Iyo laminated dhizaini inonyanya kutevedzera mitemo miviri:
1. Imwe neimwe wiring layer inofanira kunge iine pedo nereferensi layer (simba kana pasi pasi);
2. Iyo yakatarisana huru yesimba layer uye pasi pasi inofanira kuchengetwa padiki chinhambwe kupa yakakura coupling capacitance;
Inotevera inodonongodza stack kubva kune maviri-layer board kusvika masere-layer board semuenzaniso tsananguro:
1. Kuturikidzana kwekamwe-mativi PCB bhodhi uye kaviri-mativi PCB bhodhi
Kune maviri-layer mapuranga, nekuda kwenhamba shoma yezvikamu, hapasisina dambudziko relamination. Kudzora kweEMI radiation kunonyanya kutariswa kubva kune wiring uye marongero;
Iyo electromagnetic kuenderana kwema-single-layer mabhodhi uye maviri-layer mabhodhi ave kuwedzera uye zvakanyanya mukurumbira. Chikonzero chikuru chechiitiko ichi ndechekuti iyo chiratidzo loop nzvimbo yakakura kwazvo, iyo isingangobudisi yakasimba magetsi emagetsi, asiwo inoita kuti dunhu rinzwe kukanganiswa kwekunze. Kuvandudza iyo electromagnetic kuenderana kwedunhu, nzira iri nyore ndeyekudzikisa loop nzvimbo yekiyi chiratidzo.
Kiyi chiratidzo: Kubva pamaonero emagetsi emagetsi kuenderana, makiyi masiginecha anonyanya kureva masaini anoburitsa yakasimba mwaranzi uye masaini anonzwa kune yekunze. Masaini anogona kuburitsa mwaranzi yakasimba kazhinji zviratidzo zvenguva nenguva, senge yakaderera-yakarongeka masaini ewachi kana kero. Zviratidzo zvinonzwa kukanganiswa zviratidzo zveanalogi zvine mazinga akaderera.
Single uye kaviri-layer mabhodhi anowanzo shandiswa mune yakaderera-frequency analog dhizaini pazasi 10KHz:
1) Mateki emagetsi pachikamu chimwe chete anofambiswa neradially, uye hurefu hwese hwemitsara hunoderedzwa;
2) Paunenge uchimhanyisa magetsi uye waya dzepasi, dzinofanirwa kunge dziri pedyo kune mumwe nemumwe; isa waya yepasi padivi rekiyi yechiratidzo waya, uye iyi waya yepasi inofanira kunge iri padyo sezvinobvira kune iyo chiratidzo waya. Nenzira iyi, diki diki loop nzvimbo inoumbwa uye kunzwisiswa kweiyo differential mode radiation kune kupindira kwekunze kunoderedzwa. Kana tambo yepasi yawedzerwa pedyo netambo yechiratidzo, chiuno chine nzvimbo diki inoumbwa. Chiratidzo chazvino chichatora loop iyi pane dzimwe waya dzepasi.
3) Kana iri kaviri-layer redunhu bhodhi, unogona kuisa tambo yepasi pamwe nemutsara wechiratidzo kune rumwe rutivi rwebhodhi redunhu, pakarepo pazasi pemutsara wechiratidzo, uye mutsara wekutanga unofanirwa kuve wakafara sezvinobvira. Iyo loop nzvimbo yakaumbwa nenzira iyi yakaenzana nehupamhi hwebhodhi redunhu rinowedzerwa nehurefu hwemutsara wechiratidzo.
Maviri uye mana-laminates
1. SIG－GND(PWR)－PWR (GND)－SIG;
2. GND－SIG(PWR)－SIG(PWR)－GND;
Kune maviri ari pamusoro akagadzirwa akagadzirwa, dambudziko rinogona kuitika nderechinyakare 1.6mm (62mil) bhodhi ukobvu. Iyo dhizaini spacing ichave yakakura kwazvo, iyo isiri iyo chete isina kunaka yekudzora impedance, interlayer coupling uye kudzivirira; kunyanya kupatsanurwa kukuru pakati pemagetsi epasi ndege kunoderedza bhodhi capacitance uye haikodzeri kusefa ruzha.
