Tixgeli isticmaalka 1.0mm/0.6mm (40mil/24mil).

(4) Shuruudaha boosaska suufka, khadadka, iyo fiisooyinka
PAD iyo VIA: ≥ 0.3mm (12mil)
PAD iyo PAD: ≥ 0.3mm (12mil)
PAD iyo RAAC: ≥ 0.3mm (12mil)
RAAC IYO LA SOCO: ≥ 0.3mm (12mil)
Cufnaanta sare:
PAD iyo VIA: ≥ 0.254mm (10mil)
PAD iyo PAD: ≥ 0.254mm (10mil)
PAD iyo RAAC: ≥ 0.254mm (10mil)
RAAC IYO LA SOCO: ≥ 0.254mm (10mil)