Nhanganyaya yeGobvu Copper Circuit BoardVadivelu Comedy Technology

(1) Pre-plating kugadzirira uye electroplating kurapwa

Chinangwa chikuru chekukora copper plating ndeyekuona kuti pane gobvu rakakwana remhangura yekuisa mugomba kuti ive nechokwadi chekuti kukosha kwekupokana kuri mukati mechikamu chinodiwa nemaitiro. Se plug-in, ndeyekugadzirisa chinzvimbo uye kuve nechokwadi chekubatanidza simba; semudziyo wakaiswa pamusoro, mamwe maburi anongo shandiswa semaburi, ayo anoita basa rekuitisa magetsi kumativi ese.

(2) Zvinhu zvekuongorora

1. Kunyanya kutarisa metallization quality yegomba, uye ona kuti hapana kudarika, burr, gomba dema, gomba, nezvimwewo mugomba;

2. Tarisa kana pane tsvina uye zvimwe zvakanyanyisa pamusoro pe substrate;

3. Tarisa nhamba, nhamba yekudhirowa, gwaro rekugadzirisa uye tsanangudzo yemaitiro e substrate;

4. Tsvaga nzvimbo yekusimudza, kukwira zvinodiwa uye nzvimbo yekuputira iyo tangi yeplating inogona kutakura;

5. Nzvimbo yeplating uye maitiro ekugadzirisa anofanirwa kuve akajeka kuti ave nechokwadi chekugadzikana uye kugona kweiyo electroplating process parameters;

6. Kucheneswa uye kugadzirira conductive zvikamu, kutanga electrification kurapwa kuita mhinduro kushanda;

7. Sarudza kana kuumbwa kwemvura yekugezera kwakakodzera uye nepamusoro penzvimbo ye electrode plate; kana spherical anode yakaiswa mukoromo, kushandiswa kunofanirawo kuongororwa;

8. Tarisa kusimba kwezvikamu zvekusangana uye kushanduka kwehuwandu hwemagetsi uye ikozvino.

(3) Kudzora kwehunhu hwemhangura yakakora

1. Nyatsoverenga nzvimbo yeplating uye utaure nezve pesvedzero yemaitiro chaiwo ekugadzira pane yazvino, sarudza nemazvo kukosha kunodiwa kwezvino, tenzi shanduko yezvino mukuita kwe electroplating, uye simbisa kugadzikana kweiyo electroplating process parameters. ;

2. Pamberi pe electroplating, tanga kushandisa bhodhi rekugadzirisa bhodhi rekuedza, kuitira kuti bhati rive mumamiriro ekushanda;

3. Sarudza nzira yekuyerera kwehuwandu hwemazuva ano, uye wozosarudza kurongeka kwemahwendefa akarembera. Muchidimbu, inofanira kushandiswa kubva kure kusvika pedyo; kuve nechokwadi chekufanana kwekugovera ikozvino pane chero nzvimbo;

4. Kuti uve nechokwadi chekufananidzwa kwekuputira mugomba uye kuwirirana kwehupamhi hwehuputi, kuwedzera kune zviyero zvetekinoroji zvekukurudzira uye kusefa, inofanirwawo kushandisa impulse current;

5. Gara uchitarisa kuchinja kwezvino panguva ye electroplating process kuti uone kuvimbika uye kugadzikana kwekukosha kwemazuva ano;

6. Tarisa uone kana ukobvu hwemhangura plating layer yegomba inosangana nezvinodiwa zvehunyanzvi.

(4) Copper plating process

Mukuita kwekukora kwemhangura plating, maparamendi ekuita anofanirwa kugara achitariswa, uye kurasikirwa kusingakoshi kunowanzo kukonzereswa nekuda kwezvikonzero uye chinangwa. Kuti uite basa rakanaka rekukora simbi yemhangura, zvinotevera zvinofanirwa kuitwa:

1. Maererano nenzvimbo yakakosha inoverengwa nekombuta, yakabatanidzwa nechiitiko chinogara chichiunganidzwa mukugadzirwa chaiko, kuwedzera imwe kukosha;

2. Zvinoenderana neyakaverengerwa kukosha kwazvino, kuti uve nechokwadi chekutendeseka kweiyo plating layer mugomba, zvinodikanwa kuwedzera imwe kukosha, ndiko kuti, inrush current, pane yepakutanga kukosha kwezvino, uye wozodzokera kune kukosha kwepakutanga mukati menguva pfupi;

3. Apo electroplating yebhodhi redunhu inosvika maminitsi mashanu, tora kunze kwe substrate kuti uone kana mhangura yemhangura pamusoro pepamusoro uye rusvingo rwomukati rwegomba rwakakwana, uye zviri nani kuti maburi ose ane metallic luster;

4. Imwe nzvimbo inofanira kuchengetedzwa pakati pe substrate ne substrate;

5. Kana iyo yakakora yemhangura yemhangura inosvika panguva inodiwa ye electroplating, imwe chiyero chemazuva ano inofanira kuchengetedzwa panguva yekubviswa kwe substrate kuti ione kuti nzvimbo uye maburi e substrate inotevera haizosvibiswi kana kusviba.

Zvekungwaririra:

1. Tarisa magwaro ekugadzirisa, verenga zvinodiwa uye uzive machining blueprint ye substrate;

2. Tarisa pamusoro pe substrate yezvikwepa, indentations, pachena mhangura zvikamu, nezvimwewo;

3. Ita muyedzo wekugadzirisa maererano ne mechanical processing floppy disk, ita yekutanga pre-kuongorora, uye wozogadzirisa zvose workpieces mushure mekusangana nezvinodiwa zvetekinoroji;

4. Gadzirira maturusi ekuyera uye mamwe maturusi anoshandiswa kutarisa zviyero zvejometri zve substrate;

5. Maererano neyakasvibirira zvinhu zvekugadzirisa substrate, sarudza chigayo chakakodzera chekugadzira (milling cutter).

(5) Kudzora kwemhando

1. Nyatsoshandisa yekutanga chinyorwa chekuongorora system kuona kuti saizi yechigadzirwa inosangana nezvinodiwa zvekugadzira;

2. Zvinoenderana neyakaomeswa yedunhu bhodhi, zvine musoro sarudza milling process parameters;

3. Paunenge uchigadzirisa nzvimbo yebhodhi redunhu, nyatsoisungirira kuti usakuvadza kune solder layer uye solder mask pamusoro pebhodhi redunhu;

4. Kuti uve nechokwadi chekuenderana kwezviyero zvekunze zve substrate, kurongeka kwenzvimbo kunofanira kunyatsodzorwa;

5. Pakuparadzanisa uye kuunganidza, kunyanya kukoshesa kunofanira kubhadharwa kune padding base layer ye substrate kuti udzivise kukuvadzwa kumucheka wekuputira pamusoro pebhodhi redunhu.