Musiyano uye basa redunhu bhodhi solder layer uye solder mask

Nhanganyaya kune Solder Mask

Iyo yekupikisa pad is soldermask, iyo inoreva chikamu chebhodhi redunhu kuti rizopendwa nemafuta egirinhi. Muchokwadi, iyi solder mask inoshandisa kuburitsa kwakashata, saka mushure meiyo chimiro che solder mask yakamisikidzwa kubhodhi, iyo solder mask haina kupendwa negirinhi mafuta, asi ganda remhangura rinoburitswa. Kazhinji kuti uwedzere kukora kweganda remhangura, solder mask inoshandiswa kunyora mitsetse kuti ibvise mafuta akasvibira, uye tini inowedzerwa kuwedzera kukora kwetambo yemhangura.

Zvinodiwa zve solder mask

Iyo solder mask yakakosha mukudzora kukanganiswa kwekutengesa mu reflow soldering. Vagadziri vePCB vanofanirwa kudzikisira nzvimbo kana mapeji emhepo akatenderedza mapadhi.

Kunyangwe akawanda mainjiniya ekugadzira angasarudza kupatsanura ese mapedhi pabhodhi ane solder mask, iyo pini spacing uye pad saizi yezvakanaka-pitch zvikamu zvinoda kutariswa kwakanyanya. Kunyangwe mazaru emasolder mask kana mahwindo asina kuganhurwa pamativi mana eqfp angave anogamuchirwa, zvingave zvakanyanya kunetsa kudzora mabhiriji ekutengesa pakati pepini yechikamu. Kune iyo solder mask ye bga, makambani mazhinji anopa solder mask isingabati mapedhi, asi inovhara chero maficha pakati pemapedhi kudzivirira mabhiriji ekutengesa. Mazhinji epamusoro pegomo maPCB akafukidzwa nemasolder mask, asi kana ukobvu hwemasolder mask hwakakura kupfuura 0.04mm, zvinogona kukanganisa kushandiswa kwesolder paste. Surface mount PCBs, kunyanya ayo anoshandisa zvakanaka-pitch zvikamu, anoda yakaderera photosensitive solder mask.

Kugadzirwa kwebasa

Solder mask zvinhu zvinofanirwa kushandiswa kuburikidza nemvura yakanyorova maitiro kana yakaoma firimu lamination. Dry film solder mask zvinhu zvinopihwa muhupamhi hwe 0.07-0.1mm, iyo inogona kukodzera kune zvimwe zvigadzirwa zvepamhepo, asi chinhu ichi hachikurudzirwe kune yepedyo-pitch application. Makambani mashoma anopa mafirimu akaomeswa akatetepa zvakakwana kuti asangane neakanaka pitch standard, asi kune mashoma makambani anogona kupa mvura photosensitive solder mask zvinhu. Kazhinji, iyo solder mask yekuvhura inofanira kunge yakakura 0.15mm pane pad. Izvi zvinobvumira gap re 0.07mm pamucheto wepadhi. Yakaderera-profile liquid photosensitive solder mask zvinhu zvine hupfumi uye zvinowanzo kunyorerwa pamusoro pegomo maapplication kuti ape chaiwo masaizi uye mapundu.

 

Nhanganyaya kune soldering layer

Iyo solder layer inoshandiswa kune SMD kurongedza uye inoenderana nemapadhi eSMD zvikamu. Mukugadzirisa SMT, ndiro yesimbi inowanzo shandiswa, uye PCB inoenderana nechikamu pads inorohwa, uye ipapo solder paste inoiswa pandiro yesimbi. Kana iyo PCB iri pasi pendiro yesimbi, solder paste inodonhedza, uye ingori pane imwe neimwe pad Inogona kusvibiswa ne solder, saka kazhinji mask solder haifanire kunge yakakura kupfuura saizi chaiyo yepadhi, zviri nani isingasviki kana kuenzana ne saizi yepadhi chaiyo.

Chiyero chinodiwa chinenge chakangofanana neicho chepamusoro pezvikamu, uye zvinhu zvikuru ndezvizvi:

1. BeginLayer: ThermalRelief neAnTIPad yakakura ne0.5mm pane saizi chaiyo yepedhi yenguva dzose.

2. EndLayer: ThermalRelief neAnTIPad yakakura ne0.5mm pane saizi chaiyo yepadhi yenguva dzose.

3. DEFAULTINTERNAL: yepakati layer

 

Basa re solder mask uye flux layer

Iyo solder mask layer inonyanya kudzivirira foil yemhangura yedare redunhu kuti isaburitswe zvakananga kumhepo uye inoita basa rekudzivirira.

Iyo solder layer inoshandiswa kugadzira simbi mesh yesimbi mesh fekitori, uye mesh yesimbi inogona kunyatsoisa solder paste pamapatch pads anoda kutengeswa kana tinning.

 

Musiyano uripo pakati pePCB solder layer uye solder mask

Iwo maviri akaturikidzana anoshandiswa pakusodha. Hazvirevi kuti imwe inotengeswa uye imwe mafuta yakasvibirira; asi:

1. Iyo solder mask layer inoreva kuvhura hwindo pamafuta egirini eiyo yese solder mask, chinangwa ndechekubvumidza welding;

2. By default, nzvimbo isina solder mask inofanira kupendwa negirini mafuta;

3. Iyo solder layer inoshandiswa kune SMD packaging.