1. Additive Process
Ikemikari yemhangura yemhangura inoshandiswa pakukura kwakananga kwemitsara yekonduki yemunharaunda pane isiri-conductor substrate pamusoro nekubatsirwa kweimwe inhibitor.
Nzira dzekuwedzera mubhodhi redunhu dzinogona kugoverwa mukuwedzera kuzere, hafu yekuwedzera uye chikamu chekuwedzera uye dzimwe nzira dzakasiyana.
2. Backpanels, Backplanes
Iyo gobvu (senge 0.093 ″,0.125 ″) redunhu bhodhi, rinonyanya kushandiswa plug nekubatanidza mamwe mabhodhi. Izvi zvinoitwa nekuisa multi-pini Connector mugomba rakaoma, asi kwete nekutengesa, uye ipapo wiring imwe neimwe muwaya iyo Connector inopfuura nepabhodhi. Iyo yekubatanidza inogona kuiswa zvakasiyana mune general circuit board. Nekuda kweiyi bhodhi rakakosha, iro 'kuburikidza negomba harigone solder, asi rega gomba madziro uye kutungamira waya yakananga kadhi yakasimba kushandiswa, saka kunaka kwayo uye aperture zvinodiwa zvakanyanya kuomarara, huwandu hwayo hwekurongeka hahuna kuwanda, general circuit board fekitori. haidi uye haisi nyore kugamuchira rudzi urwu rwekurongeka, asi rakapotsa rave giredhi repamusoro reindasitiri ine hunyanzvi muUnited States.
3. BuildUp process
Iyi inzvimbo nyowani yekugadzira iyo yakatetepa multilayer, kuvhenekerwa kwekutanga kunotorwa kubva kuIBM SLC maitiro, mune yayo yeJapan Yasu chirimwa chekuyedza kugadzirwa kwakatanga muna 1989, iyo nzira yakavakirwa pane echinyakare mapaneru, sezvo maviri ekunze mapaneru akatanga akazara mhando. yakadai seProbmer52 isati yaputira mvura ine photosensitive, mushure mehafu yekuoma uye yakaoma mhinduro senge kugadzira migodhi neiyo inotevera layer yeakadzika fomu "sense of optical hole" (Mufananidzo - Via), uyezve kumakemikari akazara kuwedzera conductor yemhangura nemhangura plating. layer, uye pashure mutsara imaging uye etching, anogona kuwana waya itsva uye nechepasi interconnection kuvigwa gomba kana bofu buri. Kudzokororwa kwakadzokororwa kunopa huwandu hunodiwa hwezvikamu. Iyi nzira haigoni kungodzivirira mari inodhura yekuchera michina, asiwo kuderedza gomba dhayamita kusvika pasi pe10mil. Kwemakore mashanu kusvika matanhatu apfuura, marudzi ese ekutyora iyo yechinyakare layer anotora inoteedzana multilayer tekinoroji, muEuropean indasitiri pasi pekusundidzira, ita yakadaro BuildUp process, zvigadzirwa zviripo zvakanyorwa zvinopfuura marudzi gumi. Kunze kwe "photosensitive pores"; Mushure mekubvisa chivharo chemhangura nemakomba, nzira dzakasiyana dze "gomba rekugadzira" senge alkaline kemikari Etching, Laser Ablation, uye Plasma Etching inogamuchirwa kune organic mahwendefa. Pamusoro pezvo, iyo itsva Resin Coated Copper Foil (Resin Coated Copper Foil) yakavharwa nehafu-yakaomeswa resin inogonawo kushandiswa kugadzira ndiro yakatetepa, diki uye nhete-multi-layer plate ine Sequential Lamination. Mune ramangwana, zvakasiyana-siyana zvigadzirwa zvemagetsi zvega zvinozoita rudzi urwu rwekutetepa uye kupfupika-mazhinji-mabhodhi epasirese.
4. Cermet
Ceramic poda uye simbi poda zvakasanganiswa, uye adhesive inowedzerwa semhando yekuputira, iyo inogona kudhindwa pamusoro pedunhu redunhu (kana remukati layer) nefirimu gobvu kana firimu rakatetepa, se "resistor" kuiswa, panzvimbo ye iyo yekunze resistor panguva yekuungana.
5. Co-Firing
Icho chiitiko che porcelain Hybrid redunhu bhodhi. Mitsetse yedunhu reThick Firimu Paste yemasimbi anokosha akasiyana-siyana akadhindwa pamusoro pebhodhi diki anopiswa nekupisa kwakanyanya. Iwo akasiyana organic anotakura mune gobvu firimu paste anopiswa, achisiya mitsetse yeakakosha simbi conductor kuti ishandiswe sewaya dzekubatanidza.
