Kuenzaniswa neakajairwa edunhu mabhodhi, HDI edunhu mabhodhi ane zvinotevera mutsauko uye zvakanakira:
1.Size uye uremu
HDI bhodhi: Diki uye yakareruka.Nekuda kwekushandiswa kwepamusoro-density wiring uye mutete mutsara wakafara mutsara mutsara, HDI mabhodhi anogona kuwana yakawedzera compact dhizaini.
Ordinary circuit board: kazhinji yakakura uye inorema, yakakodzera nyore uye yakaderera-density wiring zvinodiwa.
2.Material uye chimiro
HDI redunhu bhodhi: Kazhinji shandisa mapaneru maviri seyakakosha bhodhi, uye wobva wagadzira yakawanda-layer chimiro kuburikidza nekuenderera mberi lamination, inozivikanwa se "BUM" kuunganidzwa kweakawanda akaturikidzana (circuit packaging tekinoroji).Kubatana kwemagetsi pakati pematanho kunowanikwa nekushandisa maburi madiki madiki nemakomba akavigwa.
Ordinary circuit board: Iyo yechinyakare yakawanda-layer dhizaini inonyanya kupindirana-layer yekubatanidza kuburikidza negomba, uye bofu rakavigwa gomba rinogona kushandiswa kuzadzisa kubatana kwemagetsi pakati pematanho, asi magadzirirwo ayo uye kugadzira kwayo kuri nyore, iyo aperture. yakakura, uye wiring density yakaderera, iyo yakakodzera kune yakaderera kusvika yepakati density application zvinodiwa.
3.Production process
HDI redunhu bhodhi: Kushandiswa kwelaser yakananga kuchera tekinoroji, inogona kuwana diki buri remapofu nemakomba akavigwa, aperture isingasviki 150um.Panguva imwecheteyo, izvo zvinodikanwa zvegomba chinzvimbo chekutonga, mutengo uye kugona kwekugadzira zvakakwirira.
Ordinary circuit board: kunyanya kushandiswa kwe mechanical drilling teknolojia, aperture uye nhamba yezvikamu zvinowanzova zvakakura.
4.Wiring density
HDI circuit board: Wiring density yakakwira, hupamhi hwemutsara uye nhambwe yemutsara kazhinji haipfuuri 76.2um, uye welding yekusangana kwepoindi density yakakura kudarika 50 per square centimita.
Ordinary circuit board: yakaderera wiring density, yakafara mutsara upamhi uye mutsara kureba, yakaderera welding yekuonana point density.
5. dielectric layer ukobvu
HDI mabhodhi: Iyo dielectric layer gobvu yakatetepa, kazhinji isingasviki 80um, uye ukobvu hwakafanana hwakakwira, kunyanya pamabhodhi-akakwirira-density mabhodhi uye akaputirwa substrates ane hunhu impedance control.
Ordinary circuit board: iyo dielectric layer gobvu yakakora, uye zvinodiwa pakufanana kwehukobvu zvakaderera.
6.Kuitwa kwemagetsi
HDI redunhu bhodhi: ine mashandiro emagetsi zvirinani, inogona kuwedzera simba rechiratidzo uye kuvimbika, uye ine kuvandudzwa kwakakosha mukukanganisika kweRF, kukanganiswa kwemagetsi emagetsi, kubuda kwemagetsi, kupisa kwemhepo uye zvichingodaro.
Ordinary circuit board: kushanda kwemagetsi kunenge kwakadzikira, kwakakodzera maapplication ane yakaderera chiratidzo chekufambisa zvinodiwa
7.Design flexibility
Nekuda kweiyo yakakwira density wiring dhizaini, HDI edunhu mabhodhi anogona kuona akaomarara edunhu madhizaini munzvimbo shoma.Izvi zvinopa vagadziri kushanduka kukuru kana vachigadzira zvigadzirwa, uye kugona kuwedzera kushanda uye kuita pasina kuwedzera saizi.
Kunyangwe HDI edunhu mabhodhi ane mabhenefiti ari pachena mukuita uye dhizaini, maitiro ekugadzira akaomarara, uye zvinodiwa zvemidziyo uye tekinoroji zvakakwirira.Dunhu rePullin rinoshandisa tekinoroji yepamusoro-soro senge laser drilling, kurongeka kwakaringana uye micro-mapofu gomba kuzadza, iyo inova nechokwadi chemhando yepamusoro yeHDI board.
Kuenzaniswa nemabhodhi edunhu akajairwa, HDI edunhu mabhodhi ane yakakwira wiring density, zvirinani magetsi ekushanda uye saizi diki, asi maitiro avo ekugadzira akaomarara uye mutengo wakakwira.Iyo yakazara wiring density uye mashandiro emagetsi echinyakare akawanda-layer edunhu mabhodhi haana kunaka seHDI edunhu mabhodhi, akakodzera epakati uye akaderera density application.