Hunhu hunokosha hwebhodhi redunhu rakadhindwa zvinoenderana nekuita kwe substrate board.Kuti uvandudze hunyanzvi hwekuita kwebhodhi redunhu rakadhindwa, kushanda kweiyo yakadhindwa yedunhu substrate board inofanira kuvandudzwa kutanga.Kuti zvizadzise zvinodikanwa zvekuvandudzwa kwebhodhi redunhu rakadhindwa, zvinhu zvitsva zvakasiyana-siyana Iri kuvandudzwa zvishoma nezvishoma uye kushandiswa.

Mumakore achangopfuura, musika wePCB wakachinja kutarisa kubva kumakomputa kuenda kunhaurirano, kusanganisira zviteshi zvepasi, maseva, uye nharembozha.Midziyo yekufambisa nhare inomiririrwa nemafoni akaendesa maPCB kune yakakwira density, kutetepa, uye kushanda kwepamusoro.Yakadhindwa yedunhu tekinoroji haiparadzaniswe kubva kune substrate zvinhu, izvo zvinosanganisirawo tekinoroji zvinodiwa zvePCB substrates.Izvo zvinoenderana zvemukati meiyo substrate zvinhu zvave kurongwa kuita yakakosha chinyorwa chekutarisa indasitiri.

1 Iko kudiwa kwepamusoro-density uye yakanaka-mutsara

1.1 Kudiwa kwefoiri yemhangura

MaPCB ese ari kusimukira akananga kune yakakwira-density uye yakatetepa-mutsara kusimudzira, uye HDI mabhodhi akanyanya kusimba.Makore gumi apfuura, IPC yakatsanangura bhodhi reHDI sehupamhi hwemutsara/mutsara wemutsara (L/S) we0.1mm/0.1mm zvichidzika.Ikozvino indasitiri inowana yakajairwa L/S ye60μm, uye yepamusoro L/S ye40μm.YeJapan 2013 vhezheni yekuisa tekinoroji yemugwagwa data ndeyekuti muna 2014, yakajairika L/S yeHDI board yaive 50μm, iyo yepamusoro L/S yaive 35μm, uye muyedzo-yakagadzirwa L/S yaive 20μm.

PCB redunhu pateni kuumbwa, iyo yechinyakare makemikari etching process ( subtractive method) mushure mefotoimaging pane yemhangura foil substrate, diki muganho we subtractive nzira yekugadzira mitsetse yakanaka inenge 30μm, uye nhete yemhangura foil (9 ~ 12μm) substrate inodiwa.Nekuda kwemutengo wepamusoro wehutete hwemhangura foil CCL uye hurema hwakawanda mukutetepa kwemhangura foil lamination, mafekitori mazhinji anogadzira 18μm yemhangura foil uye obva ashandisa etching kutetepa mhangura layer panguva yekugadzira.Iyi nzira ine maitiro akawanda, yakaoma kudzora ukobvu, uye kudhura kwakanyanya.Zviri nani kushandisa yakaonda mhangura foil.Mukuwedzera, kana PCB yedunhu L/S iri pasi pe20μm, iyo yakaonda yemhangura foil inowanzonetsa kubata.Inoda iyo yekupedzisira-yakaonda yemhangura foil (3 ~ 5μm) substrate uye yekupedzisira-yakaonda yemhangura foil yakasungirirwa kune inotakura.

Mukuwedzera kune mapepi akaonda emhangura, mitsetse yemazuva ano yakanaka inoda kuderera kwepamusoro pamusoro pefoiri yemhangura.Kazhinji, kuti uvandudze simba rekubatanidza pakati pefoiri yemhangura uye substrate uye kuve nechokwadi chekuti conductor peeling simba, iyo copper foil layer inoomeswa.Kushata kwefoiri yemhangura yakajairwa yakakura kupfuura 5μm.Kumisikidzwa kwemhangura yemhangura yemhangura yemhangura mukati meiyo substrate inovandudza kupenengura kuramba, asi kuitira kudzora iko kurongeka kwewaya panguva yekumisikidza mutsara, zviri nyore kuita kuti embedding substrate peaks asara, zvichikonzera mapfupi maseketi pakati pemitsetse kana kuderera kwekudzivirira. , iyo inonyanya kukosha kune mitsetse yakanaka.Mutsara wacho wakanyanya kuoma.Nokudaro, mapepa emhangura ane hutsika hushoma (pasi pe3 μm) uye kunyange kuderera kwakadzika (1.5 μm) kunodiwa.