6. Crossover
Iwo matatu-dimensional kuyambuka kwewaya mbiri pamusoro pebhodhi uye kuzadza kwepakati inodzivirira pakati pemadonhwe ekudonha kunonzi. Kazhinji, pendi imwe yegirini pendi pamwe nekabhoni firimu jumper, kana nzira yekuisa pamusoro uye pazasi waya ndiyo "Crossover".
7. Discreate-Wiring Board
Rimwe izwi rekuti multi-wiring board , inogadzirwa newaya yakatenderedzwa enameled yakasungirirwa pabhodhi uye yakaputika nemakomba. Kuita kwerudzi urwu rwemultiplex board mune yakakwira frequency transmission line iri nani pane flat square mutsara wakamisikidzwa neyakajairwa PCB.
8. DYCO hurongwa
Iyo kambani yeSwitzerland Dyconex yakagadzira iyo Buildup of the process muZurich. Iyo inzira ine patent yekubvisa foil yemhangura panzvimbo dzemakomba paplate pamusoro pekutanga, wozoiisa munzvimbo yakavharwa vacuum, wozoizadza neCF4, N2, O2 kuti ionize pamhepo yakakwira kuita Plasma inoshanda zvakanyanya. , iyo inogona kushandiswa kuodza zvigadziko zvenzvimbo dzine perforated uye kugadzira maburi madiki egwara (pazasi pe10mil). Maitiro ekutengesa anonzi DYCOstrate.
9. Electro-Deposited Photoresist
Electrical photoresistance, electrophoretic photoresistance ndiyo itsva "photosensitive resistance" nzira yekuvaka, yakatanga kushandiswa pakuonekwa kwezvinhu zvakaoma zvesimbi "pendi yemagetsi", ichangobva kuiswa kune "photoresistance" application. Nenzira ye electroplating, inochajiswa colloidal zvimedu zve photosensitive charged resin inoputirwa zvakafanana pamusoro pemhangura pamusoro pebhodhi redunhu se inhibitor kurwisa etching. Parizvino, yakashandiswa mukugadzirwa kwakawanda mukuita kwemhangura yakananga etching yemukati laminate. Iyi mhando ye ED photoresist inogona kuiswa mune anode kana cathode zvakateerana zvichienderana neakasiyana nzira dzekushanda, dzinodaidzwa kuti "anode photoresist" uye "cathode photoresist". Zvinoenderana neyakasiyana photosensitive musimboti, kune "photosensitive polymerization" (Negative Working) uye "photosensitive decomposition" (Positive Working) nemamwe marudzi maviri. Parizvino, iyo yakashata mhando yeED photoresistance yakatengeswa, asi inogona kushandiswa chete seanoronga kuramba agent. Nekuda kwekuomerwa kwephotosensitive muburi-buri, haigone kushandiswa kuchinjisa mufananidzo wendiro yekunze. Kana iri "positive ED", iyo inogona kushandiswa sephotoresist agent yekunze kweplate (nekuda kwe photosensitive membrane, kushaikwa kwephotosensitive effect pamadziro egomba haina kukanganiswa), indasitiri yeJapan ichiri kuwedzera kuedza tengesa kushandiswa kwekugadzirwa kwehuwandu, kuitira kuti kugadzirwa kwemitsetse yakatetepa kuve nyore kuwanikwa. Izwi iri rinonzi zvakare Electrothoretic Photoresist.
10. Flush Conductor
Ibhodhi redunhu rakakosha rakati sandarara muchitarisiko uye rinodzvanya mitsetse yese yemakondakita mundiro. Muitiro wepanera rayo rimwe chete kushandisa nzira yekufambisa yemifananidzo kuisa chikamu chemhangura foil yebhodhi repamusoro pane base zvinhu bhodhi iro rakaomeswa semi-rakaoma. Kupisa kwepamusoro uye nzira yekudzvinyirirwa kwepamusoro ichave iyo bhodhi mutsetse mukati mehafu-yakaomeswa ndiro, panguva imwe chete kupedzisa ndiro resin kuomesa basa, kupinda mutsetse kupinda pamusoro uye ose flat redunhu bhodhi. Kazhinji, ganda rakatetepa remhangura rinodzikwa kubva panzvimbo inodzokororwa yedunhu kuitira kuti 0.3mil nickel layer, 20-inch rhodium layer, kana 10-inch goridhe layer inogona kuputirwa kuti ipe yakaderera kubata kuramba uye nyore kutsvedza panguva yekutsvedza. . Nekudaro, iyi nzira haifanirwe kushandiswa kuPTH, kuitira kudzivirira gomba kubva pakuputika kana uchidzvanya. Hazvisi nyore kuwana nzvimbo yakatsetseka yebhodhi, uye haifanirwe kushandiswa pakupisa kwakanyanya, kana resin ikawedzera uye yobva yasundira mutsetse kunze kwepamusoro. Iyo inozivikanwawo seEtchand-Push, Bhodhi rakapedzwa rinonzi Flush-Bonded Board uye rinogona kushandiswa kune zvakakosha zvakadai seRotary Switch uye Wiping Contacts.
