Nheyo: Imwe firimu yehupenyu inoumbwa pamusoro pemhangura yedare redunhu, iyo inodzivirira zvakasimba pamusoro pemhangura itsva, uye inogonawo kudzivirira oxidation uye kusvibiswa pakupisa kwakanyanya. OSP firimu ukobvu inowanzodzorwa pa 0.2-0.5 microns.

1. Kuyerera kwemaitiro: degreasing → kugeza mvura → micro-rosion → kugeza mvura → kugeza acid → kugeza mvura yakachena → OSP → kugeza mvura yakachena → kuomesa.

2. Mhando dzeOSP zvinhu: Rosin, Active Resin uye Azole. Zvishandiso zveOSP zvinoshandiswa neShenzhen United Circuits parizvino zvinoshandiswa zvakanyanya azole OSPs.

Chii chinonzi OSP pamusoro pekurapa maitiro ePCB board?

3. Features: yakanaka flatness, hapana IMC inoumbwa pakati OSP firimu uye mhangura redunhu bhodhi pad, achibvumira zvakananga soldering solder uye redunhu bhodhi mhangura panguva soldering (zvakanaka wettability), yakaderera tembiricha processing tekinoroji, yakaderera mutengo (yakaderera mutengo. ) Kune HASL), simba shoma rinoshandiswa panguva yekugadzirisa, etc. Inogona kushandiswa pamativi ose e-low-tech circuit board uye high-density chip packaging substrates. PCB Proofing Yoko board inokurudzira kukanganisa: ① kutarisisa kutaridzika kwakaoma, haina kukodzera kuwanda reflow soldering (kazhinji inoda katatu); ② OSP firimu pamusoro iri nyore kukwenya; ③ kuchengetedza nharaunda zvinodiwa zvakakwirira; ④ nguva yekuchengetedza ipfupi.

4. Nzira yekuchengetedza uye nguva: Mwedzi ye6 muvhavha yekuputira (kupisa 15-35 ℃, humidity RH≤60%).

5. SMT saiti zvinodiwa: ① Iyo OSP yedunhu bhodhi inofanirwa kuchengetedzwa pane yakaderera tembiricha uye yakaderera hunyoro (tembiricha 15-35 ° C, humidity RH ≤60%) uye kudzivirira kuratidzwa kune nharaunda izere neasidhi gasi, uye kusangana kunotanga mukati me48. maawa mushure mekuburitsa OSP package; ② Inokurudzirwa kuishandisa mukati meawa makumi mana nemasere mushure mekunge chidimbu chedivi rimwe chapera, uye zvinokurudzirwa kuti uichengetedze mune yakaderera-tembiricha kabhineti pane vacuum packaging;