Nokuda kwechirongwa chekutanga, chinowanzoshandiswa kune mamiriro ezvinhu apo kune mamwe machipisi pabhodhi. Rudzi urwu rwechirongwa runogona kuwana zvirinani kuita kweSI, haina kunyatso kunakira EMI kuita, kunyanya inofanirwa kudzora ne wiring uye zvimwe zvinhu. Kunyanya kutarisisa: Ivhu repasi rinoiswa pachikamu chekubatanidza chechiratidzo chechiratidzo chine densest chiratidzo, icho chinobatsira kutora uye kudzvinyirira mwaranzi; kuwedzera nzvimbo yebhodhi kuratidza mutemo we20H.
Kune yechipiri mhinduro, inowanzoshandiswa apo iyo chip density pabhodhi yakaderera zvakakwana uye kune nzvimbo yakakwana yakatenderedza chip (isa inodiwa simba rendarira layer). Muchirongwa ichi, chikamu chekunze chePCB ivhu repasi, uye zvidimbu zviviri zvepakati zviratidzo / simba. Simba rekupa pane chiratidzo chechiratidzo chinofambiswa nemutsara wakafara, unogona kuita kuti nzira yekuvharisa kwesimba remagetsi iderere, uye iyo impedance yechiratidzo che microstrip nzira zvakare yakadzikira, uye chiratidzo chemwaranzi yemukati yemukati inogona zvakare kuve. yakadzivirirwa nechekunze. Kubva pamaonero eEMI control, iyi ndiyo yakanakisa 4-layer PCB chimiro chiripo.
Kunyanya kutarisisa: Chinhambwe chiri pakati pezvikamu zviviri zvepakati zvechiratidzo uye masimba ekusanganisa machira anofanirwa kukwidziridzwa, uye iyo wiring nzira inofanirwa kuve yakatwasuka kudzivirira crosstalk; nzvimbo yebhodhi inofanira kudzorwa zvakakodzera kuratidza mutemo we20H; kana iwe uchida kudzora iyo wiring impedance, mhinduro iri pamusoro inofanira kunyatsochenjerera kufambisa waya Yakarongwa pasi pechitsuwa chemhangura kune simba uye pasi. Mukuwedzera, iyo mhangura pamagetsi emagetsi kana pasi pasi inofanira kubatanidzwa zvakanyanya sezvinobvira kuitira kuti DC uye yakaderera-frequency yekubatanidza.
Tatu, matanhatu-laminate laminate
Kune madhizaini ane yakakwira chip density uye yakakwirira wachi frequency, 6-layer board dhizaini inofanirwa kutariswa, uye nzira yekurongedza inokurudzirwa:
1. SIG－GND－SIG－PWR－GND－SIG;
Kune rudzi urwu rwechirongwa, rudzi urwu rwelaminated hurongwa hunogona kuwana zvirinani chiratidzo chekuvimbika, chiratidzo chechiratidzo chiri padhuze nevhu repasi, iyo yemagetsi layer uye pasi pasi zvakapetwa, iyo impedance yega yega wiring layer inogona kudzora zvirinani, uye maviri. Iyo stratum inogona kutora mitsara yemagineti zvakanaka. Uye kana iyo magetsi uye pasi pasi zvakamira, inogona kupa iri nani yekudzoka nzira kune yega yega chiratidzo chiratidzo.
2. GND－SIG－GND－PWR－SIG－GND;
Kune rudzi urwu rwechirongwa, rudzi urwu rwechirongwa runokodzera chete mamiriro ekuti density yemudziyo haina kunyanya kukwirira, rudzi urwu rwelamination rune zvose zvakanakira zvekumusoro lamination, uye ndege yepasi yepamusoro nepamusoro pezvikamu zvishoma. yakakwana, iyo inogona kushandiswa sechiri nani chekudzivirira layer Kushandisa. Izvo zvinofanirwa kucherechedzwa kuti dhizaini yesimba inofanira kunge iri pedyo neyakagadzika isiri iyo huru chikamu chepamusoro, nekuti iyo ndege yepasi ichave yakazara. Naizvozvo, kuita kweEMI kuri nani pane yekutanga mhinduro.
