PaPCB, nickel inoshandiswa se substrate coating kune akakosha uye base masimbi. PCB low-stress nickel deposits inowanzoputirwa neWatt nickel plating solutions uye mamwe sulfamate nickel plating solutions ine additives inoderedza kushushikana. Rega vagadziri vehunyanzvi vakuongorore matambudziko api anowanzo sangana nawo PCB nickel plating kana uchiishandisa?
1. Nickel process. Nekupisa kwakasiyana, kupisa kwekugezera kunoshandiswa kwakasiyanawo. Mune nickel plating mhinduro ine tembiricha yepamusoro, iyo nickel plating layer inowanikwa ine yakaderera mukati kushushikana uye yakanaka ductility. Iyo yakawanda yekushanda tembiricha inochengetwa pa55 ~ 60 madhigirii. Kana kutonhora kwakanyanya, nickel saline hydrolysis ichaitika, zvichiita kuti pinholes muvhare uye panguva imwechete kuderedza cathode polarization.
2. PH kukosha. Iko PH kukosha kwe nickel-plated electrolyte ine simba guru pakuita kwekuputira uye kushanda kwe electrolyte. Kazhinji, kukosha kwepH ye nickel plating electrolyte yePCB inochengetwa pakati pe 3 ne 4. Nickel plating solution ine PH yakakosha ine simba rekuparadzira uye cathode ikozvino. Asi iyo PH yakanyanya kukwirira, nekuti cathode inoramba ichichinja haidhirojeni panguva ye electroplating process, kana yakakura kupfuura 6, inokonzeresa mapinho muchikamu cheplating. Nickel plating solution ine yakaderera PH ine nani anode dissolution uye inogona kuwedzera zvirimo nickel munyu mu electrolyte. Nekudaro, kana pH yakadzikira, tembiricha yekuwana yakapenya yeplating layer inodzikiswa. Kuwedzera nickel carbonate kana basic nickel carbonate inowedzera kukosha kwePH; kuwedzera sulfamic acid kana sulfuric acid kunoderedza pH kukosha, uye kutarisa nekugadzirisa kukosha kwePH maawa mana ega ega panguva yebasa.
3. Anode. Iyo yakajairwa nickel plating yePCBs inogona kuoneka parizvino yese inoshandisa soluble anodes, uye zvakajairika kushandisa titanium mabhasikiti seanode yemukati nickel angle. Dengu retitanium rinofanirwa kuiswa mubhegi reanode rakarukwa nepolypropylene zvinhu kudzivirira anode dope kuti isadonhe mumushonga weplating, uye inofanirwa kucheneswa nguva nenguva nekutariswa kuti ziso rakatsetseka here.
4. Kucheneswa. Kana paine organic kusvibiswa mune yeplating mhinduro, inofanirwa kurapwa neyakagadzirwa kabhoni. Asi iyi nzira inowanzobvisa chikamu chekugadzirisa-kuderedza mumiririri (kuwedzera), iyo inofanira kuwedzerwa.
5. Ongororo. Iyo yeplating mhinduro inofanirwa kushandisa iwo makuru mapoinzi eiyo maitiro mirau inotsanangurwa mukugadzirisa maitiro. Nguva nenguva ongorora kuumbwa kweiyo plating mhinduro uye iyo Hull cell bvunzo, uye tungamira dhipatimendi rekugadzira kuti rigadzirise maparamita emushonga weplating zvinoenderana nemaparamita akawanikwa.
6. Kukurudzira. Iyo nickel plating process yakafanana nemamwe maitiro e electroplating. Chinangwa chekusimudzira ndechekumhanyisa nzira yekufambisa yakawanda kuderedza shanduko yekutarisa uye kuwedzera muganho wepamusoro weiyo inobvumidzwa density. Iko kune zvakare yakakosha mhedzisiro yekumhanyisa mhinduro yeplating, iri kudzikisa kana kudzivirira mapinho munickel plating layer. Inowanzo shandiswa compressed air, cathode movement uye kumanikidzirwa kutenderera (kusanganiswa ne carbon core uye cotton core filtration) inokurudzira.
7. Cathode ikozvino density. Cathode ikozvino density ine mhedzisiro pane cathode ikozvino kushanda zvakanaka, deposition rate uye coating quality. Paunenge uchishandisa electrolyte ine PH yakaderera ye nickel plating, munzvimbo yakaderera yemazuva ano density, cathode ikozvino inoshanda inowedzera nekuwedzera ikozvino; munzvimbo yakakwirira yemazuva ano density, iyo cathode ikozvino inoshanda yakasununguka kune yazvino density; apo paunenge uchishandisa yakakwirira PH Kana electroplating liquid nickel, ukama pakati cathode ikozvino kunyatsoshanda uye ano density haina kukosha. Sezvimwe nemamwe marudzi ekuputira, huwandu hwe cathode yazvino density yakasarudzirwa nickel plating inofanirawo kuenderana nekuumbwa, tembiricha uye zvinokurudzira mamiriro ekugadzirisa.