Chikonzero plating, zvinoratidza kuti yakaoma firimu uye mhangura foil ndiro bonding haina kusimba, saka plating mhinduro yakadzika, zvichikonzera "negative chikamu" chikamu coating thickening, vakawanda PCB vagadziri kunokonzerwa zvinotevera zvikonzero. :

1. High or low exposure energy

Pasi pe ultraviolet mwenje, iyo photoinitiator, iyo inotora simba rechiedza, inoputsika kuita mahara radicals kuti itange iyo photopolymerization yemamonomeri, ichigadzira mamorekuru emuviri asinganyungudika mukunyungudutsa alkali solution.
Pasi pekuratidzwa, nekuda kwekusakwana kwepolymerization, panguva yekuvandudza, firimu rinozvimba uye kupfava, zvichikonzera mitsetse isina kujeka uye kunyange firimu layer kubva, zvichikonzera kusanganisa kwakashata kwefirimu nemhangura;
Kana kuratidzwa kwakanyanyisa, kunokonzera matambudziko ekukura, asiwo mukugadzirisa kwe electroplating kunobudisa ganda rakaputika, kuumbwa kweplating.
Saka zvakakosha kudzora exposure energy.

2. High or low film pressure

Kana iyo firimu inodzvinyirira yakaderera, iyo firimu yepamusoro inogona kunge isina kuenzana kana gaka riri pakati pefirimu rakaoma uye ndiro yemhangura haigone kusangana nezvinodiwa zvesimba rinosunga;
Kana firimu rekumanikidza rakanyanya kukwira, zvinonyungudutsa uye zvinoshanduka zvikamu zvegora rekudzivirira zvakanyanyisa kushanduka, zvichiita kuti firimu rakaoma rive brittle, electroplating shock ichava iyo inosvuura.

3. Kupisa kwefirimu yepamusoro kana kuderera

Kana firimu tembiricha yakaderera, nokuti ngura kuramba firimu haigoni kunyatsopfaviswa uye zvakakodzera kuyerera, zvichiita kuti yakaoma firimu uye mhangura-akapfeka laminate pamusoro adhesion murombo;
Kana tembiricha yakanyanyisa kukwira nekuda kwekukurumidza evaporation yezvinonyungudutsa uye zvimwe zvinhu zvinoputika muhuturo hwekuora, uye iyo yakaoma firimu inova brittle, mune electroplating kuvhunduka kuumbwa kwe warping peel, zvichikonzera percolation.