1.2 Iko kudiwa kwema laminate dielectric sheets

Iyo tekinoroji yeHDI board ndeyekuti iyo buildup process (BuildingUpProcess), iyo inowanzoshandiswa resin-yakavharwa nemhangura foil (RCC), kana laminated layer yesemi-cured epoxy glass cloth uye copper foil inonetsa kuwana mitsetse yakanaka.Parizvino, iyo semi-yekuwedzera nzira (SAP) kana yakagadziridzwa semi-yakagadziriswa nzira (MSAP) inotarisirwa kugamuchirwa, kureva kuti, insulating dielectric firimu rinoshandiswa kurongedza, uyezve electroless copper plating inoshandiswa kugadzira mhangura. conductor layer.Nekuda kwekuti mhangura yemhangura yakanyanya kutetepa, zviri nyore kugadzira mitsetse yakanaka.

Imwe yemapoinzi akakosha eiyo semi-yekuwedzera nzira ndeye laminated dielectric zvinhu.Kuti zvizadzise zvinodikanwa zve-high-density fine lines, iyo laminated material inoisa mberi zvinodiwa zve dielectric magetsi ehupfumi, insulation, kupisa kupisa, bonding simba, nezvimwewo, pamwe chete nekugadzirisa kwekugadzirisa kweHDI board.Parizvino, iyo yepasi rose HDI laminated media media inonyanya kuve ABF/GX yakatevedzana zvigadzirwa zveJapan Ajinomoto Company, inoshandisa epoxy resin ine akasiyana kurapa maajenti kuwedzera inorganic poda kuvandudza kuoma kwechinhu uye kuderedza CTE, uye girazi fiber jira. inoshandiswawo kuwedzera kuomarara..Kune zvakare akafanana akaonda-firimu laminate zvinhu zveSekisui Chemical Company yeJapan, uye Taiwan Industrial Technology Research Institute yakagadzirawo zvinhu zvakadaro.Zvishandiso zveABF zvinoramba zvichivandudzwa nekuvandudzwa.Chizvarwa chitsva chemidziyo yelaminated inonyanya kuda kuderera kwepasi roughness, kuderera kwekuwedzera kwemafuta, kuderera kwe dielectric kurasikirwa, uye kutetepa kusimba kusimba.

Mupasi rose semiconductor packaging, IC yekurongedza substrates yakatsiva ceramic substrates neorganic substrates.Iyo pitch yeflip chip (FC) yekurongedza ma substrates iri kuita diki uye diki.Ikozvino yakajairika mutsara upamhi / mutsara wemutsara i15μm, uye ichave yakatetepa mune ramangwana.Kuita kweakawanda-layer carrier kunonyanya kuda yakaderera dielectric zvivakwa, yakaderera thermal yekuwedzera coefficient uye yakakwirira kupisa kupisa, uye kutsvaga yakaderera-mutengo substrates pahwaro hwekusangana kwekuita zvinangwa.Parizvino, kugadzirwa kwakawanda kwemaseketi akanaka kunotora nzira yeMSPA yelaminated insulation uye foil yakaonda yemhangura.Shandisa nzira yeSAP kugadzira mapatani edunhu neL/S isingasviki 10μm.

Kana maPCB awedzera kuomarara uye kutetepa, tekinoroji yeHDI board yakashanduka kubva pamusimboti-ine laminates kuenda kune coreless Anylayer interconnection laminates (Anylayer).Chero-layer interconnection laminate HDI mabhodhi ane basa rimwechete ari nani pane core-ine laminate HDI mabhodhi.Nzvimbo uye ukobvu hunogona kuderedzwa ne25%.Idzi dzinofanirwa kushandisa dzakatetepa uye kuchengetedza yakanaka magetsi zvimiro zvedielectric layer.

