Zvinoenderana nechimiro chechigadzirwa, chinogona kukamurwa kuita rigid board (hard board), inochinjika bhodhi (soft board), rigid flexible joint board, HDI board uye package substrate. Zvinoenderana nehuwandu hwemutsara mutsara wekuisa, PCB inogona kukamurwa kuita imwechete pani, kaviri mapaneru uye akawanda-layer board.
Rigid ndiro
Chigadzirwa maitiro: Yakagadzirwa neyakaomarara substrate iyo isiri nyore kukotama uye ine rimwe simba. Iine kuramba kwekukotama uye inogona kupa imwe tsigiro yezvikamu zvemagetsi zvakanamirwa pairi. Iyo yakaoma substrate inosanganisira girazi fiber jira substrate, bepa substrate, composite substrate, ceramic substrate, simbi substrate, thermoplastic substrate, nezvimwe.
Zvishandiso: Kombuta nemidziyo yetiweki, midziyo yekutaurirana, kutonga kwemaindasitiri uye zvekurapa, zvemagetsi zvevatengi uye zvemagetsi zvemotokari.
Flexible plate
Chigadzirwa maitiro: Zvinoreva kudhindwa redunhu bhodhi rakagadzirwa neinochinjika insulating substrate. Inogona kuve yakakotama zvakasununguka, ronda, kupetwa, kurongeka zvisina tsarukano zvinoenderana nezvinodiwa zvemagadzirirwo enzvimbo, uye nekupokana kufambiswa uye kuwedzerwa munzvimbo ine mativi matatu. Nokudaro, gungano rechikamu uye waya yekubatanidza inogona kubatanidzwa.
Zvishandiso: mafoni akangwara, malaptop, mahwendefa uye zvimwe zvinotakurika zvemagetsi zvigadzirwa.
Rigid torsion bonding ndiro
Chigadzirwa maitiro: inoreva yakadhindwa redunhu bhodhi rine imwe kana anopfuura nzvimbo dzakaomarara uye nzvimbo dzinochinjika, iyo nhete yakadhindwa yakadhindwa redunhu bhodhi pazasi uye yakaoma yakadhindwa redunhu bhodhi pazasi yakasanganiswa lamination. Kubatsira kwayo ndekwekuti inogona kupa basa rekutsigira regid plate, asiwo ine maitiro ekukotama eplate inoshanduka, uye inogona kusangana nezvinodiwa zvematatu-dimensional musangano.
Zvishandiso: Zvishandiso zvemagetsi zvekurapa zvepamberi, makamera anotakurika uye kupeta komputa michina.
HDI bhodhi
Product features: High Density Interconnect abbreviation, kureva, high density interconnect tekinoroji, iri rakadhindwa redunhu bhodhi tekinoroji. HDI bhodhi rinowanzo gadzirwa nenzira yekuisa, uye tekinoroji yekuchera laser inoshandiswa kuchera makomba mukuisa, kuitira kuti iyo yese yakadhindwa yedunhu bhodhi inoumba interlayer yekubatanidza nemaburi akavigwa uye mapofu senzira huru yekuitisa. Kuenzaniswa neyechinyakare yakawanda-layer yakadhindwa bhodhi, HDI bhodhi inogona kuvandudza wiring density yebhodhi, iyo inobatsira pakushandiswa kwehunyanzvi hwekurongedza. Chiratidzo chekubuda kwehutano chinogona kuvandudzwa; Inogonawo kuita kuti zvigadzirwa zvemagetsi zviwedzere uye zviri nyore pakuonekwa.
Chikumbiro: Kunyanya mumunda wemagetsi evatengi ane kudiwa kwakanyanya, anoshandiswa zvakanyanya munharembozha, makomputa emabhuku, mota dzemagetsi uye zvimwe zvigadzirwa zvedhijitari, pakati pemafoni emafoni anonyanya kushandiswa. Parizvino, zvigadzirwa zvekutaurirana, zvigadzirwa zvetiweki, zvigadzirwa zveseva, zvigadzirwa zvemotokari uye kunyange zvigadzirwa zvemuchadenga zvinoshandiswa muHDI tekinoroji.
Package substrate
Zvigadzirwa zvechigadzirwa: ndiko kuti, IC seal loading plate, iyo inoshandiswa zvakananga kutakura chip, inogona kupa magetsi ekubatanidza, kudzivirira, kutsigirwa, kupisa kupisa, kusangana uye mamwe mabasa e chip, kuitira kuti uwane mapini akawanda, kuderedza saizi yechigadzirwa chepakeji, kunatsiridza mashandiro emagetsi uye kupisa kupisa, ultra-high density kana chinangwa chemulti-chip modularization.