11. Frit
MuPoly Thick Firimu (PTF) kudhinda paste, kuwedzera kune akakosha simbi makemikari, girazi poda ichiri kudiwa kuti iwedzererwe kuitira kutamba mhedzisiro ye condensation uye kunamatira mukunyungudika kwepamusoro-tembiricha, kuitira kuti kudhinda kunama. iyo isina chinhu ceramic substrate inogona kuumba yakasimba yakakosha simbi yedunhu system.
12. Yakazara-Yekuwedzera Maitiro
Iri papepa repamusoro pekuvhara zvakakwana, pasina electrodeposition yesimbi nzira (yakawanda ikemikari yemhangura), kukura kwemaitiro akasarudzwa edunhu, mamwe matauriro asina kunyatsojeka ndeye "Fully Electroless".
13. Hybrid Integrated Circuit
Iyo diki porcelain yakatetepa substrate, mune yekudhinda nzira yekushandisa yakanakisa simbi conductive inki mutsetse, uyezve nepamusoro tembiricha ingi organic nyaya yakapiswa, ichisiya conductor mutsetse pamusoro, uye inogona kuita pamusoro pekubatanidza zvikamu zvewelding. Iyo imhando yemutakuri wedunhu gobvu firimu tekinoroji pakati yakadhindwa redunhu bhodhi uye semiconductor yakabatanidzwa yedunhu mudziyo. Yakamboshandiswa mauto kana yakakwirira-frequency application, iyo Hybrid yakakura zvishoma nekukurumidza mumakore achangopfuura nekuda kwekudhura kwayo, kuderera kwemauto ehondo, uye kuomerwa mukugadzira otomatiki, pamwe nekuwedzera kweminiaturization uye sophistication yemabhodhi edunhu.
14. Mutauriri
Interposer inoreva chero mitsara miviri yemakondukita anotakurwa nemuviri unodzivirira ari conductive nekuwedzera imwe conductive filler panzvimbo ichave conductive. Semuyenzaniso, mugomba risina chinhu replate yakawanda, zvinhu zvakaita sekuzadza sirivheri paste kana copper paste kutsiva orthodox mhangura gomba madziro, kana zvinhu zvakaita vertical unidirectional conductive rubber layer, zvese zvinopindirana zverudzi urwu.
15. Laser Direct Imaging (LDI)
Iko kudzvanya ndiro yakanamirwa kune yakaoma firimu, usashandise iyo yakaipa exposure yekutamisa mufananidzo, asi pachinzvimbo chekombuta yekuraira laser beam, yakananga pane yakaoma firimu yekukurumidza scanning photosensitive imaging. Rusvingo rweparutivi rwefirimu rakaoma mushure mekufungidzira rinonyanya kudzika nekuti mwenje unoburitswa unofambirana nedanda resimba rimwe chete. Nekudaro, iyo nzira inogona kungoshanda pabhodhi rega rega, saka kukurumidza kugadzirwa kwehuwandu kunokurumidza kupfuura kushandisa firimu uye kuratidzwa kwechinyakare. LDI inokwanisa chete kuburitsa makumi matatu mabhodhi ehukuru hwepakati paawa, saka inogona kungoonekwa apo neapo muchikamu chepepa proofing kana mutengo wepamusoro weyuniti. Nekuda kwemutengo wakakwira wekuzvarwa, zvakaoma kusimudzira muindasitiri
16.Laser Maching
Muindasitiri yemagetsi, kune akawanda chaiwo magadzirirwo, akadai sekucheka, kuchera, welding, nezvimwewo, anogona zvakare kushandiswa kuita laser mwenje simba, inonzi laser processing nzira. LASER inoreva "Chiedza Chikurudziro Yakasimudzwa Emission yeRadiation" zvipfupiso, zvakashandurwa se "LASER" neindasitiri yenyika yeshanduro yemahara, zvakanyanya kusvika padanho. Laser yakagadzirwa muna 1959 neAmerican physicist th moser, akashandisa mwenje mumwe chete wechiedza kugadzira Laser mwenje parubi. Makore ekutsvakurudza akagadzira nzira itsva yekugadzirisa. Kunze kweindasitiri yemagetsi, inogona zvakare kushandiswa mune zvekurapa uye zvemauto minda
17. Micro Wire Board
Iyo yakakosha yedunhu bhodhi ine PTH interlayer yekubatanidza inowanzozivikanwa seMultiwireBoard. Kana iyo wiring density yakanyanya kwazvo (160 ~ 250in/in2), asi dhayamita yewaya idiki kwazvo (isingasviki 25mil), inozivikanwawo sediki-yakavharwa redunhu bhodhi.