Summary: Kune matanhatu-layer board scheme, chinhambwe chiri pakati pesimba resimba uye pasi pasi chinofanira kuderedzwa kuti uwane simba rakanaka uye kubatanidza pasi. Nekudaro, kunyangwe ukobvu hwebhodhi huri 62mil uye nzvimbo yepakati yakaderedzwa, hazvisi nyore kudzora nzvimbo iri pakati pesimba guru rekupa uye pasi pasi diki. Kuenzanisa chirongwa chekutanga nechechipiri chechipiri, mari yechirongwa chechipiri ichawedzera zvikuru. Naizvozvo, isu tinowanzo sarudza yekutanga sarudzo kana stacking. Paunenge uchigadzira, tevera iyo 20H mutemo uye girazi layer mutemo dhizaini.
Mana uye masere-laminates
1. Iyi haisi yakanaka stacking nzira nekuda kwekushomeka kwemagetsi emagetsi uye hombe yemagetsi impedance. Chimiro chayo ndeichi:
1.Signal 1 chikamu chepamusoro, microstrip wiring layer
2. Signal 2 yemukati microstrip wiring layer, nani wiring layer (X direction)
3.Ground
4. Signal 3 stripline routing layer, zvirinani routing layer (Y direction)
5.Signal 4 stripline routing layer
6.Simba
7. Chiratidzo 5 mukati microstrip wiring layer
8.Signal 6 microstrip trace layer
2. Icho chinosiyana chechitatu stacking nzira. Nekuda kwekuwedzera kweiyo referensi layer, ine zvirinani EMI kuita, uye hunhu hunhu hweimwe chiratidzo chiratidzo hunogona kudzorwa zvakanaka.
1.Signal 1 chikamu chepamusoro, microstrip wiring layer, yakanaka wiring layer
2. Ground stratum, yakanaka electromagnetic wave absorption kugona
3. Signal 2 stripline routing layer, yakanaka routing layer
4. Simba resimba remagetsi, richigadzira kunyura kwakanakisa kwemagetsi nepasi pasi pe5. Ground layer
6.Signal 3 stripline routing layer, yakanaka routing layer
7. Power stratum, ine simba guru rekupa impedance
8.Signal 4 microstrip wiring layer, yakanaka wiring layer
3. Iyo yakanakisa stacking nzira, nekuda kwekushandiswa kweakawanda pasi rengedzo ndege, ine yakanaka kwazvo geomagnetic absorption kugona.
1.Signal 1 chikamu chepamusoro, microstrip wiring layer, yakanaka wiring layer
2. Ground stratum, yakanaka electromagnetic wave absorption kugona
3. Signal 2 stripline routing layer, yakanaka routing layer
4.Simba resimba resimba, richigadzira yakanakisa electromagnetic absorption nepasi pasi pasi 5.Ground pasi layer
6.Signal 3 stripline routing layer, yakanaka routing layer
7. Ground stratum, yakanaka electromagnetic wave absorption kugona
8.Signal 4 microstrip wiring layer, yakanaka wiring layer
Maitiro ekusarudza kuti mangani akaturikidzana emapuranga anoshandiswa mukugadzira uye maitiro ekuarongedza zvinoenderana nezvakawanda zvinhu zvakaita sehuwandu hwemasaini network pabhodhi, density yemudziyo, PIN density, frequency yechiratidzo, saizi yebhodhi uye zvichingodaro. Nekuda kwezvinhu izvi, isu tinofanirwa kufunga zvakadzama. Kune akawanda masaini network, iyo yakakwira density yemudziyo, iyo yakakwira iyo PIN density uye nekukwirira kwemasaini frequency, iyo multilayer board dhizaini inofanirwa kugamuchirwa zvakanyanya sezvinobvira. Kuti uwane kuita kwakanaka kweEMI, zvakanakisa kuve nechokwadi chekuti chiratidzo chega chega chine referensi yayo.