Munda wekushandisa: Mumunda wezvigadzirwa zvekutaurirana mbozha senge nharembozha uye mahwendefa emakomputa, kurongedza substrates kwakashandiswa zvakanyanya. Zvakadai semamemory machipisi ekuchengetedza, MEMS yekunzwa, RF mamodule ekuzivikanwa kweRF, processor machipisi uye zvimwe zvishandiso zvinofanirwa kushandisa ekurongedza substrates. Iyo yepamusoro yekumhanyisa yekutaurirana pasuru substrate yakashandiswa zvakanyanya mu data Broadband uye mamwe minda.
Rudzi rwechipiri runorongwa maererano nehuwandu hwemitsara yemitsara. Zvinoenderana nehuwandu hwemutsara mutsara wekuisa, PCB inogona kukamurwa kuita imwechete pani, kaviri mapaneru uye akawanda-layer board.
Single panel
Single-Sided Boards (Site-sided Boards) PaPCB inonyanya kukosha, zvikamu zvakanangidzirwa kune rimwe divi, waya yakanamirwa kune rimwe divi (kune chigamba chikamu uye waya idivi rimwe chete, uye plug- mumudziyo ndiro rimwe divi). Nekuti waya inongoonekwa kune rimwe divi, iyi PCB inonzi Single-sided. Nemhaka yokuti imwe pani ine zvipingamupinyi zvakawanda zvakasimba pamutambo wekugadzira (nokuti kune rutivi rumwe chete, wiring haigoni kuyambuka uye inofanira kutenderera nenzira yakasiyana), matunhu ekutanga chete akashandisa mapuranga akadaro.
Dual panel
Mabhodhi maviri-Sidedhi ane wiring kumativi ose, asi kushandisa waya kumativi ose, panofanira kuva nekubatana kwakakodzera kwedunhu pakati pemativi maviri. Iri "bhiriji" pakati pemaseketi rinonzi pilot hole (via). Gomba rendege igomba diki rakazadzwa kana kuvharwa nesimbi paPCB, rinogona kubatanidzwa newaya mativi ese. Nekuti nzvimbo yepanera mbiri yakakura zvakapetwa kaviri kupfuura yepaneti imwe chete, iyo kaviri pani inogadzirisa kuoma kweiyo wiring inopindirana mune imwechete panel (inogona kuchinjirwa nemugomba kune rimwe divi), uye inowedzera. akakodzera kushandiswa mumasekete akaoma kupfuura mamwe mapaneru.
Multi-Layer Boards Kuti uwedzere nzvimbo iyo inogona kuve newaya, akawanda-layer mapuranga anoshandisa akawanda ega kana maviri mativi wiring board.
Bhodhi redunhu rakadhindwa rine mativi maviri emukati remukati, maviri ega-sided ekunze layer kana maviri-aviri mativi emukati layer, maviri ega-sided ekunze layer, kuburikidza nenzvimbo yekumisikidza uye insulating binder zvinhu zvakasiyana pamwe chete uye iyo conductive giraidhi yakabatana zvinoenderana. kune magadzirirwo zvinodiwa akadhindwa redunhu bhodhi inova mana-mutsetse, nhanhatu akadhindwa redunhu bhodhi, inozivikanwawo se-multi-layer akadhindwa redunhu bhodhi.
Huwandu hwezvikamu zvebhodhi hazvireve kuti kune akati wandei akazvimirira wiring akaturikidzana, uye muzviitiko zvakakosha, zvidimbu zvisina chinhu zvichawedzerwa kudzora ukobvu hwebhodhi, kazhinji huwandu hwematanho hwakaenzana, uye ine ekunze maviri akaturikidzana. . Yakawanda yebhodhi yevatambi ndeye 4 kusvika 8 layer chimiro, asi nehunyanzvi zvinokwanisika kuwana angangoita zana maseru ePCB board. Mazhinji makuru makuru emakomputa anoshandisa yakaringana multilayer mainframe, asi sezvo makomputa akadaro achigona kutsiviwa nemasumbu emakomputa mazhinji akajairwa, mabhodhi e-ultra-multilayer akatadza kushandiswa. Nekuda kwekuti matinji ari muPCB akanyatsobatanidzwa, kazhinji hazvisi nyore kuona iyo nhamba chaiyo, asi kana iwe ukatarisisa bhodhi rekutambira, rinogona kuramba richionekwa.