18. Molded Cirxuit
Iri kushandisa matatu-dimensional mold, gadzira Injection molding kana shanduko nzira yekupedzisa maitiro estereo redunhu bhodhi, inonzi Molded circuit kana Molded system yekubatanidza wedunhu.
19 . Muliwiring Board ( Discrete Wiring Board)
Iri kushandisa waya yakaonda kwazvo ine enameled, yakananga pamusoro pepasi isina ndiro yemhangura yematatu-dimensional cross-wiring, uyezve nekubatisa yakagadzika uye kudhirowa uye plating gomba, iyo yakawanda-layer interconnect redunhu bhodhi, inozivikanwa se "multi-waya bhodhi. ”. Izvi zvinogadzirwa nePCK, kambani yekuAmerica, uye ichiri kugadzirwa neHitachi nekambani yekuJapan. Iyi MWB inogona kuchengetedza nguva mukugadzira uye inokodzera nhamba shoma yemichina ine masekete akaoma.
20. Noble Metal Paste
Iri conductive paste yegobvu firimu redunhu kudhinda. Kana yakadhindwa paceramic substrate nekudhindwa kwescreen, uye ipapo iyo organic carrier inopiswa kure nekupisa kwakanyanya, iyo yakagadziriswa inoyevedza simbi yedunhu inooneka. Iyo conductive simbi poda yakawedzerwa kune paste inofanirwa kunge iri simbi inokudzwa kudzivirira kuumbwa kwemaokisi pakupisa kwakanyanya. Vashandisi vezvigadzirwa vane goridhe, platinamu, rhodium, palladium kana mamwe masimbi anokosha.
21. Pads Chete Bhodhi
Mumazuva ekutanga e-by-hole instrumentation, mamwe mabhodhi e-high-reliability akawanda akangosiya gomba uye mhete yeweld kunze kweplate uye akavanza mitsetse yekubatanidza pazasi yemukati kuti ave nechokwadi chekutengesa kukwanisa uye kuchengetedzwa kwemutsara. Iri rudzi rwemamwe maviri akaturikidzana ebhodhi haazodhindirwe welding pendi yakasvibirira, mukutaridzika kwekutarisisa, kuongororwa kwemhando kwakasimba.
Parizvino nekuda kweiyo wiring density inowedzera, akawanda anotakurika zvigadzirwa zvemagetsi (senge nharembozha), iyo yedunhu bhodhi inotarisana ichisiya chete SMT soldering pad kana mitsetse mishoma, uye kubatanidzwa kwemitsetse yakakora kupinda mukati, iyo interlayer yakaoma zvakare. kusvika pakureba kwemugodhi kwakaputsika gomba remapofu kana gomba rebofu "chifukidziro" (Pads-On-Hole), seyakabatana kuitira kudzikisa gomba rose docking nevoltage hombe yemhangura kukuvara, iyo SMT ndiro zvakare iPads Chete Bhodhi.
22. Polymer Thick Firimu (PTF)
Ndiyo yakakosha simbi inodhinda paste inoshandiswa mukugadzira maseketi, kana kudhinda paste ichigadzira yakadhindwa kuramba firimu, paceramic substrate, ine skrini inodhindwa uye inotevera kupisa kwekushisa kwepamusoro. Kana iyo organic carrier inopiswa kure, hurongwa hwemasekete akabatanidzwa akasimba anoumbwa. Mahwendefa akadaro anowanzo kunzi mahybrid circuits.
23. Semi-Additive Process
Ndiko kunongedza pahwaro zvinhu insulation, kukura redunhu inoda kutanga zvakananga nekemikari mhangura, shandura zvakare electroplate mhangura zvinoreva kuramba gobvu rinotevera, kudana "Semi-Additive" muitiro.