2 Yakakwira frequency uye yakanyanya kumhanya kudiwa

Tekinoroji yekukurukurirana tekinoroji inotangira kubva kune waya kuenda kune isina waya, kubva yakaderera frequency uye yakaderera yekumhanya kusvika yakakwirira frequency uye yakanyanya kumhanya.Ikozvino kuita kwenharembozha kwapinda mu4G uye kuchaenda ku5G, ndiko kuti, kukurumidza kutapurirana kukurumidza uye hukuru hwekutapurirana.Kuuya kwepasi rose cloud computing era kwakawedzera kaviri data traffic, uye high-frequency uye high-speed kutaurirana michina inzira isingadzivisiki.PCB yakakodzera kune yakakwira-frequency uye yakakwirira-kumhanya kutapurirana.Mukuwedzera pakuderedza kupindira kwechiratidzo uye kurasikirwa mukugadzirwa kwedunhu, kuchengetedza kutendeseka kwechiratidzo, nekuchengetedza PCB yekugadzira kuti isangane nezvinodiwa zvekugadzira, zvakakosha kuva nepamusoro-soro substrate.

Kuti ugadzirise dambudziko rePCB kuwedzera kukurumidza uye kutendeseka kwechiratidzo, mainjiniya ekugadzira anonyanya kutarisisa pane yemagetsi chiratidzo chekurasikirwa zvivakwa.Zvinhu zvakakosha zvekusarudzwa kwe substrate ndeye dielectric constant (Dk) uye dielectric kurasikirwa (Df).Apo Dk yakaderera pane 4 uye Df0.010, inenge iripakati Dk/Df laminate, uye apo Dk yakaderera pane 3.7 uye Df0.005 yakaderera, yakaderera Dk/Df grade laminates, ikozvino kune zvakasiyana-siyana zve substrates. kupinda mumusika kusarudza kubva.

Parizvino, anonyanya kushandiswa epamusoro-frequency circuit board substrates anonyanya kunzi fluorine-based resins, polyphenylene ether (PPO kana PPE) resins uye modified epoxy resins.Fluorine-based dielectric substrates, senge polytetrafluoroethylene (PTFE), ine yakaderera dielectric zvivakwa uye inowanzo shandiswa pamusoro pe5 GHz.Kune zvakare yakagadziridzwa epoxy FR-4 kana PPO substrates.

Mukuwedzera kune resin yakataurwa pamusoro apa uye zvimwe zvinhu zvinodzivirira, hutsinye hwepamusoro (profile) yemhangura yemhangura chinhu chinokosha chinokanganisa kurasikirwa kwechiratidzo, iyo inokonzerwa neganda (SkinEffect).Iyo ganda mhedzisiro ndeye electromagnetic induction inogadzirwa muwaya panguva yepamusoro-frequency chiratidzo chekufambisa, uye inductance yakakura pakati pechikamu chewaya, kuitira kuti yazvino kana chiratidzo chitarise kutarisisa pamusoro pewaya.Iyo yepamusoro roughness ye conductor inokanganisa kurasikirwa kwechiratidzo chekutumira, uye kurasikirwa kwepamusoro pepamusoro kuduku.

Panguva imwecheteyo, iyo yakakura roughness yemhangura yepamusoro, iyo yakakura kurasikirwa kwechiratidzo.Nokudaro, mukugadzirwa kwechokwadi, tinoedza kudzora kushata kwehupamhi hwemhangura yepamusoro sezvinobvira.Iyo roughness idiki sezvinobvira pasina kukanganisa simba rekubatanidza.Kunyanya kumasaini ari pamusoro pe10 GHz.Pa10GHz, iyo yemhangura foil roughness inoda kuve isingasviki 1μm, uye zviri nani kushandisa super-planar copper foil (kushata kwepamusoro 0.04μm).Iko kushata kwepamusoro kwefoiri yemhangura inodawo kusanganiswa neyakakodzera oxidation kurapwa uye bonding resin system.Munguva pfupi iri kutevera, pachava neresin-yakavharidzirwa yemhangura foil ine inenge isina rondedzero, iyo inogona kuva nepamusoro peganda simba uye haizokanganise kurasikirwa kwedielectric.