Mabda'a: Filim dabiici ah ayaa lagu sameeyay dusha naxaasta ee guddiga wareegga, kaas oo si adag u ilaalinaya dusha naxaasta cusub, sidoo kale wuxuu ka hortagi karaa oksaydhka iyo wasakhowga heerkulka sare. Dhumucda filimka OSP waxaa guud ahaan lagu xakameynayaa 0.2-0.5 microns.

1. Socodka geedi socodka: hoos u dhigista → biyaha dhaqida → micro-esion → biyaha dhaqida → dhaqida aashitada → biyo saafi ah → OSP → biyo saafi ah → qallajin.

2. Noocyada alaabta OSP: Rosin, Resin Firfircoon iyo Azole. Alaabta OSP ee ay isticmaasho Shenzhen United Circuits ayaa hadda si weyn loo isticmaalaa azole OSPs.

Waa maxay habka daaweynta dusha OSP ee guddiga PCB?

3. Features: flatness wanaagsan, ma IMC la sameeyay inta u dhaxaysa filimka OSP iyo naxaasta ee guddiga wareegga wareegga, jidaynayey alxanka tooska ah ee alxanka iyo naxaasta guddiga wareegga inta lagu guda jiro alxanka (qoynta wanaagsan), technology processing heerkulka hooseeya, qiimo jaban (qiimaha hoose). HASL), tamar yar ayaa la isticmaalaa inta lagu jiro farsamaynta, iwm. Waxaa loo isticmaali karaa labadaba looxyada wareegga-farsamada hooseeya iyo substrate-ka cufnaanta cufnaanta sare. PCB Proofing Yoko board waxay kicisaa cilladaha: ① Kormeerka muuqaalka waa adag yahay, kuma habboona alxanka dib u qulqulka badan (guud ahaan waxay u baahan tahay saddex jeer); ② Dusha filimka OSP way fududahay in la xoqo; ③ Shuruudaha deegaanka kaydinta ayaa sarreeya; ④ wakhtiga kaydinta waa gaaban yahay.

4. Habka kaydinta iyo wakhtiga: 6 bilood oo baakad vacuum ah (heerkulka 15-35 ℃, huurka RH≤60%).

5. Shuruudaha goobta SMT: ① Guddiga wareegga OSP waa in lagu hayaa heerkul hoose iyo huurka hoose (heerkulka 15-35°C, qoyaan RH ≤60%) kana fogaato soo-gaadhista deegaanka uu ka buuxo gaaska aashitada, kulankuna wuxuu bilaabmaa 48 gudahood. saacado kadib marka la furo xirmada OSP; ② Waxaa lagu talinayaa in la isticmaalo 48 saacadood gudahood ka dib markii gabal hal dhinac ah la dhammeeyo, waxaana lagu talinayaa in lagu badbaadiyo armaajo heerkul hoose halkii baakadaha vacuum;