Dual In-Line Package (DIP)

Dual-in-line package (dip-dual-in-line package), fomu yepasuru yezvikamu. Mitsara miviri yeinotungamira inowedzera kubva kudivi rechishandiso uye vari pamakona ekurudyi kune ndege yakafanana nemuviri wechikamu.

Chop inotora iyi nzira yekuisa ine mitezo miviri yemapini, iyo inogona kutengeswa zvakananga pane chip socket ine dip chimiro kana kutengeswa munzvimbo yemutengesi ane nhamba yakaenzana yemakomba. Hunhu hwayo ndehwekuti hunogona kuziva nyore nyore kufungidzira kwePCB Bhodhi, uye ine hukama hwakanaka ne bhodhi guru. Nekudaro, nekuti nzvimbo yepakeji uye gobvu yakakura kwazvo, uye mapini anokuvadzwa zviri nyore panguva yePlug-muchimiro, kuvimbika kwakashata. Panguva imwecheteyo, iyi nzira yekuisa kazhinji haina kupfuura zana mapini nekuda kwekumanikidza kwekuita.
DIP Package Stakes Mafomu ndege: Multilayer Ceramic kaviri mu-Line Dip-Line Ceramic Solising Type, Ceramic Low-Melting Girazi Pairating mhando).

Single in-line package (sip)

Imwe-in-line package (Sip-single-inline package), fomu yepaketi yezvikamu. Mutsara wenguva yakatwasuka rinotungamira kana mapini anobvarura kubva kudivi rechishandiso.

Iyo imwe mu-line package (sip) inotungamira kunze kubva kune rimwe divi repakeji uye rinoruranga mumutsara wakananga. Kazhinji, ivo vari kuburikidza ne-gomba mhando, uye mapini akaiswa mumakomba esimbi eiyo dunhu redunhu redunhu. Pakaziviswa pane yakadhindwa redunhu redunhu, pasuru yacho yakamira. Kusiyana kweiyi fomu ndeye zigzag mhando imwe-mu-line package (zip), ane mapini ainenge achiratidza kubva kune rimwe divi, asi akarongwa mune zigzag pateni. Nenzira iyi, mukati mehurefu hwakapihwa, iyo PIN density inovandudzwa. Iyo PIN CENTER HERE inowanzoitika 2,54mm, uye huwandu hwemapini hunonzwika kubva ku2 kusvika makumi maviri. Vazhinji vacho zvigadzirwa zvakagadzirirwa. Chimiro chepakeji chinosiyana. Mamwe mapakeji ane chimiro chakafanana seZip anonzi sip.

NezveKuita

Packaging inoreva kubatana nedunhu redunhu pane iyo silicon chip kune iyo yekunze majoini ine waya yekubatanidza nezvimwe zvishandiso. Iyo fomu yepakeji inoreva dzimba dzekuisa semiconductor yakabatanidzwa machipisi circuit. Izvo hazviratidze basa rekukwira, kuenzanisa, kuisiridza chip uye kuwedzeredza mashandiro epalek nemari yekubatira pane chips pane iyo chip Batanidza nezvimwe zvishandiso kuti uzive kubatana pakati pechipinza yemukati uye kutenderera kwekunze. Nekuti chip ichi chinofanira kuve chakaparadzaniswa kubva kune vekunze kuti vadzivise kusvibiswa mumhepo kubva mukugadzirisa chip rip uye kuchikonzera kusvibiswa kwemagetsi.
Kune rimwe divi, iyo chipongwa chakapongwa zviri nyore zvakare kuisa uye kutakura. Sezvo hunhu hwekuputika tekinoroji yakanangana nekuita kweiyo chipenga pachayo uye dhizaini uye kugadzira yePCB (yakadhindwa wedunhu bhodhi) yakabatana nazvo, zvakakosha.

Parizvino, kurongedza kunonyanya kukamurwa kuita dip dual in-line uye smd chip kurongedza.