Izvo zvinonyanya kubata maziso PCB zvigadzirwa muna 2020 zvicharamba zvichikura zvakanyanya mune ramangwana

Pakati pezvigadzirwa zvakasiyana-siyana zvepasi rose redunhu mabhodhi muna 2020, kukosha kwekubuda kwema substrates kunofungidzirwa kuve nekukura kwepagore kwe18.5%, inova ndiyo yepamusoro-soro pakati pezvigadzirwa zvese. Iko kukosha kwekubuda kwema substrates kwasvika 16% yezvese zvigadzirwa, yechipiri chete kune multilayer Board uye soft board. Chikonzero nei bhodhi rekutakura rakaratidza kukura kwakanyanya muna 2020 rinogona kupfupikiswa sezvikonzero zvakati wandei: 1. Global IC shipments inoramba ichikura. Zvinoenderana nedata reWSTS, iyo yepasi rose IC yekugadzira kukosha kwekukura mwero muna 2020 ingangoita 6%. Kunyange zvazvo chiyero chekukura chiri kuderera zvishoma kudarika chiyero chekukura kwehuwandu hwekubuda, inofungidzirwa kuva inenge 4%; 2. Iyo yepamusoro-unit mutengo ABF mutakuri webhodhi iri mukudiwa kwakasimba. Pamusana pekukura kukuru kwekudiwa kwezviteshi zve 5G uye makombiyuta epamusoro-soro, mapikisi makuru anoda kushandisa ABF mabhodhi ekutakura Mhedzisiro yekukwira kwemutengo uye vhoriyamu yakawedzerawo chiyero chekukura kwekubuda kwebhodhi rekutakura; 3. Kutsva kutsva kwemabhodhi ekutakura anobva ku5G mafoni efoni. Kunyangwe kutumirwa kwenharembozha dze5G muna 2020 kwakadzikira pane zvaitarisirwa nemamiriyoni mazana maviri chete, iyo millimeter wave 5G Kuwedzera kwehuwandu hwemamodule eAiP munharembozha kana huwandu hwePA module muRF kumberi-kumagumo ndicho chikonzero kuwedzera kudiwa kwemapuranga ekutakura. Zvese mune zvese, kungave kuri kuvandudzwa kwetekinoroji kana kudiwa kwemusika, iyo 2020 inotakura bhodhi pasina mubvunzo ndiyo inonyanya kubata maziso chigadzirwa pakati pese redunhu bhodhi zvigadzirwa.

Iyo inofungidzirwa maitiro ehuwandu hweIC mapakeji munyika. Idzo mhando dzepasuru dzakakamurwa kuita yepamusoro-yekupedzisira inotungamira furemu mhando QFN, MLF, SON…, yechinyakare inotungamira furemu mhando SO, TSOP, QFP…, uye mashoma mapini DIP, ari pamusoro matatu marudzi ese anongoda inotungamira furemu yekutakura IC. Tichitarisa kushanduka kwenguva refu muzvikamu zvemarudzi akasiyana-siyana emapakeji, chiyero chekukura kwewafer-level uye bare-chip package ndiyo yakakwirira. Huwandu hwekukura kwepagore kubva muna 2019 kusvika 2024 hwakakwira kusvika pa10.2%, uye chikamu chehuwandu hwepasuru yacho zvakare 17.8% muna 2019. , Inokwira kusvika pa20.5% muna 2024. , nharembozha, midziyo inopfekwa…icharamba ichikura mune ramangwana, uye rudzi urwu rwechigadzirwa harudi machipisi akaomarara, saka rinosimbisa kureruka uye kufunga kwemitengo Tevere, mukana wekushandisa wafer-level packaging yakanyanya. Kana ari emhando yepamusoro-yekupedzisira pasuru anoshandisa mabhodhi ekutakura, anosanganisira akajairwa BGA uye FCBGA mapakeji, chiyero chekukura kwepagore kubva 2019 kusvika 2024 chingangoita 5%.

 

Iko kugoverwa kwemusika kugoverwa kwevagadziri mumusika wepasi rose inotakura bhodhi ichiri kutungamirwa neTaiwan, Japan neSouth Korea zvichibva mudunhu remugadziri. Pakati pavo, chikamu chemusika cheTaiwan chiri pedyo ne40%, zvichiita kuti ive nzvimbo huru yekutakura bhodhi yekugadzira nzvimbo panguva ino, South Korea Mutengo wemusika wevagadziri veJapan nevagadziri veJapan vari pakati pepamusoro-soro. Pakati pavo, vagadziri veKorea vakakura nokukurumidza. Kunyanya, zvikamu zveSEMCO zvakakura zvakanyanya zvichifambiswa nekukura kwekutumirwa kwenharembozha yeSamsung.

Kana iri yeramangwana bhizinesi mikana, iyo 5G kuvaka iyo yakatanga muhafu yechipiri ye2018 yakagadzira kudiwa kweABF substrates. Mushure mekunge vagadziri vawedzera huwandu hwavo hwekugadzira muna 2019, musika uchiri mushoma. Vagadziri veTaiwanese vakatoisa mari inodarika NT $ 10 bhiriyoni kuvaka hutsva hwekugadzira, asi ichasanganisira mabhesi mune ramangwana. Taiwan, midziyo yekutaurirana, makomputa anoshanda zvakanyanya… zvese zvichawana kudiwa kwemabhodhi anotakura eABF. Zvinofungidzirwa kuti 2021 richange richiri gore umo kudiwa kweABF mabhodhi ekutakura kunonetsa kusangana. Pamusoro pezvo, kubvira Qualcomm yatanga iyo AiP module muchikamu chechitatu chegore ra2018, 5G smart phones yatora AiP kuvandudza kugona kwekugamuchira masaini kwenharembozha. Kana ichienzaniswa neyekare 4G mafoni akachenjera achishandisa mabhodhi akapfava seantenna, iyo AiP module ine antenna pfupi. , RF chip…etc. akaiswa mune imwe module, saka kudiwa kweAiP carrier board kuchatorwa. Mukuwedzera, 5G terminal yekutaurirana michina inogona kuda 10 kune 15 AiPs. Imwe neimwe AiP antenna array yakagadzirwa ne4 × 4 kana 8 × 4, iyo inoda nhamba yakakura yemabhodhi ekutakura. (TPCA)