Kusunga waya- nzira yekuisa chip paPCB
Kune mazana mashanu kusvika kumazana maviri machipisi akabatana kune yega yega wafer isati yapera. Kuti ushandise machipisi aya pazvinenge zvichidiwa, wafer inoda kuchekwa kuita machipisi ega obva abatanidzwa nekunze obatidzwa. Panguva ino, nzira yekubatanidza waya (nzira dzekutumira zviratidzo zvemagetsi) inonzi wire bonding.
Material ye wirebonding: goridhe / aluminium / mhangura
Material of wirebonding inotarwa nekunyatso tarisa zvakasiyana-siyana welding parameters uye nekuisanganisa nenzira yakanyatsokodzera. Maparamendi ari kurehwa pano anosanganisira zvinhu zvakawanda, zvinosanganisira semiconductor chigadzirwa mhando, kurongedza mhando, pad size, simbi inotungamira dhayamita, welding nzira, pamwe nekuvimbika zviratidzo senge kusimba uye kurebesa kwesimbi lead. Yakajairika simbi inotungamira zvinhu zvinosanganisira goridhe, aluminium uye mhangura. Pakati pavo, waya yegoridhe inonyanya kushandiswa semiconductor packaging.
Gold Wire ine yakanaka conductivity yemagetsi, yakagadzikana mumakemikari, uye ine yakasimba corrosion resistance. Zvisinei, kuipa kukuru kwewaya yealuminium, iyo yainyanya kushandiswa mumazuva ekutanga, yakanga iri nyore kuita ngura. Uyezve, kuoma kwewaya yegoridhe kwakasimba, saka inogona kuumbwa zvakanaka kuita bhora mumubatanidzwa wekutanga, uye inokwanisa kuumba semicircular lead loop (Loop, kubva pakutanga bonding kusvika yechipiri bonding) muchipiri bonding. chimiro chakaumbwa).
Aluminium Wire ine dhayamita hombe uye gomo rakakura kupfuura waya yegoridhe. Nokudaro, kunyange kana waya yegoridhe yakakwirira-yakachena ikashandiswa kugadzira loop inotungamira, haizoputsika, asi yakachena aruminiyamu waya inoputika nyore, saka inosanganiswa neimwe silicon kana magnesium kugadzira alloy. Aluminium waya inonyanya kushandiswa mukupisa-kupisa kurongedza (seHermetic) kana nzira dze ultrasonic uko waya yegoridhe haigone kushandiswa.
Kunyange zvazvo waya yemhangura yakachipa, kuoma kwayo kwakanyanya. Kana iyo kuoma kwakanyanyisa, hazvizove nyore kuumba kuita bhora chimiro, uye pane zvakawanda zvinogumira pakuumba lead loops. Uyezve, kudzvanywa kunofanirwa kuiswa kune chip pad panguva yebhora rekubatanidza maitiro. Kana kuoma kwakanyanyisa, kuputika kuchaonekwa mufirimu pazasi pedhi. Mukuwedzera, pachava ne "peeling" chiitiko umo iyo yakanyatsobatanidzwa pad layer inobvisa. Zvakadaro, sezvo iyo simbi wiring ye chip yakagadzirwa nemhangura, kune kuwedzera maitiro ekushandisa waya yemhangura mazuva ano. Zvechokwadi, kuitira kukurira kukanganisa kwemhangura yemhangura, inowanzosanganiswa nehuwandu hwezvimwe zvinhu kuti ugadzire alloy uye wozoshandiswa.