Kana iyo kemikari yemhangura nzira inoshandiswa kune ese mutsara ukobvu, iyo nzira inonzi "total kuwedzera". Ziva kuti tsananguro iri pamusoro inobva ku * specification ipc-t-50e yakabudiswa muna Chikunguru 1992, iyo yakasiyana neyepakutanga ipc-t-50d (Mbudzi 1988). Yekutanga "D vhezheni", sekuzivikanwa kwainowanzoitwa muindastiri, inoreva substrate ingave isina kugadzirwa, isiri-conductive, kana nhete yemhangura foil (yakadai se1/4oz kana 1/8oz). Chimiro chekufambisa kweasina kupikisa mumiririri chakagadzirirwa uye dunhu rinodiwa rakakoshwa nekemikari yemhangura kana yemhangura plating. Iyo 50E itsva haitauri shoko rokuti "copper yakaonda". Mukaha uripo pakati pezvirevo zviviri izvi wakakura, uye pfungwa dzevaverengi dzinoita kunge dzakashanduka neThe Times.
24.Substractive Process
Ndiyo substrate pamusoro penzvimbo isingabatsiri yemhangura foil kubviswa, iyo yedunhu bhodhi nzira inozivikanwa se "nzira yekuderedza", ndiyo inonyanya kutenderera bhodhi kwemakore mazhinji. Izvi zvinopesana ne "yekuwedzera" nzira yekuwedzera copper conductor mitsetse yakananga kune substrate isina mhangura.
25. Yakakora Firimu Circuit
PTF (Polymer Thick Film Paste), iyo ine simbi dzinokosha, inodhindwa paceramic substrate (yakadai sealuminium trioxide) uye yobva yapiswa nekupisa kwakanyanya kuita kuti dhizaini iite nesimbi conductor, iyo inonzi "thick film circuit". Imhando yediki Hybrid Circuit. Iyo Silver Paste Jumper pane imwechete-sided PCBS zvakare gobvu-firimu kudhinda asi haidi kudzingwa pakupisa kwakanyanya. Mitsara yakadhindwa pamusoro pezvikamu zvakasiyana-siyana zvinonzi "mafirimu akakora" mitsetse chete kana ukobvu huri kupfuura 0.1mm [4mil], uye teknolojia yekugadzira ye "circuit system" yakadaro inonzi "thick film technology".
26. Mutete Firimu Technology
Ndiyo conductor uye yekubatanidza dunhu yakasungirirwa kune substrate, uko ukobvu huri pasi pe0.1mm [4mil], yakagadzirwa neVacuum Evaporation, Pyrolytic Coating, Cathodic Sputtering, Chemical Vapor Deposition, electroplating, anodizing, nezvimwewo, inonzi "mutete tekinoroji yemafirimu". Zvigadzirwa zvinoshanda zvine Thin Film Hybrid Circuit uye Thin Film Integrated Circuit, nezvimwe.
27. Kuendesa Laminatied Circuit
Iyo nzira nyowani yekugadzira bhodhi redunhu, uchishandisa 93mil gobvu yakagadziridzwa yakatsetseka simbi isina tsvina, tanga waita iyo yakaipa yakaoma firimu giraidhi kutamisa, uyezve inomhanya-mhanya tambo yemhangura yeplating. Mushure mekubvisa firimu rakaoma, waya isina tsvina yeplate yepamusoro inogona kudzvanywa pakupisa kwepamusoro kune iyo semi-yakaomeswa firimu. Wobva wabvisa ndiro yesimbi isina tsvina, unogona kuwana pamusoro peiyo flat reketi yakamisikidzwa redunhu bhodhi. Inogona kuteverwa nekuchera uye kunyura maburi kuti uwane interlayer yekubatanidza.
CC - 4 coppercomplexer4; Edelectro-deposited photoresist is a total additive method yakagadzirwa neAmerican PCK company pane yakakosha mhangura-isina substrate (ona chinyorwa chakakosha pamusoro pechimakumi mana nenomwe chemagazini yedunhu redunhu ruzivo).Electric light resistance IVH (Interstitial Via Hole); MLC (Multilayer Ceramic) (yemunharaunda inter laminar kuburikidza negomba); Diki ndiro PID (Mufananidzo unofungidzira Dielectric) ceramic multilayer circuit board; PTF (photosensitive media) Polymer gobvu firimu redunhu (ine gobvu firimu namira pepa rakadhindwa redunhu bhodhi) SLC (Surface Laminar Circuits ); The surface coating line ndiyo tekinoroji itsva yakabudiswa neIBM Yasu laboratory, Japan muna Chikumi 1993. Mutsara unokochekera wakawanda une Curtain Coating pendi yegirini uye electroplating copper kunze kweplate ine mativi maviri, inobvisa kudiwa kwe. kuchera nekuisa maburi pandiro.