Dual in-line package (DIP)

Dual-in-line package (DIP-dual-in-line package), fomu yepasuru yezvikamu. Mitsara miviri yemitsara inotambanuka kubva kudivi remudziyo uye iri pamakona ekurudyi kuenda kundege inofambirana nemuviri wechikamu.

Iyo chip inotora iyi yekurongedza nzira ine mitsara miviri yemapini, ayo anogona kutengeswa zvakananga pane chip socket ine DIP chimiro kana kutengeswa munzvimbo inotengeswa ine nhamba yakafanana yemaburi ekutengesa. Hunhu hwayo ndehwekuti inogona kuona zviri nyore iyo perforation welding yePCB board, uye ine kuenderana kwakanaka neiyo main board. Nekudaro, nekuti iyo pasuru nzvimbo uye ukobvu zvakakura, uye mapini ari nyore kukuvadzwa panguva yeplug-in process, kuvimbika kwakashata. Panguva imwecheteyo, iyi nzira yekurongedza kazhinji haipfuure 100 pini nekuda kwesimba rekuita.
DIP mapakeji maumbirwo mafomu ndeaya: multilayer ceramic kaviri mu-line DIP, single-layer ceramic kaviri mu-line DIP, lead furemu DIP (inosanganisira girazi ceramic sealing type, epurasitiki encapsulation chimiro mhando, ceramic yakaderera-inonyungudika girazi yekurongedza mhando) .

Single in-line package (SIP)

Single-in-line package (SIP-single-inline package), fomu yepasuru yezvikamu. Mutsara wemitsara yakatwasuka kana mapini anobuda padivi pechigadzirwa.

Iyo imwechete in-line package (SIP) inotungamira kubva kune rimwe divi repasuru uye inoaronga mumutsara wakatwasuka. Kazhinji, iwo ari kuburikidza-gomba mhando, uye mapini anopinzwa mumakomba esimbi eakadhindwa redunhu bhodhi. Kana yakaunganidzwa pabhodhi redunhu rakadhindwa, pasuru yacho inomira parutivi. Musiyano weiyi fomu ndeye zigzag type single-in-line package (ZIP), iyo mapini ayo achiri kubuda kubva kune rimwe divi repasuru, asi akarongwa mune zigzag pateni. Nenzira iyi, mukati mehurefu hwakapihwa, pini density inovandudzwa. Iyo pini yepakati kureba inowanzoita 2.54mm, uye nhamba yepini inotangira kubva 2 kusvika 23. Zvizhinji zvacho zvigadzirwa zvakagadzirirwa. Chimiro chepasuru chinosiyana. Mamwe mapasuru ane chimiro chakafanana neZIP anonzi SIP.

Pamusoro pekurongedza

Packaging inoreva kubatanidza mapini edunhu pasilicon chip kune majoini ekunze ane waya dzekubatanidza nemimwe michina. Iyo pasuru fomu inoreva iyo imba yekumisikidza semiconductor yakabatanidzwa wedunhu machipisi. Iyo haingoite basa rekukwira, kugadzirisa, kuisa chisimbiso, kuchengetedza chip uye kuwedzera electrothermal kuita, asi zvakare inobatanidza kune mapini epakeji shell newaya kuburikidza nemabatirwo ari pa chip, uye mapini aya anopfuudza waya pane zvakadhindwa. bhodhi redunhu. Batanidza nemamwe maturusi kuti uone kubatana pakati peiyo yemukati chip neyekunze redunhu. Nekuti chip chinofanirwa kuve chakasarudzika kubva kunze kwenyika kudzivirira kusvibiswa mumhepo kubva mukuora chip circuit uye kukonzeresa kushanda kwemagetsi.
Kune rimwe divi, iyo chip chip iri nyore zvakare kuisa uye kutakura. Sezvo hutano hwekugadzira michina inobatawo zvakananga kushanda kwechiputi pachayo uye kugadzirwa nekugadzirwa kwePCB (yakadhindwa bhodhi redunhu) yakabatana nayo, inokosha zvikuru.

Parizvino, kurongedza kunonyanya kukamurwa kuita DIP mbiri-mu-mutsara uye SMD chip kurongedza.